JPS5676543A - Semiconductor element - Google Patents
Semiconductor elementInfo
- Publication number
- JPS5676543A JPS5676543A JP15294879A JP15294879A JPS5676543A JP S5676543 A JPS5676543 A JP S5676543A JP 15294879 A JP15294879 A JP 15294879A JP 15294879 A JP15294879 A JP 15294879A JP S5676543 A JPS5676543 A JP S5676543A
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- silver paste
- recess
- prevent
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title abstract 4
- 239000008188 pellet Substances 0.000 abstract 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 6
- 229910052709 silver Inorganic materials 0.000 abstract 6
- 239000004332 silver Substances 0.000 abstract 6
- 238000004299 exfoliation Methods 0.000 abstract 2
- 230000002093 peripheral effect Effects 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 230000000994 depressogenic effect Effects 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
- H01L2224/26122—Auxiliary members for layer connectors, e.g. spacers being formed on the semiconductor or solid-state body to be connected
- H01L2224/26145—Flow barriers
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
- H01L2224/27011—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature
- H01L2224/27013—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature for holding or confining the layer connector, e.g. solder flow barrier
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- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29299—Base material
- H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/29338—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H01L2224/732—Location after the connecting process
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- H01L2224/83009—Pre-treatment of the layer connector or the bonding area
- H01L2224/83051—Forming additional members, e.g. dam structures
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- H01L2224/8319—Arrangement of the layer connectors prior to mounting
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- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
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- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
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- H01L2924/181—Encapsulation
Abstract
PURPOSE:To obtain a structure which hardly causes improper shortcircuit or exfoliation of pellet in a semiconductor element by forming a recess to which silver paste can be introduced on the peripheral edge of a semiconductor pellet formed with a circuit. CONSTITUTION:A recess 13 is formed on the peripheral edge of the side to be adhered with a semiconductor pellet 7. Then, silver paste 11 is coated on a substrate 10, and the pellet 7 is brought into contact with the silver paste 11 using a collet 12. When the collet 12 is thereafter depressed and the lower adhering side of the pellet 7 is intruded into the silver paste 8, the silver paste 12 raised on the periphery of the pellet 7 is intruded into the recess 13. Since this prevent the introduction of the silver paste to the upper edge of the pellet, it can prevent the shortcircuit of the electrodes, and can also prevent the exfoliation of the pellet from the substrate by coating sufficient amount of the paste thereon.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15294879A JPS5676543A (en) | 1979-11-28 | 1979-11-28 | Semiconductor element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15294879A JPS5676543A (en) | 1979-11-28 | 1979-11-28 | Semiconductor element |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5676543A true JPS5676543A (en) | 1981-06-24 |
Family
ID=15551652
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15294879A Pending JPS5676543A (en) | 1979-11-28 | 1979-11-28 | Semiconductor element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5676543A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60187070A (en) * | 1984-03-06 | 1985-09-24 | Toshiba Corp | Semiconductor light emitting device |
US4942140A (en) * | 1987-03-25 | 1990-07-17 | Mitsubishi Denki Kabushiki Kaisha | Method of packaging semiconductor device |
-
1979
- 1979-11-28 JP JP15294879A patent/JPS5676543A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60187070A (en) * | 1984-03-06 | 1985-09-24 | Toshiba Corp | Semiconductor light emitting device |
US4942140A (en) * | 1987-03-25 | 1990-07-17 | Mitsubishi Denki Kabushiki Kaisha | Method of packaging semiconductor device |
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