JPS53124077A - Chucking for wafer - Google Patents

Chucking for wafer

Info

Publication number
JPS53124077A
JPS53124077A JP14969976A JP14969976A JPS53124077A JP S53124077 A JPS53124077 A JP S53124077A JP 14969976 A JP14969976 A JP 14969976A JP 14969976 A JP14969976 A JP 14969976A JP S53124077 A JPS53124077 A JP S53124077A
Authority
JP
Japan
Prior art keywords
chucking
wafer
substrate
jeted
chuck
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14969976A
Other languages
Japanese (ja)
Inventor
Tamotsu Sasaki
Shinpei Suzuki
Masuo Takahashi
Satoru Iwama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Hitachi High Tech Corp
Original Assignee
Hitachi Ltd
Hitachi Electronics Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Electronics Engineering Co Ltd filed Critical Hitachi Ltd
Priority to JP14969976A priority Critical patent/JPS53124077A/en
Publication of JPS53124077A publication Critical patent/JPS53124077A/en
Pending legal-status Critical Current

Links

Landscapes

  • Gripping Jigs, Holding Jigs, And Positioning Jigs (AREA)
  • Weting (AREA)

Abstract

PURPOSE:The main body featuring a U-shaped cross-section is produced, and the substrate is put on the bottom surface in the internal space. Then the air is jeted from the upper surface opposing to the bottom surface in order to chuck the substrate.
JP14969976A 1976-12-15 1976-12-15 Chucking for wafer Pending JPS53124077A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14969976A JPS53124077A (en) 1976-12-15 1976-12-15 Chucking for wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14969976A JPS53124077A (en) 1976-12-15 1976-12-15 Chucking for wafer

Publications (1)

Publication Number Publication Date
JPS53124077A true JPS53124077A (en) 1978-10-30

Family

ID=15480874

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14969976A Pending JPS53124077A (en) 1976-12-15 1976-12-15 Chucking for wafer

Country Status (1)

Country Link
JP (1) JPS53124077A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5342067A (en) * 1993-08-09 1994-08-30 Corning Incorporated Method and apparatus for machining substrate plates for magnetic memory disks
US6217034B1 (en) * 1998-09-24 2001-04-17 Kla-Tencor Corporation Edge handling wafer chuck

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5342067A (en) * 1993-08-09 1994-08-30 Corning Incorporated Method and apparatus for machining substrate plates for magnetic memory disks
US6217034B1 (en) * 1998-09-24 2001-04-17 Kla-Tencor Corporation Edge handling wafer chuck
US6702302B2 (en) * 1998-09-24 2004-03-09 Kla-Tencor Corporation Edge handling wafer chuck

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