JPS60133054A - Composition for conductively anisotropic heat sealing, its manufacture and its usage - Google Patents

Abstract

PURPOSE:To obtain a composition with hot-contact bonded dry coating film therefrom conductively anisotropic and heat-sealable, comprising conductive fine powder such as graphite one, hot-contact bonding polymeric binder and solvent. CONSTITUTION:The objective composition, i.e. a suspension with an apparent specific gravity 0.7-2.0 and viscosity 50-1,500 poises, can be obtained by mutually mixing the following components into a homogeneous dispersion: (A) 0.5- 20wt% of conductive fine powder consisting of at least one sort of matter selected from graphite, silver, copper and nickel powder with a size 0.5-4mu and carbon black powder with a size <=0.1mu, (B) 5-60wt% of hot-contact bonding polymeric binder (made up of at least one sort of polymer selected from chloroprene synthetic rubber and ethylene-vinyl acetate copolymer resin), (C) 30- 90wt% of a solvent consisting of at least one sort of solvents selected from isophorone, diacetone alcohol, methyl isobutyl ketone, xylenes, toluene, etc. and, if necessary, (D) 0.5-15wt% of tackifier (e.g. terpene resin, aliphatic hydrocarbon resin).

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a conductive anisotropic heat sealing composition. The invention also relates to a method of making the same and a method of using the same.

In other words, the conductive anisotropy of the present invention refers to the conductive anisotropy between the conductive strip layers at both end edges that are thermocompression bonded, that is, between the thermocompression bonded layers, that is,
In the direction, electrical connection can be made with a relatively small resistance value of, for example, 100 to 500Ω, and at the same time,
The distance between both adjacent conductive strip layers, that is, the interval width in the X direction is
The electrically insulated anisotropy can be satisfied with a relatively large resistance value of 5XiO10Ω at a minimum of 0.05m77H. The present invention relates to such a conductive anisotropic heat sealing composition.

DETAILED DESCRIPTION OF THE INVENTION In general, conductive heat-sealing compositions used heretofore may be used in conjunction with separate insulating heat-sealing compositions or alone to manufacture common printed circuit boards (
Used as a type of adhesive to apply and dry the electrode terminals of PCBs, flexible printed circuit boards (FPCs), electronic components, etc., overlap them with other desired electronic component electrode terminals, and heat-press them to integrate them. has been done.

When connecting current between terminals, soldering does not require any process at all, and the required heating temperature is lower than that of soldering. Polyester film, which is said to have inferior heat resistance, as well as general PCBs, It can also be used for FPC using. This makes it possible to considerably streamline the process of mounting parts and reduce costs, and its reliability has also been highly evaluated.

However, in the conventional method, from the viewpoint of adhesive strength after thermocompression bonding, it is necessary to use conductive and insulating heat seal compositions separately as described above, and the application process requires separate steps. There must be. moreover,
As the so-called "circuit turning" becomes more complex,
This increases the number of coating steps and makes it more complicated. Therefore, the cost ratio for products using this composition increases, and this becomes a cause of hindering further cost reduction and process rationalization.

Also, the current accuracy in the coating process is o, 27. , m width, and if coating with this precision is required several times,
As a result, the defective rate in production doubles as the number of times increases. For this reason, the use of this conductive and insulating heat-sealing composition is limited to production by applying a 0.2 mm width, but it is not suitable for mass production, so it is currently not available in the form of a special limited edition. be.

On the other hand, the soldering process has an established automated line and is suitable for mass production, but it requires equipment such as solder and flux, and it is difficult to streamline the process and reduce costs.
Moreover, since the substrate used must also have heat resistance, it has not come to be used for all substrates and electronic components.

The object of the present invention was to solve the above-mentioned problems, and to provide a composition in which a dry coating film bonded by thermocompression exhibits conductive anisotropy and also has heat-sealing properties, and a method for producing the same. and how to use it.

This electrically conductive anisotropic heat seal composition can be applied to a desired PCB,
After coating and drying the parts that need to be electrically connected, such as the electrode terminals of FPCs and electronic components, regardless of whether they are conductor areas or insulator areas, the parts to be adhered are thermocompressed (see the drawings). reference). At this time, in the cross section of the integrated electronic component and the dried coating film, the vertical direction (y direction in the figure) shows conductivity, and the horizontal direction (X direction in the figure) shows insulation. Therefore, it is necessary to use separate conductive and insulating heat seal compositions.
The present invention provides a heat-sealable coating film that is completely different from conventional coatings in terms of performance by simply applying it to a desired area and drying it, regardless of whether it is a conductor or an insulator.

In addition, since the dry coating film has conductivity only in the vertical direction of the cross section, there is no difference in the single width, or so-called pitch interval, in the repetition of conductor-insulation-conductor-insulation on substrates, electronic components, etc. to which it is applied. It can be used without any influence. The 0.2mfi width accuracy of the conventional coating process has been solved at once, and the fact that it can be used even with pitch spacings as low as 0.05mm is attracting attention in the future of electronic components. That's probably the case.

The present inventors have achieved the present invention with the above objectives and as a result of intensive research aiming at the above effects.

That is, the conductive anisotropic heat-sealing composition of the present invention first contains (a) graphite powder, silver powder, copper powder, nickel powder with a particle size of 0.5 to 40μ, and carbon powder with a particle size of 0.1μ or less.
0.5 to 2021% of conductive fine powder consisting of one or more types of black powder, and (b) thermocompression adhesive polymer binder 5
~60% by weight, and (C) isophorone, diacetone alcohol, methyl in butyl ketone, xylene, toluene,
80 to 90% by weight of a solvent consisting of one or more of diethyl calpitol and cellosolve acetate is mixed and dissolved, and uniformly dispersed with a loss specific gravity of 0.7 to 2. It is characterized by consisting of a suspension (a ten su ten c) with a viscosity of 50 to 1500 voids.

Further, the conductive anisotropic heat sealing composition of the present invention has (a
) Conductive fine powder consisting of one or more of graphite powder, silver powder, copper powder, nickel powder with a particle size of O05-40μ, and carbon black powder with a particle size of 0°1μ or less 0.5-20
and (b) 5 to 60% by weight of a thermocompressible polymeric binder.
and (C) 80-90% of a solvent consisting of one or more of isophorone, diacetone alcohol, methyl isobutyl ketone, xylene, toluene, diethylcarpitol and cellosolve acetate, and further (d) a tackifier. It is characterized by consisting of a suspension (a + b + c + d) with an apparent specific gravity of 0.7 to 2.0 and a viscosity of 50 to 1,500 voids, which is obtained by mixing and dissolving 0.5 to 15% by weight and uniformly dispersing it. .

Furthermore, the method for producing the conductive anisotropic heat sealing composition of the present invention includes (a) graphite powder, silver powder, copper powder, nickel powder with a particle size of 0.5 to 40μ, and carbon black with a particle size of 0.1μ or less; 0.5 to 20% by weight of a conductive fine powder consisting of one or more types of powder, (b) 5 to 60% by weight of a thermocompression adhesive polymer binder, and (C) isophorone, diacetone alcohol, methyl. Isobutyl ketone, xylene, toluene, diethylcarpitol and selonlubuacetate.
30 to 90% by weight of a solvent consisting of one or more of the following is mixed and dissolved (a + b + c) L and uniformly dispersed to give an apparent specific gravity of 0.7 to 2.0, a viscosity of 50 to 1500, and a void suspension of 50 to 1500. It is characterized by being adjusted to a cloudy liquid.

Furthermore, the method for using the conductive anisotropic heat sealing composition of the present invention includes (graphite powder, silver powder, copper powder, nickel powder with a1 particle size of 05 to 40μ, and carbon black powder with particle size of 0.1μ or less). 0.5 to 20]ii% of conductive fine powder consisting of one or more types, (b) 5 to 60% of a thermocompression adhesive polymer binder, and (C) isophorone, diacetone alcohol, methyl An apparent specific gravity of 0.7 to 2.0% is obtained by mixing and dissolving 80 to 90% by weight of a solvent consisting of one or more of isobutyl ketone, xylene, toluene, diethyl calpitol and cellosolve acetate, and uniformly dispersing the mixture.
0, suspension with a viscosity of 50 to 1500 poise (a+b+c)
A conductive anisotropic heat-sealing composition consisting of a conductive anisotropic heat-sealing composition having a minimum mutual insulation width of o, o5.
After coating and depositing an adherent layer on one surface of at least one of both terminal areas of a corresponding desired electric component provided with a plurality of conductive strip layers up to gt, the above-mentioned both terminals are applied. The areas are overlapped so that the conductive strip layers are electrically conductive with each other, and heated at a temperature of 70 to 250°C and a pressure of 1 to 75 kg/c.
It is characterized in that both terminal areas are crimped by heating and pressurizing with IrL2.

In addition, in the present invention, the thermocompression bondable polymer binder (
It is characterized in that bl is one or more of chloroprene-based synthetic rubber, ethylene-vinyl acetate copolymer resin, polymethyl methacrylate resin, polyester resin, polyamide resin, and polyurethane resin.

Furthermore, the tackifier ((11 is a terpene resin,
It is characterized by being made of one or two aliphatic hydrocarbon resins.

Next, the reason for limiting the number of lids in the present invention is as follows. If the conductive fine powder (a) has less than O05%, the conductivity is insufficient and it cannot be used.

If it exceeds 20% by weight, it will show conductivity also in the cross-sectional direction (X direction) and cannot be used. If the amount of the polymer binder (b) is less than 5% by weight, the adhesive strength after thermocompression bonding will be insufficient and it cannot be used. Moreover, if it exceeds 60% by weight, it cannot be used because it exhibits insulating properties also in the longitudinal direction (X direction) of the cross section. The solvent (C) is 80
If it is less than 90% by weight, the viscosity of the suspension will be too high (too much, making it difficult to print and apply), and if it exceeds 90% by weight, the viscosity will be too low, making it difficult to apply. Also, considering the stability of the suspension, it cannot be used.If the tackifier (d) is less than 0.5]M:%,
This is not acceptable because it does not exhibit an adhesive effect, and if it exceeds 15%, the consistency of the suspension is too high and it is difficult to use, so it is not acceptable.

When the apparent specific gravity is less than 0.7 with respect to the above apparent specific gravity O07 to 2.0, the proportion of the C component in the suspension 1 (a + b + c) and (a + b + c + d) components increases, and the viscosity becomes too low. cannot be used. If it exceeds 2.0, (a+b+c
) and (a+b+c10a) components (al component) increases and exhibits conductivity also in the transverse cross-sectional direction (X direction), making it unusable.
500 voids, if it is less than 50 voids, it is difficult to coat and cannot be used, and if it exceeds 1500 voids, the consistency is too high (too much and coating is difficult and not possible).

Furthermore, the particle size of the conductive fine powder (a) is 0.5 to 40.
If the value of μ is less than that, the contact resistance will increase, the conductive anisotropy will not be exhibited, and the material will become close to insulating, so it is not acceptable. If the value exceeds this value, conduction will easily occur even in the lateral direction of the new surface, making it impossible.

On the other hand, in the case of carbon black, the particle diameter is set to be less than 0.01 μm because it is difficult to obtain particles with a diameter exceeding 0.1 μm, and since the particles are bonded together like a chain, it is not limited even if the particles are fine.

Next, to briefly explain an example of the use of the present invention with reference to the drawings, the electrode terminals 4 of a liquid crystal display tube (LC'D) 8 are connected to the conductor terminals 2 of a printed circuit board (PCB) 1 with corresponding conductors 5 and 6, respectively. During this time, an adhesion layer 7 of the composition according to the present invention is formed.

FIGS. 1 and 2 are perspective views showing an enlarged outline thereof. - Next, this is heated and pressed, that is, thermocompression bonded, to form the conductive anisotropic heat-sealing layer 8.

That is, the corresponding conductors 5 and 6 are adhered to each other to complete the connector portion. FIG. 8 is a schematic diagram showing an enlarged view of this connector section.

In this case, in the X direction, insulation is maintained even if the heat seal layer 8 is interposed between them, and in the X direction, that is, the pressure bonding layer between the corresponding conductors 5 and 6, that is, the heat seal layer is conductive. In this way, it exhibits conductive anisotropy.

Also, for example, when the distance width between adjacent conductors 5 in the X direction is at least 0.05 mm, the resistance value in the X direction is 5 x 1
The resistance value in the X direction is only about 100 to 500Ω, which is very large.

Very small.

The present invention will be further described below with reference to Examples.

Example 1-1 (a) Graphite powder with an average particle size of 20μ 5% heavy chain (bJ polymer resin binder 25% (thermocompression bondable) (c) Solvent Isophorone 80tt Xylene 30% by weight Toluene 10% Specific gravity: 0.9, viscosity: 200 poise In this case, (b) Nisbel 1811 (polyester resin) manufactured by Hitachi Chemical Co., Ltd. Ring Vinyroll KBX-0161 manufactured by Showa Kobunshi Co., Ltd.
(//) etc. can be used.

Example 1-2 (a) Graphite powder with an average particle size of 10μ 4-layer carbon black with a cap% of 0.1μ or less 2 (bl thermocompression bondable
5o 〃 Polymer resin binder (C) solvent Cellosolve acetate 2o 〃Toluene 20 〃 Isophorone 4 〃 Apparent specific gravity 1゜0, viscosity 1250 boise In this case (b)
As examples, Showa Kobunshi Co., Ltd. Ring Vinyroll 2200 (chloroprene synthetic rubber), Vinylol 5F-L (ethylene-vinyl acetate copolymer), and the like can be used.

Example 1-8 (a) Graphite powder with an average particle size of 5μ 10% (bJ thermocompression bondable polymer resin binder 40//(C) Solvent methyl in butyl ketone 20//Diacetone alcohol 20/ / Toluene 10// Apparent specific gravity 1゜0, viscosity 1400 voise In this case (b)
As Fuji Kasei Kogyo Co., Ltd. Tomide #512 (Polyamide 1
Degreasing) Dai Shichiru Kogyo Co., Ltd.'s Dai Amide (nylon resin), etc. can be used.

Example 1-4 (a) Silver powder with an average particle size of 15μ 20% (bl) Polymer resin binder capable of thermocompression bonding 30//(C1 solvent Isophorone 20// Toluene 20// Xylene 10// In this case, Nispel 1311 (polyester resin) manufactured by Hitachi Chemical Co., Ltd., Vinyroll 2200 (chlorofusin synthetic rubber) manufactured by Showa Kobunshi Co., Ltd., etc. can be used as bJ.

Example 2-1 (a) Graphite powder with an average particle size of 20μ 5% by weight (b) Polymer resin binder capable of thermocompression bonding 80 (C) Solvent Isophorone 20 // Diethyl calpitol 15 Turpentine 5 Toluene 15 〃 (dl Tackifying resin 10// Apparent specific gravity 0.9 Viscosity 750 voise In this case (b1 Nippon Polyurethane Co., Ltd. Niboran 2802 (Boriureta resin) // tt 8022 ('') (d, l Rough damage Alcon P-100 (aliphatic hydrocarbon resin) manufactured by Kagaku Kogyo Co., Ltd. can be used.

Example 2-2 (Al Graphite powder with an average particle size of 10μ 41% carbon black of 0.1A or less 2 (bJ thermocompression bondable polymer resin binder 42% by weight (C1 solvent cyclohexanone-20/ /Xylene 20 〃 Dioctyl phthalate ('D, O, P) 4 1/(
d) Tackifying resin 8/l Apparent specific gravity 1.1, viscosity 1500 voise In this case (b) Toyobo Co., Ltd. Vylon 2038 (Polyester V, ll fat) // // 3 oss (// ) (C1 Alcon P-100 (aliphatic hydrocarbon resin) manufactured by Arakawa Chemical Co., Ltd. (dicaloric hydrocarbon resin manufactured by Mitsubishi Gas Chemical Co., Ltd.), etc. can be used.

Example 2-8 ta + graphite powder with average particle size of 10μ 10% (+))
Polymer resin binder capable of thermocompression bonding 30 〃(c) Solvent
Butyl cellosolve acetate) 20//n-hexane 20 xylene 15// (d) Tackifying resin 5 Apparent specific gravity 1.0, viscosity 1800 poise In this case (bl Showa Neoprene Co., Ltd. Neoprene WRT ( Chloroprene rubber) // // WD (//') (dll Frozen Oil and Fat Industries Co., Ltd.) YS Resin-#1150 (terpene resin), YS Resin #1000 (), etc. can be used.

Example 2-4 (al 20% by weight of silver powder with an average particle size of 15 μm) (bl thermocompression-bondable polymeric resin binder 30 (C1 solvent isophorone 20) xylene 20 (dl tackifying property) Resin 5 // Apparent specific gravity 1.6, viscosity 900 boids In this case // tt HE-10 (〃) (d1 Nippon Zeon Co., Ltd. Finton A-too (li aliphatic petroleum resin) etc. can be used.

The effects of the present invention are such that the above-mentioned objects of the present invention are fully achieved, and electrical connections between terminals of electrical components and electronic devices can be made in a simple process while maintaining high reliability using a single heat-sealing composition. can do. It is extremely useful in industry.

[Brief explanation of drawings]

FIG. 1 is an enlarged perspective view showing an example of the use of a conductive anisotropic heat-sealing composition according to an embodiment of the present invention, and FIG. 2 is a schematic perspective view showing a composition layer according to an embodiment of the present invention. FIG. 8 is an enlarged schematic cross-sectional view of the connector portion in which the composition layer shown in FIG. 2 is crimped. ■...Printed circuit board (PCB) 2...Conductor terminal 3...Liquid crystal display tube (LCD) 4...Electrode terminal 5.6...Corresponding conductor 1 (i.e. thermocompression bonded conductor) 7... Adhesive layer of composition 8... Conductive anisotropic heat-sealing layer. Procedural amendment dated July 12, 1980 1. Indication of the case 1988 Patent Application No. 2284-57 2. Name of the invention 3. Person making the amendment Relationship with the case Patent applicant Nippon Graphite Industries Co., Ltd. 1 , the claims on page 1, line 4 to page 6, line 1 of the specification are amended as follows. [2. Claim 1, (a) graphite powder with a particle size of 0.5 to 40μ, silver powder, copper powder, nickel powder, palladium l) powder, tin powder, solder powder, and carbon black with a particle size of 0.1μ or less powder 1
0.5 to 20% by weight of a conductive fine powder consisting of a species or two or more species, (1)) 5 to 60% by weight of a thermocompression adhesive polymer binder, and (C) isophorone, diacetate alcohol, An apparent specific gravity of 0.7 to 2.01, uniformly dispersed by mixing and dissolving 30 to 90% by weight of a solvent consisting of one or more of methyl isobutyl ketone, xylene, toluene, diethyl carpitol and cellosolve acetate. Viscosity 50-1
A conductive anisotropic heat sealing composition comprising a 500 poise suspension (8+b+'c). 2. The thermocompression bondable polymer binder (b) includes Orlprene synthetic rubber, ethylene vinyl acetate copolymer resin, polymethyl methacrylate resin, polyester resin, polyamide adhesive, One or two of polyurethane 8I fats
The conductive anisotropic heat-sealing composition according to claim C, characterized in that the conductive anisotropic heat-sealing composition is characterized in that the composition contains at least one species. 3. (a) One or more types of graphite powder, silver powder, copper powder, nickel powder, palladium powder, tin powder, solder powder, and carbon black powder with a particle size of 0.1 μ or less, with a particle size of 0.5 to 40 μ 0.5 to 20% by weight of conductive fine powder consisting of (b) 5 to 601% of a thermocompression adhesive polymer binder, and (C') isophorone, diacetone alcohol, methyl isobutyl ketone, xylene, toluene. , 1M of diethylcarpitol and cellosolve acetate! or 2'pf
An apparent ratio MO obtained by mixing and dissolving 30 to 90% by weight of a solvent consisting of iJ, lf and further 0.5 to 15% by weight of (d) a tackifier and uniformly dispersing the mixture. 2.0 and a viscosity of 50 to 1500 voids (a + c + d). 4. The thermocompression-adhesive polymer binder (h) is one or two of the following: polypropylene synthetic rubber, ethylene-vinyl acetate copolymer resin, polymethyl methacrylate resin, polyester resin, polyamide resin, and polyurethane resin. The electrically conductive anisotropic heat-sealing composition according to claim 3, which has the above properties. 5. The electrically conductive anisotropic heat seal according to claim 3, wherein the tackifier (d) is one or both of a terpene resin and an aliphatic hydrocarbon resin. Composition. 6. (a) One or more types of graphite powder, silver powder, copper powder, nickel powder, palladium powder, tin powder, solder powder, and carbon black powder with a particle size of 0.1 μ or less, with a particle size of 0.5 to 40 μ 0.5 to 20% by weight of a conductive fine powder consisting of (b) a thermocompression adhesive polymer binder of 5 to 6071% mold
and (C) 30 to 90% by weight of a solvent consisting of one or more of isophorone, diacetone alcohol, methyl isobutyl ketone, xylene, toluene, diethylcarpitol, and cellosolve acetate are mixed and dissolved (a + b
+c) L/, uniformly dispersed appearance +1) specific gravity 0
．． 7 to 2.0 and a viscosity of 50 to 1,500 poise. 7. The thermocompression adhesive polymer binder (b) is a polypropylene synthetic rubber, ethylene il! The conductive anisotropic heat according to claim 6, characterized in that it is one or more of acid vinyl copolymer resin, polymethyl methacrylate resin, polyester resin, polyamide resin, and polyurethane resin. A method for producing a sealing composition. 8. (a) 1 of graphite powder, silver powder, copper powder, nickel powder, palladium powder, tin powder, solder powder, and carbon black powder with particle size of 0.5 to 40μ and 0.1μ or less
0.5 to 20% by weight of S-conductive fine powder consisting of seeds or 2i or more; and (b) 5 to 60% by weight of a thermocompression adhesive polymer binder.
and (C) 1 weight or 2f of isophorone, diacetone alcohol, methyl isobutyl ketone, xylene, toluene, diethylcarpitol and cellosolve acetate!
Mixing and dissolving 30 to 90% by weight of a solvent consisting of i or more,
Uniformly dispersed apparent specific gravity 0.7-2.01 viscosity r&5
A conductive anisotropic heat sealing composition consisting of a suspension (a + b + c) of 0 to 1500 voids is electrically connected to each other so that the mutual insulation width to be electrically conductive is at least 0.05 mm.
After forming an adherent layer by coating on one surface of at least one of both terminal areas of a corresponding desired electric component provided with a plurality of conductive strip layers up to the above-mentioned both terminal areas The above-mentioned conductive strip layers are stacked so as to be electrically conductive with each other, and heated at a temperature of 70 to 250°C and a pressure of 1 to 75 kg/
A method of using a conductive anisotropic heat-sealing composition, which comprises crimping the both terminal areas by applying heat and pressure using a CD. 9. The thermocompression bondable polymeric binder (b) is 141 or 2 or more of the following: polypropylene synthetic rubber, ethylene-vinyl acetate copolymer resin, polymethyl methacrylate resin, polyester resin, polyamide resin, and polyurethane resin. A method of using the conductive anisotropic and sealing composition according to claim 8, characterized in that: ” 2. Specify page 6, line 8 “100-500Ω” as [10
~1 to Ω]. 3. Add the following between page 9, line 14 and line 15. There are various types of electronic components to be connected, such as PCBs, FPCs, glass for liquid crystals, solar cells, etc., but the surface conductive material of the connecting terminals, for example, in the case of PCBs, is gold, tin, graphite, etc. In the case of , it is tin oxide, indium oxide, etc. Due to this conductive material, the contact resistance value with the conductive fine powder used in the S-electrotropic thermocompression suspension changes significantly. When the surface conductive material is graphite, the conductive fine powder of the conductive anisotropic thermocompression suspension shows lower contact resistance value than graphite and carbon black, and the surface conductive material such as gold, tin, tin oxide, indium oxide, etc. The contact resistance value of the terminal will be high if the terminal is made of a material.On the contrary, if the electrical material on the terminal surface is gold, tin, tin oxide, indium oxide, etc., the conductive fine powder will be nickel, palladium, tin, etc. Solder powder, etc. are good.For this reason, this conductive anisotropic heat sealing composition, which is intended for connecting various electronic component terminals, is made by blending various conductive fine powders in a certain small amount. 4. On page 10, line 9, replace [Nilakel powder and] with [nickel powder, palladium powder, tin powder, solder powder and]
Correct. 5. Change ``nickel powder and'' to ``nickel powder, palladium powder, tin powder, solder powder and'' in the second line of page 11.
In line 13 of the same page, "nickel powder and" is corrected to "nickel powder, palladium powder, tin powder, solder powder and". 6. Change "nickel powder and" in line 8 of page 12 to "nickel powder, palladium powder, tin powder, solder powder and"
Correct. 76, page 16, line 13 [100~5O0Ω] is changed to “10
Correct it to Ω to 1. 8. Between the 3rd and 4th lines of page 19, there is a Karo person as shown below. [Example 1-5 <a) 3 weight graphite powder with an average particle size of 20μ w% average particle size of 5μ
Tin powder 2Φm% (11) Polymer resin binder 25 times open air (can be bonded by thermocompression) (C) Solvent Isophorone 30% by weight Xylene 30% by weight Toluene 10% by weight In this case (h) is Hitachi Chemical Nisbel 1311 (polyester resin) manufactured by Kogyo Co., Ltd. Vinyroll K B X-0161 manufactured by Showa Kobunshi Co., Ltd.
(polyester resin) etc. can be used. Example 1-6 (a) Graphite powder with an average particle size of 5μ 4% by weight average particle size 1
5μ nickel powder 6% heavy chain (11) Thermocompression bondable polymeric resin binder 40% by weight (C) Solvent Methyl isobutyl 1-20% by weight diacetone alcohol 20 [@
% Toluene 10% by weight 14. ) specific gravity 1.0, viscosity 140O bois In this case (
As b), Ni Kasei Gyo Co., Ltd. 1-Mite #512 (polyamide resin), Daicel Industries Co., Ltd. Dai-Amide (nylon resin), etc. can be used. 9, page 21, No. 20 et seq., the following is added. “Example 2-5 (a) 7% by weight graphite powder with an average particle size of 10 μm and an average particle size of 5
μ palladium powder 3% by weight (b) Polymer resin binder capable of thermocompression bonding 30% by weight (C) Solvent butyl cellosolve acetate 20% by weight n-hexane 20% by weight Xylene 15% by weight (d) Tackifying resin 5% by weight Apparent specific gravity 1.0, viscosity 1300 voids In this case (b) Showa Neoprene Co., Ltd., Neoprene WRI (chloroprene rubber) Showa Neoprene Co., Ltd., Neoprene WD (chloroprene rubber) (d) Frozen Oil and Fat Industries YS Resin #1150 (terpene resin) manufactured by Frozen Oil Industry Co., Ltd., YS Resin #1000 (terpene resin) manufactured by Frozen Oil Industry Co., Ltd., and the like can be used. ” Procedural amendment to remove January 28, 1985 1. Indication of the case 1988 Patent Application No. 228457 2. Name of the invention Conductive anisotropic heat sealing composition Method for manufacturing and using the same 3. Amendment Relationship with Person 21 Patent Applicant: Nippon Graphite Industries Co., Ltd. (Amendment) Description 1, Title of Invention Conductive Anisotropic Heat Sealing Composition, Method for Manufacturing and Using the Same 2, Claims L (a) Conductive fine powder consisting of one or more of graphite powder, silver powder, copper powder, nickel powder, palladium powder, and carbon black powder under tin powder with a particle size of 0.5 to 60μ. 5 to 20% by weight b) 5 to 55% by weight of thermocompression bondable polymer binder, and (C) one type of isophorone, diacetone alcohol, methyl isobutyl ketone, xylene, toluene, diethyl calpitol, and cellosolve acetate. Or an apparent specific gravity of 0.7 to 2.0% by mixing and dissolving two or more solvents with 80.wt% and uniformly dispersing them.
0, suspension with a viscosity of 50 to 1500 poise (a+b+c+
4) A conductive anisotropic heat sealing composition comprising: Elephant: The thermocompression adhesive polymer binder (b) is 14 or 24 or more of chloroprene-based synthetic rubber, ethylene-vinyl acetate resin, polymethyl methacrylate resin, polyester resin, polyamide resin, and polyurethane resin. The conductive anisotropic heat-sealing composition according to claim 1, characterized by: & (a) Graphite powder, silver powder, copper powder, nickel powder, palladium powder, tin powder, solder powder, gold-plated nickel powder, gold-plated copper powder, gold-plated tin powder and Q, 1μ particle size of 0.5-60μ 1 of the following carbon black powders
0.5 to 20% by weight of a conductive fine powder consisting of a species or two or more, ■) 5 to 56 weight Jt% of a thermocompression adhesive polymer binder, and 1
．． (0) 80 to 90% by weight of a solvent consisting of one or more of the following: isophorone, diacetone alcohol, methyl isobutyl ketone, xylene, toluene, diethylcarpitol and cellosolve acetate; (d) calcium carbonate powder 0. 5 to 5% by weight, and further (e) 0 tackifier
．． 5 to 15% by weight and uniformly dispersed in a suspension having an apparent specific gravity of 0.7 to 2.0 and a viscosity of 50 to 1500 poise (a+b+c+d+6). Heat-sealing composition. The above-mentioned thermocompression bondable polymeric binder [A] is one or more of chloroprene-based synthetic rubber, ethylene-vinyl acetate copolymer resin, polymethyl methacrylate resin, polyester resin, polyamide resin, and polyurethane resin. The conductive anisotropic heat-sealing composition according to claim 8, characterized in that: & The conductive anisotropic heat-sealing composition according to claim 8, wherein the tackifier (e) is one or two of a terpene resin and an aliphatic hydrocarbon resin. thing. a (a) Graphite powder, silver powder, copper powder, nickel powder, palladium powder, tin powder, solder powder, gold-plated nickel powder, gold-plated copper powder, gold-plated tin powder and 0.1-μ particle size. ．． Conductive fine powder consisting of one or more types of carbon black powder of c+ or less 0.5 to 2
0 weight s) thermocompression adhesive polymer binder 5-55% by weight
and (0) a solution of 0.5 to 5 times consisting of one or more of isophorone, diacetone alcohol, methyl isobutyl ketone, xylene, toluene, diethylcarpitol, and cellosolve acetate mixed and dissolved (a+b+
o+d) and uniformly dispersed with an apparent specific gravity of 0.7 to 2.
A method for producing a conductive anisotropic heat sealing composition, which comprises adjusting the composition to a suspension having a viscosity of 0.0 and a viscosity of 50 to 1500 voids. 1.) of the thermocompression adhesive polymer binder is one or two of chloroprene-based synthetic rubber, ethylene-vinyl acetate copolymer resin, polymethyl methacrylate-F resin, polyester resin, polyamide resin, and polyurethane resin. 7. The method for producing a conductive anisotropic heat-sealing composition according to claim 6, wherein the conductive anisotropic heat-sealing composition is at least 1 species. & (a) Conductive fine powder consisting of one or more types of graphite powder, silver powder, copper powder, nickel powder, palladium powder, and carbon black powder below tin with a particle size of 0.5 to 60μ. (C) isophorone, diacetone alcohol, methyl isobutyl ketone, xylene, toluene,
An apparent specific gravity of 0.7 to 2.0 and a viscosity of 50 to 15 O0 is obtained by mixing and dissolving 0.5 to 5% by weight of a solution consisting of one or more of diethyl calpitol and cellosolve acetate and uniformly dispersing it. suspension (a + b + o + d
), the electrically conductive anisotropic heat-sealing composition should be electrically connected to each other and have a minimum mutual insulation width of Q, Q5.
After forming an adherent layer by coating on one surface of at least one area of both terminal areas of a corresponding desired electric component provided with a plurality of conductive strip layers up to m+i, the above-mentioned both terminals are applied. The areas are overlapped so that the conductive strip layers are electrically conductive with each other. C1 temperature: 70-250°C, pressure: 1-75'C
9/ A method of using a conductive anisotropic heat-sealing composition, which comprises crimping the both terminal areas by heating and pressurizing with Cr+t. 9) of the thermocompression adhesive polymer binder is one or more of chloroprene-based synthetic rubber, ethylene-vinyl acetate copolymer resin, polymethyl methacrylate resin, polyester resin, polyamide resin, and polyurethane resin. A method of using the electrically conductive anisotropic heat sealing composition according to claim 8. 3. Detailed Description of the Invention The present invention relates to a ζ conductive anisotropic heat sealing composition. The invention also relates to a method of making the same and a method of using the same. That is, the conductive anisotropy of the present invention refers to the conductive i! Electrical connection can be established between the strip layers, that is, between both thermocompression layers, that is, in the y direction, with a relatively small resistance value of, for example, 10 to 1 KJ7, and at the same time,
The minimum distance between both adjacent conductive strip layers, that is, the distance in the X direction is 0.0511111! It is possible to satisfy the anisotropy of electrical insulation with a relatively large resistance value of 5×1 OΩ. The present invention relates to such a conductive anisotropic heat sealing composition. DETAILED DESCRIPTION OF THE INVENTION In general, conductive heat-sealing compositions used heretofore may be used in conjunction with a separate insulating heat-sealing composition composition or alone for application to general printed circuit boards ( PCB), flexible printed circuit board (FP
C) is used as a type of adhesive to apply and dry the electrode terminals of electronic components, etc., overlap them with other desired electronic component electrode terminals, and bond them under heat to form an integrated C. When making terminal-to-terminal electrical connectors, soldering does not require any process, and the required heating temperature is lower than that of soldering. It can also be used for FPO using stell film. This makes it possible to considerably streamline the process of mounting parts and reduce costs, and its reliability has also been highly evaluated. However, in the conventional method, from the viewpoint of adhesive strength after thermocompression bonding, it is necessary to use conductive and insulating heat seal compositions separately as described above, and the application process requires separate steps. There must be. moreover,
As the so-called "circuit turning" becomes more complex,
This increases the number of coating steps and makes it more complicated. Therefore, the cost ratio of products using this composition is increased, which hinders further cost reduction and process rationalization. In addition, the current accuracy in the coating process is 0.19 mm width,
Moreover, if coating with this precision is required several times1, the defective rate in production doubles as the number of times increases. For this reason, the use of this conductive and insulating heat-sealing composition is limited to production by coating it in a width of 0.2 mm, which is not suitable for mass production, and is currently only available in a limited edition. be. On the other hand, the soldering process has an established automated line and is suitable for mass production, but it requires equipment such as soldering and flux, making it difficult to rationalize the process and reduce costs, and the substrate used Since the material itself requires heat resistance, it has not been used for all circuit boards and electronic components.The purpose of the present invention is to solve the above problems. It is an object of the present invention to provide a composition in which a compressed dried coating film exhibits conductive anisotropy and also has heat-sealing properties, and a method for producing and using the same.This conductive anisotropic heat-sealing composition , desired PCB
, FPG and electronic component electrode terminals and other parts that need to be connected with electricity, regardless of whether they are conductor areas or insulator areas.
At the same time, it is coated on one side and dried, and then heat-pressed onto the area where the curvature is to be applied (see drawing). At this time, in the cross section of the integrated electronic component-dried coating film, the vertical direction (X direction in the figure) shows full conductivity, and the horizontal direction (
In the direction (X direction in the figure), insulation is exhibited. Therefore, there is no need to use separate conductive and insulating heat seal compositions, and
To provide a heat-sealable coating film that is completely different from conventional coatings in terms of performance, regardless of the insulator, simply by applying it to a desired area and drying it. The electronic components to be connected are POB and FPC! , Nesa Glass for liquid crystals, solar cells, etc., but the surface conductive material of the connecting terminal part, for example, in the case of PCB, is gold, tin, graphite, etc., and in the case of Nesa Glass for liquid crystals, it is tin oxide, indium oxide, etc. be. This conductive material significantly changes the contact resistance value with the conductive fine powder used in the conductive anisotropic thermocompression suspension. When the terminal surface conductive material is graphite, the conductive and conductive fine powder of the conductive anisotropic thermocompression suspension is graphite and carbon black, and gold, tin, tin oxide, indium oxide, etc. The contact resistance value of a terminal with a surface conductive material is high. On the contrary, the conductive material on the terminal surface
Among gold, tin, tin oxide, indium oxide, etc., the conductive fine powder is preferably nickel, palladium, eido solder powder, etc. Therefore, this conductive anisotropic heat-sealing composition, which is intended for connecting terminals of various electronic components, can have an even lower contact resistance value by blending a certain amount of various conductive fine powders. Become. In addition, since the dry coating film has conductivity only in the vertical direction of the cross section, there is no difference in C1 single width, so-called pitch interval, in the repetition of conductor-insulation-conductor-insulation on substrates and electronic components to be coated. It can be used without any influence. The 0.2 inch width accuracy of the conventional coating process has been solved at once, and it is now possible to use pitches even smaller than that, with a minimum pitch of 0.05 mm, which will be of interest in the future of electronic components. It would be to collect. The present inventors have achieved the present invention with the above objectives and as a result of intensive research aiming at the above effects. That is, the conductive anisotropic heat sealing composition of the present invention first contains (a) graphite powder, silver powder, copper powder, nickel powder, palladium powder, tin powder, solder powder, and gold powder with a particle size of 0.5 to 60μ. Conductive fine powder 0°5-2 consisting of one or more of the following: plated nickel powder, gold plated copper powder, gold plated tin powder, and carbon black powder of 0.1μ or less.
0% by weight and ■) 5-55% by weight of thermocompression bondable polymer binder.
and (C) 80 to 9% by weight of a solvent consisting of one or more of isophorone, diacetone alcohol, methyl isobutyl ketone, xylene, toluene, diethylcarpitol, and cellosolve acetate, and (d) calcium carbonate powder and So-called extender pigment of titanium oxide powder 0.
It is characterized by consisting of a suspension (a+b+c+d) having an apparent specific gravity of 0.7 to 2.0 and a viscosity of 50 to 1,500 voids, which is obtained by mixing and dissolving 5 to 5% by weight and uniformly dispersing the particles. Further, the conductive anisotropic heat sealing composition of the present invention has 1.
(a) Graphite powder, silver powder, copper powder, nickel powder, palladium powder, tin powder, solder powder, gold-plated nickel powder, gold-plated copper powder, gold-plated tin powder with a particle size of 0.5 to 60μ, and 0.1μ 1 of the following carbon black powders
0.5 to 20% by weight of conductive fine powder consisting of a species or two or more species; (b) 5 to 55% by weight of a thermocompression bondable polymer binder;
(c) 80 to 90% by weight of a solvent consisting of one or more of isophorone, diacetone alcohol, methyl isobutyl ketone, xylene, toluene, diethylcarpitol, and cellosolve acetate, and (d) calcium carbonate powder and titanium oxide powder. 0.5 to 5% by weight of the so-called extender pigment and further 0.5 to 15% by weight of (e) the tackifier are mixed and dissolved and uniformly dispersed to give an apparent specific gravity of 0.7 to 2.
．． 01 Viscosity 50-1500 void suspension (a+'b+
c+d+6). Furthermore, the method for producing the conductive anisotropic heat-sealing composition of the present invention includes (a) graphite powder, silver powder, copper powder, -nickel powder, palladium powder, tin powder, and solder having a particle size of 0.5 to 60μ; Conductive fine powder consisting of one of powder, gold-plated nickel powder, gold-plated copper powder, gold-plated tin powder, and carbon black powder of 0.1 μ or less, or G2s or more.
．． 5 to 20 important parts and ■) thermocompression adhesive polymer binder 5 to 5
5 Weight section and section 6) One or more of isophorone, diacet/alcohol, methyl isobutyl ketone, xylene, toluene, diethyl calpitol and cellosolve acetate
(d) 80-90% by weight of a solvent consisting of
Calcium carbonate powder and titanium oxide powder are mixed and dissolved with 0.5 to 5% by weight of so-called extender pigment (a+b+.+d) and uniformly dispersed to give an apparent specific gravity of 0.7 to 2.0.
It is characterized by adjusting the viscosity to a suspension having a viscosity of 50 to 1500 voids. Furthermore, 141 methods of using the conductive anisotropic heat sealing composition of the present invention include (a) graphite powder, silver powder, copper powder, nickel powder, radium powder having a particle size of 0.5 to 60μ;
Conductive fine powder consisting of 1 Km or two or more of tin powder, solder powder, gold-plated nickel powder, gold-plated copper powder, gold-plated tin powder, and carbon black powder of 0.1 μ or less 0.5 to 20 m% by weight, ■) 5 to 55 i% by weight of a thermocompression bondable polymer binder, and (C) one of isophorone, diacetone alcohol, methyl isobutyl ketone, xylene, toluene, diethyl calpitol, and cellosolve acetate, or 80 to 90% by weight of a solvent consisting of two or more types,
(d) A suspension with an apparent specific gravity of 0.7 to 2.0 and a viscosity of 50 to 1,500 voids made by mixing and dissolving 0.5 to 5% by weight of so-called extender pigments of calcium carbonate and titanium oxide powder and uniformly dispersing the mixture. A conductive anisotropic heat sealing composition consisting of liquid (a + t) + c + d) is provided with a plurality of conductive strip layers having a minimum mutual insulation width of 0.05 #l to be electrically connected and conductive. After forming a "C" adhesion layer on one surface of at least one of both terminal areas of a desired electric component to be compared, the conductive strip layer is electrically connected to both terminal areas and the conductive strip layer. Place them on top of each other so that the temperature is 70℃.
It is characterized in that the both terminal areas are crimped by heating and pressurizing at ~250[deg.] C. and a pressure of 1~q5ky/crl. In addition, in the present invention, the thermocompression bondable polymer binder (
b) is i4-ff or two or more of chloroprene-based synthetic rubber, ethylene-vinyl acetate copolymer resin, polymethyl methacrylate-Y resin, polyester resin, polyamide resin, and polyurethane resin. do. The extender pigment (ψ is electrically insulating, and 'C' does not contribute to electrical connection at all. Generally, conductive anisotropic heat seals are composed of conductive powder and thermocompression adhesive polymer binder. The environmental properties (e.g., constant temperature and humidity, heat and cold resistance, hot and cold temperature cycles, etc.) of the paint film after thermocompression bonding, that is, in the mounted form, are inferior to general heat seal paint films. This is due to the difference in the expansion and contraction properties of the conductive powder and thermocompression polymer binder in response to humidity.As a result, the contact electrical resistance value of the conductive anisotropic heat seal coating film, Initial properties such as adhesive strength are impaired in proportion to the environmental test time and reliability becomes weak.On the other hand, the conductive anisotropic heat-seal coating film containing the extender pigment (d) has poor environmental properties. It has been experimentally proven that the design is good, and the reliability after implementation is also fully satisfied.
There is C. This is because the extender pigment (d) greatly moderates the expansion and contraction properties of the conductive anisotropic heat-seal coating film itself with respect to temperature and humidity. Furthermore, the tackifier (e) is one of a terpene resin, an aliphatic hydrocarbon resin, or 2#i. Next, the reason for limiting the quantity in the present invention is as follows. If the amount of the conductive fine powder (a) is less than 0.5% by weight, the conductivity is insufficient and it cannot be used. If it exceeds 20% by weight, 'C' also exhibits conductivity in the cross-sectional direction (X direction), making it unusable. If the amount of the polymeric binder is less than 5% by weight, the adhesive strength after thermocompression bonding will be insufficient and it cannot be used. Moreover, if it exceeds 55% by weight, it exhibits insulating properties also in the longitudinal direction (X direction) of the cross section, so it cannot be used. If the solvent (C) is less than 80% by weight, the viscosity of the suspension becomes too high and it is difficult to print and coat, so it is not possible
If it exceeds %, the viscosity becomes too low, making it difficult to apply, and it cannot be used due to the stability of the suspension. If the extender pigment ((1) is less than 0.5% by weight, it cannot act as a relaxation material for expansion and contraction properties, and if it exceeds 5% by weight, it is itself electrically insulating and inhibits conductive anisotropy. If the tackifier (e) is less than 0.5% by weight, it will not exhibit a tackifying effect and cannot be used; if it exceeds 15% by weight, the consistency of the suspension will be too high and it will be difficult to use. Not possible. When the apparent specific gravity is less than 0.7 to 0.7 to 2°O, the suspension (a + b + O + d) and (a + c + d
+e) The proportion of component C in component increases, and the viscosity becomes too low, making it unusable. If it exceeds 2.0, (a
+b+c+d) and (a+b+0+d+e) components (a
) component increases, and it also shows conductivity in the cross-sectional lateral direction (X direction), making it unusable. Roughly speaking, if the viscosity is less than 50 poise, it will be difficult to apply, and if it exceeds 1500 poise, the viscosity will be 1. The consistency becomes too high, making it difficult to apply. Furthermore, the particle size of the conductive fine powder (a) is 0.5 to 60.
If the value of μ is less than that, the contact resistance will increase, the conductive anisotropy will not be exhibited, and the material will become close to insulating, so it is not acceptable. If the value exceeds this value, conduction will easily occur even at C in the lateral direction of the cross section, making it impossible. On the other hand, in the case of carbon fist blanks, the reason why it is less than 0.1μ is that it is difficult to obtain those with a diameter exceeding 0.1μ, and since the particles are bonded together like a chain, fine <-r is also limited. isn't it. Next, to briefly explain an example of the use of the present invention with reference to the drawings, a conductor terminal 2 of a printed circuit board (PCB) 1,
The electrode terminals 4 of the liquid crystal display tube (L(ID) 8) are made to correspond to the corresponding conductors 5 and 6, and an adhesion layer 7 of the composition according to the present invention is interposed between them. This is an enlarged perspective view showing the outline thereof.Next, this is heated and pressurized, that is, thermocompression bonded, to form a conductive anisotropic heat-sealing layer 8.That is, each of the corresponding conductors 5 and 6 is They are adhered to each other to complete the C connector part. Fig. 8 is an enlarged schematic diagram of this connector part shown in C. In this case, in the X direction, a heat seal layer 8 is interposed between them.
Even if the conductors 5 and 6 are connected to each other, insulation is maintained, and conductivity is ensured in the X direction, that is, the crimping layer between the corresponding conductors 5 and 6, that is, the heat seal layer. In this way, it exhibits conductive anisotropy. Also, for example, when the distance width between adjacent conductors 6 in the X direction is at least 0.05 mm, the resistance value in the X direction is 5×10
The resistance value in the X direction is 1 Ω, which is very large.
It is only about 0 to 1 Ω. Very small. The present invention will be further explained below with reference to Examples. (a) Graphite powder with an average particle size of 2oμ 5% by weight (b) Polymer resin binder 24 # (thermocompression bondable) (C) Solvent Isophorone 80 z Xylene 80 at Toluene 101 (d) Extender pigment Titanium oxide Powder 1% by weight (Product name KA-10 manufactured by Titan Kogyo Co., Ltd.) Apparent specific gravity 0.9, viscosity 200 voise (in this case) Nispel 1811 manufactured by Hitachi Chemical Co., Ltd. (polyester resin) Showa Kobunshi ( Vinyroll KBX-0161 (polyester resin) manufactured by Co., Ltd. can be used. Example 1-2 (a) Ink lead powder with an average particle size of 10μ 4% by weight Carbon black with a particle size of 0.1μ or less 2IO:l) Polymer resin binder capable of thermocompression bonding (0) Solvent Cellosolve acetate 2o Toluene 20 s Isophorone 4 # (d) Extender Pigment Titanium oxide powder 2/l (Titan Kogyo Co., Ltd., product name KA~85) Apparent specific gravity 1.0, viscosity 125 o Boyes (in this case Φ) as Showa Polymer ( Vinylol 2200 (chlorobrene synthetic rubber) manufactured by Showa Kobunshi Co., Ltd., Vinylol 5E-L (ethylene-vinyl acetate copolymer) manufactured by Showa Kobunshi Co., Ltd., and the like can be used. Example 1-8 (a) Graphite powder with an average particle size of 5μ 10 times 1) Polymer resin binder capable of thermocompression bonding 87.5 tt<C) Solvent Methyl isobutyl ketone 20 Diacetone alcohol 20 1 Toluene 10 (d) Extender pigment Calcium carbonate powder 2.51 (trade name MSK-0, manufactured by Maruo Calcium Co., Ltd.) Apparent specific gravity 1.
0, viscosity: 1400 voise In this case ■) and 'C Tomide #512 (polyamide resin) manufactured by Fuji Chemical Industries, Ltd., Dai-Amide (nylon resin) manufactured by Daicel Industries, Ltd., etc. can be used. (a) Silver powder with an average particle size of 15μ 20% by weight (b) Polymer resin binder capable of thermocompression bonding 29 #(0) Solvent Isophorone 20 1 Toluene 20 1 Xylene 10 1 ((1) Extender pigment Calcium carbonate powder 11 (trade name MO-1 manufactured by Maruo Calcium Co., Ltd.) Apparent specific gravity 1.7,
Viscosity 500voices (medium in this case) Nispel 1811 (polyester resin) manufactured by Hitachi Chemical Co., Ltd. Showa Kobunshi Co., Ltd.'lit! Vinylol 2200 (chloroprene synthetic rubber) and the like can be used. (a) Graphite powder with an average particle size of 20μ 8% by weight average particle size 5
μ tin powder 2I Φ) Polymer resin binder 24 N (thermocompression bondable) (0) Solvent Isophorone 80% by weight xylene 80
1 Toluene IOI (d) Extender pigment calcium carbonate powder 11 In this case (
b) Nispel 1811 (polyester resin) manufactured by Hitachi Chemical Co., Ltd. Vinyroll KBX-0161 (polyester resin) manufactured by Showa Kobunshi Co., Ltd. (d) °C1 Product name MSK-0 manufactured by Maruo Calcium Co., Ltd., etc. can be used. Example 1-6 (a) Graphite powder with an average particle size of 5μ 4% by weight average particle size 15
μ nickel powder 61 Φ) Polymer resin binder capable of thermocompression bonding 87 1 (C) Solvent Methyl isobutyl ketone 20 Diacetone
Alcohol 20 N Toluene 10 (d) Extender pigment Titanium oxide powder 8I, apparent specific gravity 1.
0, viscosity 1400 voids (medium in this case) Fuji Kasei Kogyo Co., Ltd. Tomide #512 (polyamide resin) Daicel Industries Co., Ltd. Dai-Amide (nylon resin) (d) Toshi C1 Titanium Kogyo Co., Ltd. product name KA -lo etc. can be used. Example 1-7 (a) 8.5w/f% gold-coated nickel powder Φ by gold plating with average particle diameter of 35μ) Polymer resin binder capable of thermocompression bonding 60N(0) Solvent Isophorone 15N Toluene 14.5 1 (CI) Extender pigment Titanium oxide 21 Apparent specific gravity 1.0, viscosity SOO voids (in this case Φ) are manufactured by Showa Kobunshi Co., Ltd. Product name Vinyroll 2202 (Chlorobrene synthetic rubber) Manufactured by Hitachi Kasei 1 Shiba Co., Ltd. Nispel 1811 (polyester resin) (d) can be manufactured by Titan Kogyo Co., Ltd. under the trade name KA1g. Example 1-8 (a) 10% by weight gold-coated copper powder by gold plating with an average particle size of 15μ 0) Polymer resin binder capable of thermocompression bonding 55 1 (0) Solvent Isophorone 80 1 Xylene 71 (d) Extender pigment Calcium carbonate 11 In this case (b)
(+1) is manufactured by Toyobo Co., Ltd. under the trade name Vylon 20S8 (polyester resin 9) manufactured by Nippon Polyurethane Co., Ltd. under the trade name Futsuborane 280° (polyurethane resin) (+1) is manufactured by Maruo Calcium Co., Ltd. under the trade name MSK-
o etc. can be used. Examples 2 to 1 (a) Graphite powder with an average particle diameter of 20μ 5% by weight ■) 27% by weight of a thermocompression bondable polymer resin binder (C) Solvent
Isophorone 20 N Diethylcarpitol 15 I Turpentine oil 51 Toluene 15 I (d) Extender pigment Titanium oxide powder 8I (Titan Kogyo)
Co., Ltd. Product name: KA-10) (e) Tackifying resin 1
0 1 Apparent specific gravity 0.9, viscosity 750 poise In this case Φ) Nippon Polyurethane Co., Ltd. Nitsubofun 2802 (polyurethane resin) 1 Nippon Polyurethane Co., Ltd. Nitsuboran 3o22 (polyurethane resin) ' (e) Department-Yo Kagaku Kogyo Co., Ltd. Alcon P-100 (
aliphatic hydrocarbon resin) etc. can be used. Example 2-2 (a) Graphite powder with an average particle size of 10μ 4% by weight Carbon black with a particle diameter of 0.1μ or less 21 (b) Polymer resin binder capable of thermocompression bonding 39% by weight (C) Solvent Cyclohexanone 2o #Xylene 20 N Dioctyl@-Rule-) (D, 01P) 4 1 (d) Extender pigment Calcium carbonate powder 3I (trade name MO-1 manufactured by Maruo Calcium Co., Ltd.) (e) Tackifying resin 81 Apparent Specific gravity 1.1, viscosity 1500 poise In this case Φ) Vylon 20SS (polyester resin) manufactured by Toyobo M Co., Ltd. Vylon S OSS (polyester resin) manufactured by Toyobo Co., Ltd. (0) Alcon P manufactured by Kagaku Kogyo Co., Ltd. -100 (aliphatic hydrocarbon resin) Nicarp-L (hydrocarbon resin) manufactured by Mitsubishi Gas Chemical Co., Ltd., etc. can be used. Example 2-3 (a) Graphite with an average particle size of 10μ Powder 10% by weight ■) Polymer resin binder capable of thermocompression bonding 29.5 Overlapping part (C) Solvent Butyl O cellosolve acetate 20 1n-hexane 20 1 Xylene 15 p (d) Extender pigment Calcium carbonate powder 0.5 1 (Product name MSK-1 manufactured by Maruo Calcium Co., Ltd.) (e) Tackifying resin 51 Apparent specific gravity 1.0, viscosity 1800 poise In this case ■) Showa Neoprene Co., Ltd. Neoprene WR'l'' (Chloroprene rubber ) Showa Neoprene Co., Ltd. Neoprene WD (chloroprene rubber) (d) Freezing Oil Industry Co., Ltd. ys resin #1150 (
ys resin #1000 (terpene resin) manufactured by Frozen Oil Industry Co., Ltd. can be used. Example 2-4 (a) Silver powder with an average particle size of 15μ 20% by weight ■) Polymer resin binder capable of thermocompression bonding 29% by weight (○) Solvent Isophorone 20'z xylene 20 1 Methyl ethyl ketone 5 # (d) Extender pigment titanium oxide powder 11 (Titan Kogyo)
Co., Ltd., product name KA-85) (e) Tackifying resin 5
(b) Sumitomo Chemical Co., Ltd. Sumitate HA-20 (ethylene-vinyl acetate copolymer) Sumitomo Chemical Co., Ltd. Sumiti) HE-10 (ethylene-vinyl acetate copolymer)
Vinyl acetate copolymer) (8) Nippon Zeon Co., Ltd. Finton A-100 (aliphatic petroleum resin), etc. can be used. Example 2-5 (a) Graphite powder with an average particle size of 10μ 7 Jt% Palladium powder with an average particle size of 5μ 81 (b) Polymer resin binder capable of thermocompression bonding 29 z (○)
Solvent Butyl cellosolve acetate 20% by weight
n-hexane 20 xylene 15 r ((1) Extender pigment titanium oxide powder l # (Titan Kogyo Co., Ltd. product name KA-10) (8) Tackifying resin 5 # Apparent specific gravity 1.0, viscosity 18OO Boys In this case (b) Showa Neobrene Co., Ltd. Neoprene WRI (chloroprene rubber) Showa Neobrene Co., Ltd. Neoprene WD (chloroprene rubber) (8) Freeze Oil Industry Co., Ltd. YS Resin #1150 (terpene resin) Freeze Oil Industry Co., Ltd. Co., Ltd. YS Resin #1000 (terpene resin), etc. can be used. Example 2-6 (a) 75% by weight gold cord nickel powder by gold plating with an average particle size of 15μ (b) Polymer resin bonding that can be bonded by thermocompression Agent 50% by weight (C
) Solvent Isophorone 2o I Diethylcarpitol 7 #Xylene, 5,5 1 (d) Extender titanium oxide 2,5 (e) Tackifier resin 7.5I In this case, (b) is Showa Kobunshi Co., Ltd. ) manufactured by Showa Kobunshi Co., Ltd. (trade name: Vinyroll 2200) manufactured by Showa Kobunshi Co., Ltd. (trade name: Vinyroll KBX-0161) (
Polyester resin] (d) is manufactured by Titanium Kogyo Co., Ltd., with the product name KA-85 (e
) is manufactured by Buyo Kagaku Kogyo Co., Ltd. under the trade name Alcon P-10.
0 (aliphatic hydrocarbon resin), etc. can be used. The effects of the present invention are such that the above-mentioned objects of the present invention are fully achieved, and electrical connections between terminals of electrical components and electronic devices can be made in a simple process while maintaining high reliability using a single heat-sealing composition. can do. It is extremely useful in industry. 4. Brief Description of the Drawings Figure 1 is a schematic perspective view showing an enlarged example of the use of a conductive anisotropic heat sealing composition according to an embodiment of the present invention, and Figure 2 is a schematic perspective view showing an example of the use of a conductive anisotropic heat sealing composition according to an embodiment of the present invention. 3 is an enlarged schematic cross-sectional view of a connector part in which a composition layer according to an example is adhered between desired ends; FIG. 3 is an enlarged view of a connector part in which a composition layer shown in FIG. It is a cross-sectional schematic diagram shown in FIG. 1... Printed circuit board (POB) 2... Conductor terminal 8... Liquid crystal display tube (LOD) 4... Electrode terminal 5. 6... Corresponding conductor (i.e., conductor to be thermocompressed) 7... Adhesive layer of composition 8... Conductive anisotropic heat seal layer

Claims (1)

[Claims] t (conductive fine powder consisting of one kind of graphite powder, silver powder, copper powder, nickel powder with a1 particle size of 0.5 to 40μ, and carbon black powder with a particle size of 0°1μ or less, or 28I or more) 0.5 to 20% by weight, and (b) thermocompression adhesive polymer binder 5
~60% by weight, and (C) isophoro/, diacetone alcohol, methyl isobutyl ketone, xylene, toluene,
A suspension of voids with an apparent specific gravity of 0.7 to 2.0 and a viscosity of 50 to 150 O dissolved in 30 to 900 to 90 weight of one or more of diethyl calpitol and cellosolve acetate and uniformly decomposed. A conductive anisotropic heat sealing composition comprising a liquid (a+b+c). 2. The thermocompression-adhesive polymer binder (b) is one or more of chloroprene-based synthetic rubber, ethylene-vinyl acetate copolymer resin, polymethyl methacrylate resin, polyester resin, polyamide resin, and polyurethane resin. The electrically conductive anisotropic heat-sealing composition according to claim 1, characterized in that: &(a) Conductive fine powder consisting of one or more of graphite powder, silver powder, copper powder, nickel powder with a particle size of 0.5 to 40μ, and carbon black powder with a particle size of 0.1μ or less.
5 to 20% by weight, and (b) a thermocompression bondable polymeric binder 5 to 6
0% by weight, and (C) 80 to 90% by weight of a solvent consisting of one or more of isophorone, diacetone alcohol, methyl isobutyl ketone, xylene, toluene, diethylcarpitol, and cellosolve acetate, and further (d
) Mixed and dissolved with 0.5-15% by weight of tackifier and uniformly dispersed, apparent specific gravity 0.7-2°0, viscosity 50-1
A conductive anisotropic heat sealing composition comprising a suspension of 500 voids (a+b+c+a). Melon The thermocompression adhesive polymer binder (bl is one or more of chloroprene-based synthetic rubber, ethylene vinyl acetate copolymer resin, polymethyl methacrylate resin, polyester resin, polyamide resin, and polyurethane resin) - Conductive anisotropic heat sealing composition according to claim 8, characterized in that the tackifier (di is one or both of terpene resin and aliphatic hydrocarbon resin) The conductive anisotropic heat-sealing composition according to claim 8, characterized in that: a (a) graphite powder, silver powder, copper powder, nickel powder with a J particle size of O05 to 40μ, and 0.1μ or less Conductive fine powder consisting of one or more types of carbon black powder 0
．． 5 to 20% by weight, and (b) thermocompression adhesive polymer binder 5 to 20% by weight.
60% by weight and (C) 30 to 90% by weight of a solvent consisting of one or more of isophorone, diacetone alcohol, methyl isobutyl ketone, xylene, toluene, diethylcarpitol, and cellosolve acetate are mixed and dissolved (a+b+c). L, uniformly dispersed and apparent specific gravity 0.7
A method for producing a conductive anisotropic heat sealing composition, which comprises adjusting the composition to a suspension having a viscosity of 50 to 1,500 voids and a viscosity of 50 to 1,500 voids. I The thermocompression adhesive polymer binder (b) is one or more of chloroprene-based synthetic rubber, ethylene vinyl acetate copolymer resin, polymethyl methacrylate resin, polyester resin, polyamide resin, and polyurethane resin. 7. The method for producing a conductive anisotropic heat-sealing composition according to claim 6. & (a) Conductive fine powder 0.5 consisting of one or more of graphite powder, silver powder, copper powder, nickel powder with a particle size of 0.5 to 40μ, and carbon black powder of 0.1u or less
~20% by weight and (bll thermocompressible polymeric binder 5~6
Solvents 30-9 consisting of one or more glazes of military sophorone, diacetone alcohol, methyl isobutyl ketone, xylene, toluene, diethylcarpitol and cellosolve acetate. % by weight and are uniformly dispersed with an apparent specific gravity of 0.
．． 7-2.0, a suspension with a viscosity of 50-1500 poise (a
A conductive anisotropic heat-sealing composition consisting of 10 + c) is provided with a plurality of conductive strip layers having a minimum mutual insulation width of 0.05 mm to be electrically connected and conductive. After coating and depositing an adhesive layer on one surface of at least one of both terminal areas of a desired electrical component, the two terminal areas are overlapped so that the conductive strip layers are electrically conductive with each other. In total, temperature 70-250℃, pressure 1-7
5kg/. A method of using a conductive anisotropic heat-sealing composition, characterized in that the both terminal areas are crimped by heating and pressurizing at L2. 9. The thermocompression adhesive polymer binder (b) is one or more of chloroprene-based synthetic rubber, ethylene vinyl acetate copolymer resin, polymethyl methacrylate resin, polyester resin, polyamide resin, and polyurethane resin. A method of using the electrically conductive anisotropic heat sealing composition according to claim 8.