JPS57208002A - Thermal pressure conductive composition - Google Patents

Thermal pressure conductive composition

Info

Publication number
JPS57208002A
JPS57208002A JP9418281A JP9418281A JPS57208002A JP S57208002 A JPS57208002 A JP S57208002A JP 9418281 A JP9418281 A JP 9418281A JP 9418281 A JP9418281 A JP 9418281A JP S57208002 A JPS57208002 A JP S57208002A
Authority
JP
Japan
Prior art keywords
conductive composition
thermal pressure
pressure conductive
thermal
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9418281A
Other languages
Japanese (ja)
Inventor
Riyouichi Sado
Toshiyuki Kawaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Polymer Co Ltd, Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Polymer Co Ltd
Priority to JP9418281A priority Critical patent/JPS57208002A/en
Publication of JPS57208002A publication Critical patent/JPS57208002A/en
Pending legal-status Critical Current

Links

Landscapes

  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP9418281A 1981-06-18 1981-06-18 Thermal pressure conductive composition Pending JPS57208002A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9418281A JPS57208002A (en) 1981-06-18 1981-06-18 Thermal pressure conductive composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9418281A JPS57208002A (en) 1981-06-18 1981-06-18 Thermal pressure conductive composition

Publications (1)

Publication Number Publication Date
JPS57208002A true JPS57208002A (en) 1982-12-21

Family

ID=14103174

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9418281A Pending JPS57208002A (en) 1981-06-18 1981-06-18 Thermal pressure conductive composition

Country Status (1)

Country Link
JP (1) JPS57208002A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60133054A (en) * 1983-12-05 1985-07-16 Nippon Kokuen Kogyo Kk Composition for conductively anisotropic heat sealing, its manufacture and its usage
JPS60177576A (en) * 1984-02-23 1985-09-11 シャープ株式会社 Method of connecting liquid crystal display element
JPS6164085A (en) * 1984-09-04 1986-04-02 ダイソー株式会社 Electric member
JPS61168573U (en) * 1985-04-09 1986-10-18
JPS61168574U (en) * 1985-04-09 1986-10-18
JPS62109857A (en) * 1985-11-06 1987-05-21 Hiroshi Hirabayashi Molding composition
JPS63237374A (en) * 1987-03-26 1988-10-03 キヤノン株式会社 Electric circuit member
JPH01297462A (en) * 1988-05-25 1989-11-30 Tech Res & Dev Inst Of Japan Def Agency Coloring composition for camouflaging and camouflaged colored material
US5376403A (en) * 1990-02-09 1994-12-27 Capote; Miguel A. Electrically conductive compositions and methods for the preparation and use thereof
US5853622A (en) * 1990-02-09 1998-12-29 Ormet Corporation Transient liquid phase sintering conductive adhesives
WO2016080053A1 (en) * 2014-11-17 2016-05-26 カルソニックカンセイ株式会社 Electronic substrate and heat-dissipating structure

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS494057A (en) * 1972-05-09 1974-01-14
JPS50111598A (en) * 1974-02-15 1975-09-02
JPS51109936A (en) * 1975-03-25 1976-09-29 Suwa Seikosha Kk Dodenihoseiomotsu setsuchakuzai
JPS51115540A (en) * 1975-03-04 1976-10-12 Seiko Epson Corp Bonding method
JPS5335194A (en) * 1976-09-13 1978-04-01 Sanyo Electric Co Ltd Conductive bonding agent
JPS53133799A (en) * 1977-04-27 1978-11-21 Idearisaachi Yuugen Electroconductive paint

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS494057A (en) * 1972-05-09 1974-01-14
JPS50111598A (en) * 1974-02-15 1975-09-02
JPS51115540A (en) * 1975-03-04 1976-10-12 Seiko Epson Corp Bonding method
JPS51109936A (en) * 1975-03-25 1976-09-29 Suwa Seikosha Kk Dodenihoseiomotsu setsuchakuzai
JPS5335194A (en) * 1976-09-13 1978-04-01 Sanyo Electric Co Ltd Conductive bonding agent
JPS53133799A (en) * 1977-04-27 1978-11-21 Idearisaachi Yuugen Electroconductive paint

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS619342B2 (en) * 1983-12-05 1986-03-22 Nippon Kokuen Kogyo Kk
JPS60133054A (en) * 1983-12-05 1985-07-16 Nippon Kokuen Kogyo Kk Composition for conductively anisotropic heat sealing, its manufacture and its usage
JPS60177576A (en) * 1984-02-23 1985-09-11 シャープ株式会社 Method of connecting liquid crystal display element
JPH0348633B2 (en) * 1984-09-04 1991-07-25 Daisow Co Ltd
JPS6164085A (en) * 1984-09-04 1986-04-02 ダイソー株式会社 Electric member
JPS61168573U (en) * 1985-04-09 1986-10-18
JPS61168574U (en) * 1985-04-09 1986-10-18
JPS62109857A (en) * 1985-11-06 1987-05-21 Hiroshi Hirabayashi Molding composition
JPS63237374A (en) * 1987-03-26 1988-10-03 キヤノン株式会社 Electric circuit member
JPH01297462A (en) * 1988-05-25 1989-11-30 Tech Res & Dev Inst Of Japan Def Agency Coloring composition for camouflaging and camouflaged colored material
JPH0333752B2 (en) * 1988-05-25 1991-05-20 Boeicho Gijutsu Kenkyu Honbucho
US5376403A (en) * 1990-02-09 1994-12-27 Capote; Miguel A. Electrically conductive compositions and methods for the preparation and use thereof
US5830389A (en) * 1990-02-09 1998-11-03 Toranaga Technologies, Inc. Electrically conductive compositions and methods for the preparation and use thereof
US5853622A (en) * 1990-02-09 1998-12-29 Ormet Corporation Transient liquid phase sintering conductive adhesives
WO2016080053A1 (en) * 2014-11-17 2016-05-26 カルソニックカンセイ株式会社 Electronic substrate and heat-dissipating structure

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