JPS5295164A - Dividing and cleansing for semi-conductor pellet - Google Patents
Dividing and cleansing for semi-conductor pelletInfo
- Publication number
- JPS5295164A JPS5295164A JP1145276A JP1145276A JPS5295164A JP S5295164 A JPS5295164 A JP S5295164A JP 1145276 A JP1145276 A JP 1145276A JP 1145276 A JP1145276 A JP 1145276A JP S5295164 A JPS5295164 A JP S5295164A
- Authority
- JP
- Japan
- Prior art keywords
- dividing
- cleansing
- semi
- conductor pellet
- pellet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Dicing (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
PURPOSE: To facilitate secure and automated cleansing by dividing wafers adhered on a sustaining base through the intermediary of a wax layer into pellets, heating them to exfoliate, and sustaining them in orderly fashion.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1145276A JPS5295164A (en) | 1976-02-06 | 1976-02-06 | Dividing and cleansing for semi-conductor pellet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1145276A JPS5295164A (en) | 1976-02-06 | 1976-02-06 | Dividing and cleansing for semi-conductor pellet |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5295164A true JPS5295164A (en) | 1977-08-10 |
Family
ID=11778480
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1145276A Pending JPS5295164A (en) | 1976-02-06 | 1976-02-06 | Dividing and cleansing for semi-conductor pellet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5295164A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH029186A (en) * | 1988-06-28 | 1990-01-12 | Tanaka Kikinzoku Kogyo Kk | Manufacture of square type block |
US5494549A (en) * | 1992-01-08 | 1996-02-27 | Rohm Co., Ltd. | Dicing method |
-
1976
- 1976-02-06 JP JP1145276A patent/JPS5295164A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH029186A (en) * | 1988-06-28 | 1990-01-12 | Tanaka Kikinzoku Kogyo Kk | Manufacture of square type block |
US5494549A (en) * | 1992-01-08 | 1996-02-27 | Rohm Co., Ltd. | Dicing method |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5295164A (en) | Dividing and cleansing for semi-conductor pellet | |
JPS5284969A (en) | Electrode connection method and lead tape used for the same | |
JPS5228879A (en) | Semiconductor device and method for its production | |
JPS5339067A (en) | Production of semiconductor device | |
JPS51126077A (en) | Manufacturing method of semi-conductor equpment | |
JPS51113458A (en) | Wafer stretching device | |
JPS5235797A (en) | Manufacturing method for boehmite | |
JPS5227278A (en) | Semicondcutor unit | |
JPS528787A (en) | Semiconductor device process | |
JPS5273673A (en) | Production of semiconductor device | |
JPS52125273A (en) | Semiconductor device | |
JPS51123558A (en) | Manufacturing method of plate semiconductor | |
JPS5428566A (en) | Manufacture of semiconductor device | |
JPS51132762A (en) | Heat-treatment method of semiconductor device | |
JPS5339870A (en) | Semiconductor device | |
JPS5360574A (en) | Stem | |
JPS52151561A (en) | Polishing method of semiconductor wafers | |
JPS5418670A (en) | Manufacture of semiconductor device | |
JPS5342575A (en) | Semiconductor device | |
JPS5219984A (en) | Manufacture process for a isolation layer used to make a semiconductor element | |
JPS5261956A (en) | Production of semiconductor device | |
JPS5228271A (en) | Collet for pellet bonding | |
JPS5424575A (en) | Handling method of wafer | |
JPS5215270A (en) | Method of transporting semiconductor pellets | |
JPS526081A (en) | Semiconductor wafer |