JPH10116640A - Connection structure for circuit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a connection structure excellent in initial and long period connection reliability for various material circuits including a circuit having a surface contamination layer. SOLUTION: A circuit connection structure is formed by electrically connecting confronting-formed connection circuits via conductive particles mixed in insulating adhesive 5. In the connection structure, the conductive particles are made of mixture of particles which are formed by substantially coating high molecular core material surfaces with metal thin layers 2 and metal particles 4 which have higher rigidity than that of the high molecular core material 1, and coated particles 3 and the main metal component of the metal particles 4 are put in connection by connection members made of at least one kind or more of common materials.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connection circuit for connecting circuits such as an integrated circuit, a liquid crystal display panel or an EL display panel, and connection terminals to other necessary electric members.

[0002]

2. Description of the Related Art As electronic components have become smaller and thinner, circuits used in them have become higher in density and higher in definition. Since connection of these fine circuits is difficult to handle with conventional solder or rubber connectors, recently, anisotropic conductive adhesives and film-like materials (hereinafter referred to as connection members) have been frequently used. . In this method, a connection member layer made of an adhesive containing a predetermined amount of conductive particles is provided between opposing circuits, and a pressurizing or heating pressurizing means is provided, so that electrical connection between the circuits can be performed simultaneously. An insulating property is given to the adjacent circuit, and the opposing circuits are bonded and fixed. However, in this method, the continuity between the circuits is mainly obtained by contact of a plurality of conductive materials, often metal particles. The contact area between them is not enough. Further, since the coefficient of thermal expansion of the metal particles is generally about one order of magnitude smaller than that of the adhesive, for example, at a high temperature, the amount of expansion of the metal particles is smaller than that of the adhesive, and follows the change in the gap of the connection circuit. (Hereinafter referred to as followability with respect to temperature change), the contact area and the number of contact points of the metal particles with the circuit are reduced, resulting in an increase in connection resistance and poor conduction. That is, when metal particles are used as the conductive particles, even if the initial connectivity is obtained, there is a defect that the long-term reliability including the temperature change is inferior.

The inventors of the present invention have previously proposed a method for solving the drawbacks when using the above-mentioned metal particles and remarkably improving the reliability.
A method using conductive particles (hereinafter referred to as coated particles) in which the surface of a polymer nucleus is substantially covered with a thin metal layer has been proposed (Japanese Patent Application Laid-Open No. Sho 62-188184). According to this method, a sufficient contact area can be obtained because the conductive particles are appropriately deformed so as to be pressed between circuit surfaces or between the conductive particles by pressurization or heating and pressurization at the time of circuit connection. Since the core material has a rigidity and a thermal expansion / shrinkage characteristic very close to those of the adhesive compared to the metal particles, the core material has a follow-up property to a temperature change, so that the connection reliability can be remarkably improved.

[0004]

The above-mentioned invention shows excellent connection reliability for many circuits, but the circuit surface has C
It has recently been found that in the case of r, Al, solder and the like, the connection resistance, especially the initial resistance, is high and the reliability of the connection part may be insufficient. After examining the above problems, these circuit surfaces are liable to form a contaminant layer such as an adsorption layer for water and the like and an oxidized layer. It was found that the cause was that the layer could not be penetrated and sufficient contact with the pure metal could not be obtained. It is known that most metals have a surface oxide layer of several Angstroms to several hundred Angstroms in air, and the oxide layer generally has lower conductivity or insulating properties than pure metal. Will be shown. The present invention provides a circuit connection structure having excellent connection reliability even for a contaminant layer, particularly a circuit whose surface is easily oxidized.

[0005]

That is, the present invention provides a connection structure of a circuit in which connection circuits formed facing each other are electrically connected via conductive particles mixed in an insulating adhesive. In, the conductive particles comprise a mixture of particles substantially covering the surface of the polymer nucleus material with a thin metal layer and metal particles having higher rigidity than the polymer nucleus material, the coated particles and the metal particles The present invention relates to a circuit connection structure characterized by being connected by a connection member made of at least one kind of common material without a main metal component.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings showing embodiments. 1A to 1D are schematic cross-sectional views of a connecting member according to the present invention. The connecting member is a composite particle 3 in which the surface of a polymer core material 1 is substantially covered with a thin metal layer 2 and a metal particle 4 are compounded in an insulating adhesive 5 and dispersed in a predetermined amount. The connecting member made of these is formed on a separator 6 that can be peeled off as necessary. At this time, basically, both the coating particles 3 and the metal particles 4 are singly or combined (aggregated) to connect the circuits. Specifically, the particle size is as shown in FIG.
As shown in FIG.
As shown in FIG.
This is possible because the coated particles 3 have a deformability at the time of connection because there is a bite into the circuit surface. Further FIG.
In the case where the coated particles 3 <the metal particles 4 as shown in (c), the present invention can be applied as long as the coated particles 3 are present in an aggregated state and the aggregate diameter is equal to or larger than the particle diameter of the metal particles 4. The coating particles 3 and the metal particles 4 may be independent, or both may be agglomerated as shown in FIG. It is more preferable that the coating particles 3 and the metal particles 4 are forcibly attached to each other by a thin layer of an adhesive or an adsorbent. FIGS. 1A and 1D show the optimum state from the viewpoint of improving the reliability. It is necessary that the particle diameter of these conductive particles be smaller than the insulation width (space) of the circuit to be connected in order to maintain the insulation with the adjacent circuit. Further, addition of insulating particles smaller than the above-described particle size of the conductive particles is also preferable because the insulating property with the adjacent circuit is maintained.

The total amount of the coating particles 3 and the metal particles 4, that is, the amount of the conductive particles added is 0.1 to 15% by volume, preferably 0.5 to 10% by volume, based on the solid content of the insulating adhesive 5. , Coated particles 3 based on the total amount of coated particles 3 and metal particles 4
Accounts for 5 to 95%, preferably 25 to 95% by volume
It is. When the content of the conductive particles is 0.1% by volume or less, satisfactory conductivity cannot be obtained, and when the content is 15% by volume or more, the chances of the particles being connected in the plane direction increase, so that the insulation with the adjacent circuit decreases. It is not preferable. The addition amount of the metal particles is important for constituting the present invention, but the effect can be exhibited in a relatively wide range. The constituent materials according to the present invention will be described below. The coated particles 3 are basically particles having a particle diameter of 1 to 50 μm, in which the surface of the polymer core material 1 is substantially covered with the thin metal layer 2. The polymer core material 1 may be any of a completely solid body, a foam having bubbles therein, a hollow body having a gas inside, an aggregate forming a core material by a collection of small particles, and the like. Can be used.

The shape of the polymer core material is typically substantially spherical, but the shape is not particularly limited. Polymer core material 1
Examples of the material include various plastics such as polystyrene and epoxy resin, rubbers such as styrene-butadiene rubber and silicone rubber, and natural polymers such as starch and cellulose. And additives such as antioxidants. These polymer core materials are already commercially available for use as fillers for chromatograms, standard particles, cosmetics, and the like, for example, from Toyo Soda Kogyo Co., Ltd., Nippon Synthetic Rubber Co., Ltd., Toray Co., Ltd., and Kanebo Co., Ltd. And available. As the thin metal layer 2, various metals, metal oxides, alloys, and the like having conductivity are used. Examples of metal elements include Zn, Al, S
b, Au, Ag, Sn, Fe, Cu, Pb, Ni, P
d, Pt, etc., which can be used alone or in combination. Further, for special purposes such as adjustment of hardness and surface tension and improvement of adhesion, Mo, Mn, and the like can be used.
Other elements and compounds such as Cd, Si, and Cr can also be added. From the viewpoints of conductivity and corrosion resistance, Ni, Ag,
Au, Sn, and Cu are preferably applicable, and they can also be formed as a single layer or multiple layers. As a method of forming a coating layer using these, a vapor deposition method, a sputtering method, an ion plating method, a dry method such as a thermal spraying method, or a plating method can be applied. An electroless plating method capable of obtaining a coating layer is preferred. The thickness of the coating layer is 0.01-5 μm
m can be applied, but 0.05 to 1.0 μm is preferable. Here, the thickness includes, for example, a metal base layer, if any.

If the thickness of the coating layer is small, the conductivity is reduced, and if the thickness is increased, the polymer core material is hardly deformed at the time of circuit connection, so that the contact area with the circuit is undesirably reduced. The particle size of the coating particles 3 is 0.5 to 50 μm. If the particle size is 0.5 μm or less, the number of the filled particles increases, and the adhesion area with the circuit is substantially reduced. Since this is lost, it is not preferable in measuring the resolution of the connecting member. The particles can exist independently or aggregated in the connecting member. The metal particles 4 have a particle size of 0.01 to 50 μm, and are selected from particles having higher rigidity and higher corrosion resistance than the polymer core material 1 at the time of circuit connection. When the particle diameter is 0.01 μm or less, the ability to break through the contaminant layer on the circuit surface is lacking, which is not suitable for the practice of the present invention. When the particle diameter is 50 μm or more, insulation is lost when particles exist between adjacent circuits. Not preferred. The preferred range of the particle size is 0.03 to 30 μm. The shape of the metal particles is preferably spherical, but is not particularly limited. A particularly preferred shape is one having a large number of protrusions and irregularities on the surface of the particle, and the shape and high rigidity increase the ability to penetrate the contaminated layer on the circuit surface. These metal particles include Zn, Al, Sb, U, C
d, Ga, Ca, Au, Ag, Co, Sn, Se, F
e, Cu, Th, Pb, Ni, Pd, Be, Mg, Mn
These can be used alone or in combination. Further, these metals can be formed into two or more layers by plating or the like. Since the above metal particles have excellent corrosion resistance and are easily available,
i, Ag, and Au can be preferably applied. In addition, as the non-deformable particles of the present invention, in addition to the above-described metal particles, a composition that has a higher rigidity at the time of connection than the polymer core material and is less deformable than the coated particles, such as glass, ceramic, and alumina. It is also possible to use particles having a core formed of an inorganic material or a high-rigidity polymer material and having a conductive film formed on the surface by metal plating or the like. Further, as exemplified above, the main metal component of the coating particles and the metal particles is at least one.
Ni, Ag, and Au are particularly preferable in terms of conductivity and corrosiveness.

As the insulating adhesive 5 used in the present invention, there can be basically applied the compounding used for ordinary adhesive sheets having insulating properties. The components of the adhesive include a polymer that imparts cohesion, and other optional tackifiers, tackifiers, crosslinking agents, antioxidants, dispersants, and the like. These polymer species include ethylene-vinyl acetate copolymer, modified ethylene-vinyl acetate copolymer, polyethylene, ethylene-propylene copolymer, ethylene-acrylic acid copolymer, ethylene-acrylic ester copolymer, ethylene -Acrylate copolymer, acrylate rubber, polyisobutylene, atactic polypropylene, polyvinyl butyral, acrylonitrile-butadiene copolymer, styrene-butadiene block copolymer, styrene-isoprene block copolymer, polybutadiene, Ethyl cellulose, phenoxy, polyester, epoxy, polyamide, polyurethane, natural rubber, silicone rubber, synthetic rubbers such as polychloroprene, polyvinyl ether, etc. can be applied, alone or in combination of two or more. Used in. Examples of the tackifier include dicyclopentadiene resin, rosin, modified rosin, terpene resin, xylene resin, terpene-phenol resin, alkylphenol resin, coumarone-indene resin, and the like. These are used in combination.
Representative examples of the tackifier include various plasticizers such as dioctyl phthalate. Crosslinkers are used when it is necessary to increase the cohesion of the polymer and are polyfunctional substances that react with the functional groups of the polymer, such as polyisocyanates, melamine resins, urea resins,
Examples include phenolic resins, amines, acid anhydrides, peroxides, and the like, and benzophenone, benzoquinone, and the like may be used as a sensitizer in the case of photocurability. Anti-aging agents are used when it is necessary to enhance the stability of the polymer binder against heat, oxygen, light, etc., for example, stabilizers such as metal soaps and antioxidants such as alkylphenols And benzophenone-based and benzotriazole-based ultraviolet absorbers, etc., and if necessary, used alone or in combination of two or more. The dispersant may be used for improving the dispersibility of the conductive particles. Examples of this include a surfactant, which can be used alone or in combination of two or more of nonionic, cationic, anionic and amphoteric.

The method of manufacturing the connecting member according to the present invention includes dissolving an adhesive composition comprising a polymer and other additives used as necessary in a solvent, or dispersing the adhesive composition in a medium in a suspended state, or After being melted into a liquid by heat melting, the conductive particles are mixed by an ordinary dispersion method such as a ball mill or a stirrer to obtain a conductive particle mixed adhesive composition. When a solvent is used, the solvent can be used because the conductive particles having the metal layer formed on the polymer core material have almost no solubility in the solvent, but it is possible to use a solvent. More preferably, a solvent that does not dissolve is selected. As this means, for example, it is a good method to emulsify the adhesive and disperse the conductive particles in an aqueous medium. The conductive particle-mixed adhesive composition may form a connection member layer directly on a circuit using screen printing or a roll coater on one or both circuits requiring connection, May be used as a continuous long body. In order to obtain an adhesive film as a continuous elongated body, the connecting member layer may be continuously wound after forming the connecting member layer on the separator which has been subjected to a peeling treatment as necessary on paper or a plastic film. When the adhesive layer does not have tackiness, it is possible to wind without using a separator, and for reinforcing the adhesive, for example, a core material such as a nonwoven fabric can be used. When a solvent or a dispersion medium is contained in the adhesive composition in the above-mentioned manufacturing method, an adhesive film having conductive particles having a denser arrangement in the thickness direction is obtained by utilizing the volume shrinkage phenomenon in the thickness direction when the solvent is dried. In hot-melt coating in the absence of a solvent, it is possible to prevent environmental pollution caused by the solvent during the production. The thickness of the adhesive film is relatively determined in consideration of the particle size of the conductive particles and the characteristics of the connection member, and is preferably 1 to 100 μm. If it is 1 μm or less, sufficient adhesiveness cannot be obtained, and if it is 100 μm or more, it is not practical because a large amount of conductive particles must be mixed in order to obtain sufficient conductivity. From this reason, a more preferable thickness is 5 to 50 μm.

The adhesive film thus obtained has considerable transparency. When the adhesive film has transparency, the quality can be easily filled at the time of production and the appearance can be improved. Further, in the bonding of display elements and the like, it is possible to adopt a configuration in which the adherend can be seen through. As a method of connecting a circuit using the obtained adhesive film, for example, if there is a separator in a state where the adhesive film is temporarily attached to the circuit, the separator is peeled off, or the adhesive composition is applied on the circuit. If necessary, after removing the solvent,
Another circuit to be connected may be attached to the surface by a hot press or a heating roll. FIGS. 2A to 2D schematically show a state in which circuits are connected by such a method. The adhesive 5 softens and flows due to heat and pressure, and the coated particles 3 also soften and deform and come into contact with each other. Therefore, both circuits7.
Conductive bonding between the 7's becomes possible. At this time, metal particles 4
Can break through the contaminant layer present on the surface of the circuit 7 and come into contact with the circuit 7, so that good circuit connection can be obtained. The operation of each constituent material according to the present invention will be described. The insulating adhesive bonds the connection circuits (in the thickness direction) together and acts as an insulating material between adjacent circuits (in the surface direction). The conductive particles provide electrical connection between the connection circuits, and between adjacent circuits (insulated circuit portion) is generally concave compared to the circuit surface and is not applied as much pressure as between the connection circuits.
The particle size is less than 50 μm smaller than between adjacent circuits,
Insulating properties are maintained by adding 0.5 to 15% by volume of the particles to prevent connection of the particles in the plane direction.

At this time, in the present invention, particles having deformability and particles having no deformability are used in combination by pressurization or heating and pressurization at the time of circuit connection as conductive particles, so that circuits of various materials can be initially used. It is possible to obtain a lower connection resistance value and a long-term connection reliability. In other words, metal particles do not soften and deform as compared to adhesives or coated particles due to pressure or heat and pressure during circuit connection, so they penetrate into contaminant layers such as metal oxide layers on the circuit surface and become pure metal layers of the circuit. And excellent electrical conductivity, particularly in the initial state. On the other hand, the coated particles, in which the surface of the polymer core material is substantially covered with a thin metal layer, are softened by heating, pressurizing, or heating / pressing during circuit connection because the metal is a thin layer. Alternatively, it can be deformed and can be appropriately deformed so as to press against the circuit surface or between the particles, thereby keeping the contact area large.
Also, since the metal is a thin layer, the coefficient of thermal expansion of these particles can be approximated to that of the adhesive, so they have the ability to follow the temperature change and maintain a large contact area. Reliability is obtained. In addition, as the conductive particles, by using a composite of coated particles and metal particles in which the surface of the polymer nucleus material is substantially covered with a thin metal layer, metal particles having excellent rigidity can be subjected to pressure during connection or pressure. It is also conceivable to act as an abrasive by heating and pressing to create a fresh surface of the particle surface or circuit surface, or to destroy a thin insulating adhesive layer existing on the contact surface. This process is performed in a substantially oxygen-free atmosphere that is closed to the outside world with an adhesive and a circuit, similar to the phenomenon of biting into the contaminated layer described above. Become. In addition, it is conceivable that the metal particles may partially break the thin metal layer of the coated particles to reach the polymer core material, but in this case, the influence of the metal layer is reduced and the particles can thermally expand freely, Since the difference in displacement between the adhesive and the coated particles during thermal expansion and contraction is reduced and the ability to follow a temperature change is improved, the connection reliability is further improved. In addition, the contact area increases at the interface between metal particles, because part of the metal particles are pressed into the surface of the contaminated layer or the coated particles by pressurization or heating and pressurization when connecting the circuit. Therefore, it is considered that it also has the effect of improving reliability.

[0014]

EXAMPLES The present invention will be described in more detail with reference to Examples. Beauty Examples 1 to 13 and Comparative Examples 1 and 2 (1) Preparation of Insulating Adhesive Solution The following adhesive was mixed and dissolved to obtain an adhesive solution having a solid content of 20%. Clayton G-1650 (Styrene-ethylene-butylene-styrene type block polymer, trade name, manufactured by Shell Chemical Co., Ltd.) 60 weight capitalized Clearon P-120 (hydrogenated terpene resin, trade name, manufactured by Yasuhara Yushi Co., Ltd.) 40 weight parts Toluene 40 weight parts (2) Preparation of coated particles Univex C type (spherical phenol resin, trade name of Unitika Ltd.) was classified as a polymer core material using a microsieve, Particles having an average particle size of 5, 10, 25, and 50 μm were obtained. Using these particles, pretreatment is performed by the following method, and then electroless plating of Ni is performed, followed by displacement plating of Au so that the thickness of the coating layer is Ni 0.3 μm / Au.
Coated particles having a multilayer structure of 0.05 μm were produced. (B) Pretreatment The polymer core material is forcibly stirred in methyl alcohol,
Pretreatment was performed for both degreasing and roughening, and then methyl alcohol was separated by filtration. (B) Activation Next, circuit prep 3316 (PdCl + HCl +
An SnCl 2 -based activation treatment solution (trade name, manufactured by Nippon Electroplating Engineers Co., Ltd.)
The activation treatment was performed by stirring at 5 ° C. for 20 minutes.
Thereafter, washing with water and filtration were performed. (C) Electroless Ni Plating The particles after the activation treatment were immersed in a Blue Schumer (electroless Ni plating solution, bath capacity: 300 μdl, trade name, manufactured by Nippon Kanigen) solution and subjected to forced stirring at 90 ° C. for 50 minutes. After a predetermined time, it was washed with water. The plating solution amount was calculated from the surface area of the particles. (D) Electroless Au plating Au displacement plating was performed on the surface of the Ni-coated particles obtained above. The plating solution is Lectro Respreb (Electroless Au plating solution, trade name of Japan Electroplating Engineers Co., Ltd.), which is subjected to a plating treatment at 90 ° C. for 30 minutes, and then thoroughly washed with water, Then, drying was performed at 90 ° C. for 2 hours.

(3) Metal Particles The following four types of metal particle particles were used. (A) 0.05 μm average particle size, Ni in gas evaporation method, manufactured by Vacuum Metallurgy Co., Ltd. (b) 2 μm average particle size, Ni carbonyl, Inc.
(C) Average grain diameter 2.5 μm, (b) 0.1 μm A
Formation of u-plated layer (d) Atomized Ni with an average particle size of 25 μm, manufactured by Mitsui Kinzoku Kogyo Co., Ltd. Au plating of (c) was similarly prepared using the same Au plating solution as in the previous section. (4) Preparation of connection member The above-mentioned (1) to (3) were mixed in a predetermined amount (solid content mixing ratio, details are shown in Table 1), and a separator (silicone-treated polyester film, 58 μm in thickness) was mixed with a bar coater.
m) and dried at 100 ° C. for 5 minutes to produce a connection member having a predetermined dried thickness (see Table 1). (5) Circuit connection Line width 0.1 mm, pitch 0.2 mm, thickness 35 μm
A connection member cut into a 3 mm adhesive width and a 100 mm length is placed on a flexible circuit board (FPC) having a total circuit width of 100 mm having a Cu circuit of 150 ° C. and 2 kg / cm −
An FPC with a connecting member was obtained by heating and pressing for 5 seconds. Thereafter, the separator is peeled off, and the circuit is aligned under a microscope with another transparent conductive glass having the same pitch (a Cr circuit and an ITO circuit is also used for some comparisons, glass thickness: 1.1 mm), and is subjected to 150 ° C. -30kg / cm-20
The circuit was connected by heating and pressing for 2 seconds. (6) Evaluation method Table 1 shows the measurement results of the connection resistance before and after the thermal shock test of the connection body of the circuit obtained as described above. The connection resistance was measured using a multimeter (TR-6877, manufactured by Advantest Co., Ltd.), and the average value of the connection resistance of 500 samples was displayed. Thermal shock test is -40 ° C / 30min-10
300 cycles were performed with 0 ° C./50 minutes as one cycle. The insulation resistance between adjacent circuits was as good as 10Ω or more.

(7) Results It was found that each of the examples exhibited good initial and post-heat shock test connection resistance to the Cr circuit. Since the thermal shock test is the most severe test in the reliability evaluation,
It turns out that it has good reliability. Comparative Example 1 shows the case of only the coated particles. In the case of the ITO circuit, a good connection resistance was exhibited both at the initial stage and after the thermal shock test.
In the Cr circuit, the initial resistance is as high as 50Ω. On the other hand, Comparative Example 2 is a case of using only metal particles. Although good initial resistance is obtained in both the ITO and Cr circuits, the resistance increase after the thermal shock test is large. In Examples 9 to 11 in which the conductive particles of Comparative Examples 1 and 2 were used in combination, good reliability was obtained for both the Cr and ITO circuits after the initial low resistance and thermal shock tests. In addition, when the cross section of the connection part was observed with a scanning electron microscope, in Examples 1 to 4, as schematically shown in FIG. The metal particles were present around the coated particles and between the circuit surface. Similarly, FIG. 2C in Example 5, FIG. 2B in Example 6, and FIG. 2A in Examples 6 to 8 and Example 12 exist.

Examples 14 to 16 (1) Preparation of Insulating Adhesive The following components were mixed and stirred to prepare an adhesive solution having a solid content of 29%. Nipol 1032 (Nitrile rubber, trade name, manufactured by Nippon Zeon Co., Ltd.) 50 parts by weight HITANOL 2400 (alkylphenol resin, trade name manufactured by Hitachi Chemical Co., Ltd.) 20 parts by weight Epicoat 1002 (bisphenol epoxy resin) ,
Yuka Shell Epoxy Co., Ltd.) 30 parts by weight Cureazole 29Z (2-phenylimidazole, trade name of Shikoku Chemicals Co., Ltd.) 5 parts by weight Irganox 1010 (phenolic antioxidant, Ciba-Geigy product name) 1.0 weight group Mark CDA-6 (decamethylenedicarboxylic acid disalicyloyl hydrazide, trade name of Adeka Argus Co., Ltd.)
0.5 parts by weight Methyl ethyl ketone 250 parts by weight (2) Coated particles As coated particles, fine pearl (spherical polystyrene resin, trade name, manufactured by Uchiyu Chemical Industry Co., Ltd.) is sieved using a micro sieve to a sieve of 3 μm. A pass product was obtained and further separated by sedimentation to obtain particles having an average particle diameter of 1 μm and a sieve of 16 μm on
Two types of particles having an average particle diameter of 20 μm of a 5 μm pass product were obtained.
After the same pretreatment as in Examples 1 to 15, Ni electroless plating was performed using these particles at 90 ° C. for 30 minutes while dispersing and stirring the particles in a plating solution described below. The thickness of the plating film was adjusted by calculating the surface area of the particles and the effective Ni component in the plating solution, and adjusting the plating solution concentration. That is, in Examples 14 to 16, the coating layer was a single layer of Ni. Metal particles, circuit connection conditions and evaluation were as in Examples 1 to
Same as 15. However, in this embodiment, post-curing was performed at 150 ° C. for one hour after the circuit was connected. First result
As shown in the table, all showed good reliability. In this example, since a heat-curable adhesive was used, the connection was strong and the reliability was good.

[0018]

[Table 1]

[0019]

As described in detail above, according to the circuit connection structure according to the present invention, as the conductive particles, the particles in which the surface of the polymer nucleus material is substantially covered with the thin metal layer, and the metal particles And the main metal component of the coated particles and the metal particles is made of at least one kind of common metal material, so that it is excellent for circuits of various materials including circuits having a surface contamination layer. In addition, the initial and long-term connection reliability can be obtained.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view showing a supporting member according to the present invention.

FIG. 2 is a schematic sectional view showing a connection state of a circuit using the connection member according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Polymer core material 2 Metal thin layer 5 Coating particle 4 Metal particle 5 Insulating adhesive 6 Separator 7 Circuit

Claims (3)

[Claims] In a connection structure of a circuit in which connection circuits formed opposite to each other are electrically connected via conductive particles mixed in an insulating adhesive, the conductive particles are made of a polymer. The core material comprises a mixture of particles substantially coated with a thin metal layer on the surface thereof and metal particles having higher rigidity than the polymer core material, wherein the coated particles and the main metal component of the metal particles are at least one or more. A connection structure for a circuit, wherein the connection is made by a connection member made of a common material. 2. The circuit connection structure according to claim 1, wherein the average particle size of the coated particles and the metal particles is set to be coated particles ≧ metal particles. 3. The surface of at least one of the connection circuits is C
3. The circuit connection structure according to claim 1, wherein the circuit connection structure is made of r, Al, ITO, or solder.