JPS5335194A - Conductive bonding agent - Google Patents

Conductive bonding agent

Info

Publication number
JPS5335194A
JPS5335194A JP11006276A JP11006276A JPS5335194A JP S5335194 A JPS5335194 A JP S5335194A JP 11006276 A JP11006276 A JP 11006276A JP 11006276 A JP11006276 A JP 11006276A JP S5335194 A JPS5335194 A JP S5335194A
Authority
JP
Japan
Prior art keywords
bonding agent
conductive bonding
electrodes
substrate
enable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11006276A
Other languages
Japanese (ja)
Inventor
Hidekazu Komatsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Original Assignee
Tokyo Sanyo Electric Co Ltd
Tottori Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Sanyo Electric Co Ltd, Tottori Sanyo Electric Co Ltd, Sanyo Electric Co Ltd filed Critical Tokyo Sanyo Electric Co Ltd
Priority to JP11006276A priority Critical patent/JPS5335194A/en
Publication of JPS5335194A publication Critical patent/JPS5335194A/en
Pending legal-status Critical Current

Links

Landscapes

  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE: To enable the connection between electrodes which are small in contact resistance by containing a great amount of fine metallic granule in bonding materials and coating it on the place required for either of one substrate electrode and other substrate electrodes or semiconductor chip electrodes.
COPYRIGHT: (C)1978,JPO&Japio
JP11006276A 1976-09-13 1976-09-13 Conductive bonding agent Pending JPS5335194A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11006276A JPS5335194A (en) 1976-09-13 1976-09-13 Conductive bonding agent

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11006276A JPS5335194A (en) 1976-09-13 1976-09-13 Conductive bonding agent

Publications (1)

Publication Number Publication Date
JPS5335194A true JPS5335194A (en) 1978-04-01

Family

ID=14526097

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11006276A Pending JPS5335194A (en) 1976-09-13 1976-09-13 Conductive bonding agent

Country Status (1)

Country Link
JP (1) JPS5335194A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57208002A (en) * 1981-06-18 1982-12-21 Shinetsu Polymer Co Thermal pressure conductive composition

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57208002A (en) * 1981-06-18 1982-12-21 Shinetsu Polymer Co Thermal pressure conductive composition

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