JPS619342B2 - - Google Patents
Info
- Publication number
- JPS619342B2 JPS619342B2 JP58228457A JP22845783A JPS619342B2 JP S619342 B2 JPS619342 B2 JP S619342B2 JP 58228457 A JP58228457 A JP 58228457A JP 22845783 A JP22845783 A JP 22845783A JP S619342 B2 JPS619342 B2 JP S619342B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22845783A JPS60133054A (en) | 1983-12-05 | 1983-12-05 | Composition for conductively anisotropic heat sealing, its manufacture and its usage |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22845783A JPS60133054A (en) | 1983-12-05 | 1983-12-05 | Composition for conductively anisotropic heat sealing, its manufacture and its usage |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60133054A JPS60133054A (en) | 1985-07-16 |
JPS619342B2 true JPS619342B2 (en) | 1986-03-22 |
Family
ID=16876785
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22845783A Granted JPS60133054A (en) | 1983-12-05 | 1983-12-05 | Composition for conductively anisotropic heat sealing, its manufacture and its usage |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60133054A (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2602237B2 (en) * | 1987-07-24 | 1997-04-23 | 株式会社日立製作所 | Liquid crystal display |
JP2509804B2 (en) * | 1994-07-22 | 1996-06-26 | シャープ株式会社 | Display device |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4997062A (en) * | 1972-12-26 | 1974-09-13 | ||
JPS51109936A (en) * | 1975-03-25 | 1976-09-29 | Suwa Seikosha Kk | Dodenihoseiomotsu setsuchakuzai |
JPS5212500A (en) * | 1975-07-18 | 1977-01-31 | Nittan Co Ltd | Producing method of electrical insulation compound |
JPS5241648A (en) * | 1975-09-30 | 1977-03-31 | Seikosha Co Ltd | Conductive adhesives |
JPS5349295A (en) * | 1976-10-16 | 1978-05-04 | Nippon Kokuen Kogyo Kk | Conductive heat seal composition* method of manufacture thereof* and method of use thereof |
JPS55774A (en) * | 1979-05-01 | 1980-01-07 | Seikosha Co Ltd | Electrically conductive adhesive part and its use |
JPS57208002A (en) * | 1981-06-18 | 1982-12-21 | Shinetsu Polymer Co | Thermal pressure conductive composition |
-
1983
- 1983-12-05 JP JP22845783A patent/JPS60133054A/en active Granted
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4997062A (en) * | 1972-12-26 | 1974-09-13 | ||
JPS51109936A (en) * | 1975-03-25 | 1976-09-29 | Suwa Seikosha Kk | Dodenihoseiomotsu setsuchakuzai |
JPS5212500A (en) * | 1975-07-18 | 1977-01-31 | Nittan Co Ltd | Producing method of electrical insulation compound |
JPS5241648A (en) * | 1975-09-30 | 1977-03-31 | Seikosha Co Ltd | Conductive adhesives |
JPS5349295A (en) * | 1976-10-16 | 1978-05-04 | Nippon Kokuen Kogyo Kk | Conductive heat seal composition* method of manufacture thereof* and method of use thereof |
JPS55774A (en) * | 1979-05-01 | 1980-01-07 | Seikosha Co Ltd | Electrically conductive adhesive part and its use |
JPS57208002A (en) * | 1981-06-18 | 1982-12-21 | Shinetsu Polymer Co | Thermal pressure conductive composition |
Also Published As
Publication number | Publication date |
---|---|
JPS60133054A (en) | 1985-07-16 |