JPS63237374A - Electric circuit member - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [Industrial application field] TECHNICAL FIELD The present invention relates to electrical circuit members.

[Prior Art] Conventionally, the following techniques are known as techniques related to electric circuit members configured by electrically connecting electric circuit components.

■Wire bonding method.

FIGS. 13 and 14 show typical examples of semiconductor devices connected and sealed by the wire bonding method, and the wire bonding method will be explained below based on FIGS. 13 and 14.

In this method, the semiconductor element 4 is fixedly supported on the element mounting part 2 using Ag paste 3 or the like, and then the connection part 5 of the semiconductor element 4 and the desired connection part 6 of the lead frame l are connected with ultrafine material such as gold. This is a method of electrically connecting using gold m-wires 7.

After connection, the semiconductor element 4 and the lead frame l are sealed using a resin 8 using a method such as a transfer molding method, and then the unnecessary portion of the lead frame l extending outside from the resin-sealed part is cut off. , bend the semiconductor device 9 into the desired shape.
make.

■T A B (Tape Automated Ba
FIG. 15 shows a typical example of a semiconductor device connected and sealed by the TAB method.

This method is an automatic bonding method using a tape carrier method. That is, to explain based on FIG. 15, after positioning the carrier film substrate 16 and the semiconductor element 4, the inner lead part 17 of the carrier film substrate 16 and the connecting part 5 of the semiconductor element 4 are connected by thermocompression bonding. This is the way to do it. After the connection, the semiconductor device 9 is sealed with resins 20 and 21.

■CCB (Controlled Co11apse
Bonding) law (for example, Special Publication Act 1977
(No. 6, Japanese Unexamined Patent Publication No. 60-57944) FIG. 16 shows a typical example of a semiconductor device connected and sealed by the CCD method. This method will be explained based on FIG. 16. Note that this method is also called a flip chip bonding method.

Solder bumps 31 are provided in advance on the connection portion 5 of the semiconductor element 4,
A semiconductor element 4 provided with solder bumps 31 is positioned and mounted on a circuit board 32.

Thereafter, the semiconductor element 4 is connected to the circuit board 32 by heating and melting the solder, and the semiconductor device 9 is manufactured by sealing after washing with flux.

■The method shown in Figs. 17 and m18, that is, an insulating film 71 made of polyimide or the like is formed on a portion of the first semiconductor element 4 other than the connection portion 5, and a metal material 70 made of Au or the like is provided on the connection portion 5. Next, the exposed surfaces 73 and 72 of the metal material 70 and the insulating film 71 are flattened. On the other hand, an insulating film 71° made of polyimide or the like is formed on a portion other than the connection portion 5° of the second semiconductor element 4′, a metal material 70′ made of Au or the like is provided on the connection portion 5′, and then a metal material 70′ made of Au or the like is provided on the connection portion 5′. exposed surface 73° of material 70' and insulation g71',
Flatten 72'.

Thereafter, as shown in FIG. 18, the first semiconductor element 4 and the second semiconductor element 4 degrees are positioned, and after positioning, the connection part 5 of the first semiconductor element 4 is bonded by thermocompression. The connecting portion 5° of the second semiconductor element 4° is connected to metal materials 70, 70.
Connect via '.

■The method shown in FIG. 19, that is, an anisotropic conductive film 78 in which conductive particles 79 are dispersed in an insulating material 77 is interposed between the first circuit substrate 75 and the second circuit substrate 75. , the first circuit substrate 75 and the second circuit substrate 75
After positioning the circuit board at 75°, apply pressure or
The connection portion 76 of the first circuit substrate 75 and the second circuit substrate are heated during pressurization.
This is a method of connecting the connecting portion 76' of the circuit board 75''.

■The method shown in FIG. 20, i.e. 2. An elastic connector in which metal wires 82 such as Fe, Cu, etc. are arranged in a fixed direction in an insulating material 81 between the first circuit substrate 75 and the second circuit substrate 75. After positioning the first circuit base material 75 and the second circuit base material 75' with the intervening circuit board 83, pressure is applied to connect the connecting portion 7 of the first circuit base material 75.
6 and the connecting portion 76' of the second circuit board 75'.

[Problems to be Solved by the Invention] The conventional bonding method described above has the following problems.

■Wire bonding method■ When designing the connecting part 5 of the semiconductor element 4 to be placed inside the semiconductor element 4, the ultra-fine metal wire 7 has an extremely small wire diameter, so the outer peripheral edge 10 of the semiconductor element 4 or the lead This makes it easier to contact the outer peripheral edge 11 of the element mounting portion 2 of the frame l. The ultra-fine metal ia7 covers these outer peripheral edges lO to 1.
If it touches 1, it will short circuit. Furthermore, ultra-fine metal! The length of a7 has to be increased, and if the length is increased, the ultrafine metal wire 7 will be easily deformed during transfer molding.

Therefore, the connecting portion 5 of the semiconductor element 4 needs to be placed around the semiconductor element 4, and is inevitably subject to circuit design limitations.

■In the wire bonding method, in order to avoid contact between adjacent ultra-fine metal wires 7, contact between semiconductor ultra-fine metal wires 7 is required.
Therefore, once the size of the semiconductor element 4 is determined, the maximum number of the connections 5 is necessarily determined.

However, in the wire bonding method, the pitch dimension is usually as large as about 0.2 mm, so the number of connecting portions 5 must be reduced.

■The height h of the ultra-fine gold JiI wire 7 measured from the connection part 5 on the semiconductor element 4 is usually 0.2 to 0.4 mm, but 0.2
Since it is relatively difficult to reduce the thickness to less than mm, it is not possible to reduce the thickness.

■Wire bonding takes time. In particular, when the number of connection points increases, bonding time becomes longer and production efficiency deteriorates.

■If the transfer mold condition range is exceeded for some reason, the ultrafine metal wire 7 may be deformed or cut in the case of I&W.

Further, in the Ja bonded portion 5 on the semiconductor element 4, An that is not alloyed with the ultrafine metal wire 7 is exposed and twisted.

■TAB method■ If the connecting part 5 of the semiconductor element 4 is designed to be inside the semiconductor element 4, the length of the inner lead part 17 of the carrier film substrate 16 becomes longer, so that the inner lead part 17 is easily deformed. Otherwise, the inner lead portion may not be able to be connected to the desired connection portion 5, or the inner lead portion 17 may come into contact with a portion of the semiconductor element 4 other than the connection portion 5.

In order to avoid this, it is necessary to bring the connecting portion 5 of the semiconductor element 4 to the periphery above the semiconductor element 4, which is subject to design limitations.

■Even in the TAB method, the pitch dimension of the connection parts on the semiconductor element 4 must be approximately 0.09 to 0.15 mm.
Therefore, similar to the problem (2) of the wire bonding method, it is difficult to increase the number of connections.

(2) In order to prevent the inner lead portions 17 of the carrier film substrate 16 from coming into contact with portions other than the connection portions 5 of the semiconductor element 4, a desired connection shape of the inner lead portions 17 is required, which increases costs.

(2) In order to connect the connecting portion 5 of the semiconductor element 4 and the inner lead portion 17, gold bumps must be attached to the connecting portion 5 of the semiconductor element 4 or the connecting portion of the inner lead portion 17, which increases the cost.

■ CCB method ■ Solder bumps 31 must be formed on the connection portions 5 of the semiconductor element 4, which increases costs.

■If the amount of solder on a bump is large, bridges (a phenomenon in which adjacent solder bumps come into contact with each other) will occur between adjacent solder bumps.
On the other hand, if the amount is too small, the connecting portion 5 of the semiconductor element 4 and the connecting portion 33 of the substrate 32 will not be connected and electrical continuity will not be established. In other words, the reliability of the connection becomes low. Furthermore, there is a problem in that the amount of solder and the solder shape of the connection affect the reliability of the connection (Technical data of the Brazing Technology Research Group, No. 017-'84, published by the Brazing Technology Research Group).

As described above, the amount of solder bumps 31 needs to be controlled because the amount of solder bumps affects the reliability of the connection.

(2) If the solder bumps 31 are present inside the semiconductor element 4, it becomes difficult to visually inspect whether or not the connection has been made well.

■Poor heat dissipation characteristics of semiconductor elements (Reference material: Elect
ronic Packaging Technology
y 1987,! (Vat.

3, No. 1) P, 88-71 NIKKEI
MICRO DEVICES.

(May 1988, P. 97-108), therefore, great efforts are required to improve heat dissipation characteristics.

■Technique shown in FIGS. 17 and 18■Exposed surface 72 of insulating film 71 and exposed surface 73 of metal material 70,
Furthermore, the exposed surface 72° of the insulating film 71'' and the exposed surface 73' of the metal material 70' must be made flat, which increases the number of steps and costs.

■The exposed surface 72 of the insulation 115t71 and the exposed surface 73 of the metal material 70 or the exposed surface 72' of the insulating film 71' and the metal material 70
If the exposed surface 73' of ' is uneven, the metal material 70 and the metal material 7
0゛ is no longer connected, and reliability decreases.

■Technology shown in Fig. 19■ After positioning, when applying pressure to connect the connecting parts 76 and 76', it is difficult to apply constant pressure, resulting in variations in the connection state, and as a result, the connecting parts The variation in contact resistance value becomes large. Therefore, the reliability of the connection becomes poor.

In addition, when a large amount of current is passed, phenomena such as heat generation occur, so it is not suitable when a large amount of current is desired to be passed.

■Even if a constant pressure is applied, the anisotropic conductive film 78
Due to the arrangement of the conductive particles 79, variations in the resistance value become large. Therefore, the reliability of the connection becomes poor. Furthermore, it is not suitable for connections requiring large current capacity.

(2) If the pitch between adjacent connecting parts (the distance between the centers of adjacent connecting parts) is narrowed, the resistance value between adjacent connecting parts will decrease, which is not suitable for high-density connections.

■The resistance value changes due to variations in the amount of protrusion h1 at the connection part 76.76° of the circuit board 75.75', so h1
It is necessary to accurately control the amount of variation.

■Additionally, anisotropic conductive films can be used to connect semiconductor elements and circuit substrates,
Furthermore, when used to connect the first semiconductor element and the second semiconductor element, in addition to the disadvantages described above (■ to ■), a bump must be provided at the connection part of the semiconductor element, resulting in high cost. occurs.

■Technology shown in Figure 20 ■Pressure is required, and a pressure jig is required.

■The contact resistance between the gold B wire 82 of the elastic connector 83 and the connecting portion 76 of the first circuit substrate 75 and the connecting portion 76' of the second circuit substrate 75' changes depending on the pressing force and surface condition. Connection reliability is poor.

■Since the metal wire 82 of the elastic connector 83 is a rigid body, if the pressing force is large, the elastic connector 83
If the surfaces of the first circuit substrate 75 and the second circuit substrate 75° are damaged during use, and if the pressing force is small, the reliability of the connection will be poor.

■Furthermore, circuit board 75, 75° connection part 76.76"
The protrusion amount h2 of the metal wire 82 of the elastic connector 83 and the protrusion amount h3 of the metal wire 82 of the elastic connector 83 and their variations affect resistance value change and damage, so it is necessary to take measures to reduce the variation.

(2) Further, when an elastic connector is used to connect a semiconductor element and a circuit substrate, or to connect a first semiconductor element and a second semiconductor element, the same drawbacks as in (1) to (2) occur.

The present invention solves all of the above-mentioned problems and proposes a new electrical circuit member that is high in density, highly reliable, and low in cost. High-density multi-point connections can be obtained and various properties such as heat can be improved.

(The following is a blank space) [Means for solving the problem] The present invention provides a first electrical circuit component having a connecting portion and a second electrical circuit component having a connecting portion, by electrically connecting both electrical circuit components. In an electric circuit member configured by interposing an electric connecting member between the two and connecting the two electric circuit components at the connecting portion, the electric connecting member is made of a plurality of metals or alloys. The metal members are connected to each other by exposing one end of the metal member to the first electric component side and exposing the other end of the metal member to the second electric circuit component side. It is constructed by being embedded in an insulator so that it is electrically insulated.
In addition, one or both of a metal body or an inorganic material body having a desired shape is buried in the insulator, and the connection portion of the first electric circuit component and the metal member exposed on the first electric circuit component side are buried. By alloying one end with the other! a
or the connecting portion of the second electrical circuit component and the second electrical circuit component.
The gist lies in an electric circuit member characterized in that the metal member is connected to one end of the metal member exposed on the side of the electric circuit component by alloying.

Examples of electric circuit components in the present invention include semiconductor elements, circuit boards such as I-shaped circuit boards, ceramic boards, and fully bent boards (hereinafter sometimes simply referred to as circuit boards), lead frames, and the like. That is, any one of these components may be used as the first electrical circuit component, and any one of these components may be used as the second electrical circuit component.

The object of the present invention is a component having a connection part as an electric circuit component. Although the number of connection parts does not matter, the greater the number of connection parts, the more effective the present invention becomes.

Further, although the location of the connection portion does not matter, the effect of the present invention becomes more pronounced as the connection portion is located inside the electric circuit component.

In the present invention, a first electrical circuit component and a second electrical circuit component are connected using an electrical connection member.

The electrical connection member according to the present invention is constructed by embedding a plurality of metal members in an insulator. The metal members are each insulated by an insulator, and one end of the metal member is exposed to the first electric circuit component side, and the other end is exposed to the second electric circuit component side. Further, one or both of a metal body or an inorganic material body having a desired shape is embedded in the insulator.

Here, as the material of the metal member, gold is preferable, but any metal or alloy other than gold may also be used.For example, Cu, A metal, and Sn.

Examples include metals or alloys such as Pb-3n.

Furthermore, the cross section of the metal member can be bicircular, square, or any other arbitrary shape.

Further, the thickness of the metal member is not particularly limited, and may be set to, for example, 20 gmφ or more or 20 ILmφ or less, taking into consideration the pitch of the connecting portions of the electric circuit components.

Note that the exposed portion of the metal member may be on the same surface as the insulator, or may be made to protrude from the surface of the insulator. This protrusion may be on one side or both sides, and if it is protruded, it may be in the form of a bump.

Furthermore, the spacing between the metal members may be the same as the spacing between the connecting parts of the electrical circuit components, or may be narrower than that, and when the spacing is narrower, the spacing between the electrical circuit components and the electrical connecting members may be the same. It becomes possible to connect the electrical circuit component and the electrical connection member without requiring positioning.

Also, metal members do not need to be placed vertically in the insulator;
There may be multiple lines from the first electric circuit component side to the second electric circuit component side.

Furthermore, the electrical connection member may be composed of one layer or multiple layers of two or more layers.

In the present invention, one or both of a metal body and an inorganic material body having a desired shape is embedded in the insulator.

Here, examples of the metal body or inorganic material body having a desired shape include a plate-shaped body, a rod-shaped body having various cross-sectional shapes, a sphere, and the like.

Further, examples of the material of the metal body include Ag and Cu.

to U, to 42 Be, Ca, Mg, Mo, Ni, Si
, W, Fe, Sn, Zn, etc., or alloys thereof.

In addition, as the material of the inorganic material body, for example, SiC, B
eO,B4(:,TaC,Til12.(:rB2.T
iN, BP, UN, 8I1. N.

Si, N4. SiO□, B20. , 8l 203.
Na2Q, 20. CaO, ZnO.

BaO, PbO, 5b20*, 85203. La20z
, ZnO2, P2O5, Tl0z+MgO, Ta205
Examples include ceramics, diamond, C9B, glass, etc. One or more of these inorganic materials may be used.

Metal body One type of inorganic material body or 2N4 or more may be used.

The size and shape of the metal object and inorganic material object to be buried, and
The dispersed position and quantity in the insulator are arbitrary as long as the metal members embedded in the insulator do not come into contact with each other, short-circuit, or break due to the metal body or the inorganic material body. Further, it is not necessary that the metal body or the inorganic material body exists between all the metal members, and there may be some parts where the metal body and the inorganic material body do not exist. Furthermore, the fully bent body and the inorganic material body may or may not be exposed to the outside of the insulator. Also, metal bodies and inorganic material bodies may be in contact with each other,
They don't even have to be in contact.

The insulator of the electrical connection member is not particularly limited as long as it is an insulating material. For example, insulating resin may be used. moreover,
When using a resin, the type of resin does not matter. Either thermosetting resin or thermoplastic resin may be used. For example, polyimide resin, polyphenylene sulfide resin, polyether sulfone resin, polyetherimide resin, polystyrene resin, silicone resin, fluororesin, polycarbonate resin, polydiphenyl ether resin, polybenzylimidazole resin, phenolic resin, urea resin, melamine resin. , alkyd resin, epoxy resin, polyamideimide resin, polyproblene resin, polyvinyl chloride resin, polystyrene resin and other resins can be used.

Among these resins, it is more preferable to use a resin with good thermal conductivity because even if the semiconductor element has heat, the heat can be radiated through the resin.
By selecting a resin having the same or similar coefficient of thermal expansion as that of the circuit board, it is possible to further prevent a decrease in the reliability of the device due to thermal expansion/shrinkage.

In the present invention, the connection portion of the first electric circuit component and the first
connection by alloying one end of the metal member of the electrical connection member exposed on the side of the electrical circuit component, or
The connecting portion of the electrical circuit component of tJS2 is connected to one end of the metal member of the electrical connection member exposed on the electrical circuit component side of tJS2 by alloying. That is, in the present invention, either the NS1 electric circuit component or the second electric circuit component is alloyed.

In addition, as an alloying method, for example, the corresponding connection parts may be brought into contact with each other and then heated at an appropriate temperature.Heating causes diffusion of atoms in the connection parts, and a solid solution or metal is formed on the surface of the connection parts. A layer of intercalary compound is formed and the connections are alloyed. In addition, when Au is used for the metal member of the electrical connection member and An is used for the connection part of the electric circuit component, the heating temperature is preferably 200 to 350°C.

Note that any known method may be used for the connection without alloying. For example, the connection may be made by pressing the electrical circuit component and the electrical connection member.

[Function] Since the above-mentioned electrical connection member is used in the present invention, it is also possible to arrange the connection parts of the electric circuit components inside, and the number of connection parts can be increased. It becomes possible to

Further, the electrical connection member can be made thinner, and from this point of view as well, it is possible to make the electrical connection member thinner.

Furthermore, since the amount of metal members used for the electrical connection member is small, the cost is low even if expensive gold is used as the metal member.

Since one of the electrical circuit components is alloyed via the electrical connection member, there is no variation in contact resistance and the reliability of the connection is high.

In addition, since either the first electric circuit component or the second electric circuit component is alloyed and connected, quality deterioration due to alloying (for example,
When using electrical circuit components that would cause heat-induced deterioration when alloyed by heating, such deterioration can be prevented by connecting the electrical circuit components by pressing, for example, without alloying them. be able to. Also, depending on the application, you may want to make electrical circuit parts removable.
In such a case, if the electric circuit parts are connected by pressing, for example, without alloying, the electric circuit parts can be made detachable.

In the present invention, since one or both of the metal body and the inorganic material body having a desired shape are embedded in the insulator of the electrical connection member, the connection from the first electric circuit component to the second electric circuit component is Thermal conductivity, also.

Thermal conductivity from the second electrical circuit component to the if electrical circuit component is improved. In other words, if the thermal conductivity of the electrical connection member is good, and if an electrical circuit component with a large amount of heat is used as the first electrical circuit component, and an electrical circuit component that is less affected by heat is used as the second electrical circuit component, If selected, the first
The heat generated from the electrical circuit component is quickly conducted to the second electrical circuit component via the electrical connection member, and this heat is radiated from the second electrical circuit component. Therefore, it is possible to obtain an electric circuit member with good heat dissipation characteristics.

Note that if an inorganic material body having a coefficient of thermal expansion close to that of the electric circuit component is embedded in the insulator of the electrical connection member.

The thermal expansion coefficient of the insulator of the electrical connection member is close to that of the electrical circuit component, and cracks in the insulator or metal component, or changes in the characteristics of the electrical circuit component, may occur when heat is applied. This phenomenon that impairs the reliability of the semiconductor device can be prevented, and a highly reliable semiconductor device can be obtained.

Note that this effect is remarkable when the difference in coefficient of thermal expansion between the first electric circuit component and the second electric circuit component is large.

Furthermore, by embedding the metal body in the insulator, it is possible to reduce electromagnetic noise that exits from the electrical circuit components to the outside world, and it is also possible to reduce noise that enters the electrical circuit components from the outside world.

[Example] (First Example) A first example of the present invention will be described based on FIGS. 1 and 2.

In this embodiment, a circuit board 101, which is a first electric circuit component having a connection part 102, and a second circuit board 101 having a connection part 105 are used.
The circuit board 104, which is an electric circuit component of
In the electrical circuit member configured by connecting at the connecting portions 102 and 105 of 104, the electrical connecting member 125 electrically insulates the plurality of metal members 107 made of metal or alloy from each other. and one end of the metal member 107 is connected to the first
The metal member 1 is exposed on the circuit board 101 side.
07 is embedded in an insulator with the other end exposed to the second circuit board 104 side, and
A steel plate 156 is embedded in the insulator 111, and connects the connecting portion 102 of the first circuit board 101 and the first circuit board 101.
Either the connecting portion 105 of the second circuit board 104 and one end of the metal member 107 exposed to the second circuit board 104 are connected by alloying one end of the metal member 107 exposed to the side. They are connected by alloying.

This example will be explained in more detail below.

First, the electrical connection member 125 will be explained while explaining one manufacturing example of the electrical connection member 125.

FIG. 2 shows one manufacturing example.

First, as shown in FIG. 2(a), an insulating sheet 155 is attached to the front and back of an iron plate 156. Thereafter, holes 157 having an inner diameter larger than the wire diameter of the metal wire 121 are made at a pitch of 40 gm at positions where gold Em 121 made of a metal such as gold or an alloy having a diameter of 20 mm is inserted. After that, the metal wire 12 is inserted into the hole 157.
1, put the resin 123 into the hole 157, and
23 is cured. The cured resin 123 becomes an insulator. Therefore, metal wire 121 is insulated from other metal wires 121. Thereafter, it is sliced at the dotted line 124 to create an electrical connection member 125. The electrical connection member 125 created in this way is shown in FIGS. 2(b) and 2(C).

Although the iron plate 156 is used in this example, it may be made of other metal or inorganic material, and the shape is not limited to a plate but may also be a rod or a sphere.Furthermore, the iron plate 156 and the metal wire 121 Although the hole 157 of the iron plate 156 may be insulated in advance, the method for producing the electrical connection member is not limited to the above method, and other methods may be used.

In the electrical connection member 125 created in this way,
The metal wire 121 constitutes the metal member 107, and the iron plate 156,
The insulating sheet 155 and the resin 123 constitute the insulator 111.

In this electrical connection member 125, metal &Iai2 serving as metal members are electrically insulated from each other by resin 123. Further, one end of the metal 5121 is attached to the circuit board 101.
The other end is exposed to the circuit board 104 side.

These exposed parts are circuit boards fo1 and 10, respectively.
The connecting portions 108 and 109 are connected to 4.

Next, the first circuit board lot, the electrical connection member 125,
A second circuit board 104 is prepared. As shown in FIG. 1, the circuit boards 101 and 104 used in this example have a large number of connection parts 102 and 105 therein.

Note that the connection portion 102 of the first circuit board 101 is connected to the connection portion 105 of the second circuit board 104 and the electrical connection member 12.
Metal is exposed at positions corresponding to the connection parts 108 and 109 of No. 5.

or the connecting portion 102 of the first circuit board 101 and the connecting portion 10B of the electrical connecting member 125.

Positioning is performed so that the connection portion 105 of the second circuit board 104 and the connection portion 109 of the electrical connection member 125 correspond, and after positioning, one of them is alloyed and connected, and the other is connected by another method. .

Here, the first circuit board lot, electrical connection member 1
25. There are the following two methods for connecting the second circuit board 104, and either method may be used.

(1) After determining the position between the first circuit board 101 and the electrical connection member 125, and after alloying and connecting the connection part 102 of the first circuit board 101 and the connection part 108 of the electrical connection member 125, A method in which the second circuit board 104 is positioned and the connection portion 105 of the second circuit board 104 and the connection portion 109 of the electrical connection member 125 are pressed and connected.

■ After positioning the circuit board 104 of f52 and the electrical connection member 125, the connection part 105 of the second circuit board 104
After alloying and connecting the connecting portion 109 of the electrical connecting member 125, the first circuit board 101 is positioned, and the first circuit board 101 is positioned.
The connection portion 102 of the circuit board 101 and the electrical connection member 125
A method in which the connection is made by pressing the connection part 108 of the

When the connectivity of the connection portions of the electrical circuit members produced as described above was examined, the connections were found to be highly reliable.

Furthermore, the heat dissipation properties were also good.

(Second example) FIG. 3 shows a second embodiment.

In this example, a circuit board 51 is used as a first electric circuit component having a connection part 52, and a semiconductor element 4 having a large number of connection parts 5 therein is used as a second electric circuit component.

Alloying was performed between the connecting portion 5 of the semiconductor element 4 and the connecting portion 54 of the Wt4A approximately 4A member 125 in which one or both of a metal body or an inorganic material body having a desired shape is embedded in an insulator. .

The electrical connection member 125 in which one or both of a metal body and an inorganic material body is embedded in an insulator has a size corresponding to the semiconductor element 4.

After alloying and connecting, a lead frame 55 was connected to the lower surface of the circuit board 51.

Other points are similar to the first embodiment.

In this example as well, the connection section was connected with high reliability.

Furthermore, the heat dissipation properties were also good.

(Third example) FIG. 4 shows a third embodiment.

In this example, the first electric circuit component is the semiconductor element 4, and the second electric circuit component is the circuit board 51.

Note that after connection, a lead frame l is placed on the top surface of the circuit board 51.
were connected and sealed with a sealing material 63.

Other points are similar to the first embodiment.

In this example as well, the connection section was connected with high reliability.

Furthermore, the heat dissipation properties were also good.

(Fourth example) FIG. 5 shows a fourth embodiment.

In this example, the first electric circuit component is a semiconductor element 4',
This is an example in which the second electric circuit component is the semiconductor element 4. In this example, an electrical connection member having a size corresponding to the semiconductor element 4 is used, and the lead frame 1 is connected to the first electrical connection member 125. It is connected to the metal member exposed on the 4° side of the semiconductor element.

The rest is the same as the third embodiment.

In this example as well, the connection section was connected with high reliability.

Furthermore, the heat dissipation properties were also good.

(Fifth example) FIG. 6 shows a fifth embodiment.

In the fifth embodiment, the first '1 is an air circuit component, m2 is an electric circuit component, and the parts other than the connection part are an insulating film 103, i0
This is an example in which circuit boards 101 and 104 covered by 6 are used.

Further, as an electrical connection member, one shown in FIG. 7 was used. That is, as shown in FIG.
In the electrical connection member 125 embedded therein, the exposed portion of the metal member 107 protrudes from the surface of the resin insulator 111. Such electrical connection member 125 may be created, for example, by the following method.

First, by the method described in the first embodiment, as shown in FIG. 2(b),
6. Prepare the electrical connection member shown in (C) Next, the metal wire 121 is connected to the insulating sheet 15
Etching may be performed until it protrudes by about 5 to 10 JLm.

Note that in this embodiment, the amount of protrusion of the metal wire 121 was set to 10 gm, but any amount may be used.

Furthermore, the method for making the metal wire 121 protrude is not limited to etching, and other chemical or mechanical methods may be used.

Other points are similar to the first embodiment.

Note that the protruding portion and the electrical connection member 125 are connected to the metal wire i21.
Place it in a mold with four parts in the position of
Bumps 150 as shown in FIG. 8 may be formed by crushing the protrusions 126 of 121.

In this case, the metal wire 121 becomes difficult to fall off from the insulator 111.

In addition, in this example, metal &! 1t121 is the metal member 107
Further, the iron plate 156, the insulating sheet 155, and the resin 123 constitute the insulator 111.

Note that the bumps may be created by melting the protrusions with heat, or any other method may be used.

In this example as well, the connection section was connected with high reliability.

Furthermore, the heat dissipation properties were also good.

(6th example) FIG. 9 shows a sixth embodiment.

In this example, a semiconductor element 4 is used as the first electrical circuit component, and a lead frame 1 is used as the second electrical component.

Other points are similar to the fifth embodiment.

In this example as well, the connection section was connected with high reliability.

Furthermore, the heat dissipation properties were also good.

(Seventh Example) A seventh embodiment is shown in FIG. 1O.

In this example, the electrical connection member 125 is different from the electrical connection member shown in the fifth embodiment. That is, in the electrical connection member 125 of this example, the pitch between the metal members is narrower than that shown in the fifth example. That is, in this example, the pitch between the metal members 107 is set to be narrower than the spacing between the first circuit board connecting portions.

That is, in the fifth embodiment, the first circuit board 101 and the second
An electrical connection member 125 is located at the connection position with the circuit board 104.
However, in this example, the first circuit board 1
01 and the second circuit board 104 is necessary, but positioning with the electrical connection member 125 is not necessary.

Therefore, the first circuit board 101 and the second circuit board 10
It is also possible to connect without positioning by selecting appropriate values for the connection dimensions (dll, Fil) of No. 4 and the connection dimensions (d12.PI3) of the electrical connection member.

In this example as well, the connection section was connected with high reliability.

Furthermore, the heat dissipation properties were also good.

(Eighth Example) FIG. 11 shows an electrical connection member used in the eighth example.

FIG. 11(a) is a perspective view of the electrical connection member, FIG.
b) is a sectional view of the electrical connection member.

An example of making such an electrical connection member will be described next.

First, using the manufacturing method shown in the first embodiment, an iron plate 15 is placed in the insulator.
Prepare three electrical connection members 128°, 129, and 130 in which 6 is embedded.

The position of the metal wire 121 in the first sheet 128 is m row and n column.
It is displaced from the center by a and nb. The second one! The position of the gold FE wire 121 of No. 29 is in the mth row and the nth column, and is displaced from the center by mac and nbc. 3rd piece 130 gold y & 5121
is located in m rows and n columns, displaced from the center by mad and nbd. a.

The values of b, c, and d are such that the upper and lower metals 121 are electrically conductive, but the left and right sides are not electrically conductive with each other. The three electrical connection members are positioned and laminated using a method such as thermocompression bonding to create the electrical connection member 125.

In addition, in this example, the positions of the metals of the electrical connection members were selected according to rules such as m rows and n columns, but the metals on the top and bottom were conductive, and the left and right sides were not electrically conductive with each other. It can be random if you do.

In addition, although this example describes the case where three layers are laminated, two
Any number of layers may be used as long as the electrical connection member of this example is laminated using a thermocompression bonding method. 7th
A protrusion may be provided as shown in the figure, or a bump 150 may be provided as shown in FIG. i8.

In this example as well, the connection section was connected with high reliability.

Furthermore, the heat dissipation properties were also good.

(Ninth Example) FIG. 12 shows an electrical connection member used in the ninth example.

FIG. 12(a) is a cross-sectional view of the electrical connection member during manufacture;
FIG. 12(b) is a perspective view of the electrical connection member,
Figure (C) is the above sectional view.

First, metal wire guide plates 131, 132 and iron plate 156 are prepared. Then, the iron plate 156 is attached to the metal wire guide plate 131.13.
Insert it between 2 and hold.

Next, the metal wire 121 is passed through desired holes 133 and 134 made in the metal wire guide plates 131 and 132, and stretched to a desired tension. Thereafter, resin 123 is poured between the metal wire guide plates 131 and 132 and hardened. After that, the guide plate is removed and a Trt94-like connection member 125 is created.

Further, the electrical connection member of this example may be processed to provide a protrusion as shown in FIG. 7 (or a bump 150 may be provided as shown in FIG. 8).

The first circuit component and the second electric circuit component of this example are:
Each of them is one of circuit base materials such as a semiconductor element, a circuit board, and a lead frame.

In this example as well, the connection section was connected with high reliability.

Furthermore, the heat dissipation properties were also good. .

[Effects of the Invention] Since the present invention is configured as described above, the following numerous effects can be obtained.

1. Highly reliable connections between semiconductor elements and circuit substrates such as circuit boards and lead frames can be obtained. Therefore, the conventionally used wire bonding method, TAB
It becomes possible to replace the CCB method.

2. According to the present invention, the stirrup can be placed at any location (particularly inside) of the electric circuit component, which enables more multi-point connections than the wire bonding method or the TAB method, and is suitable for connection with a large number of bins. This is the method.

Furthermore, due to the presence of an insulating material between adjacent metals of the electrical connection member, there is no electrical conduction between the adjacent metals.
Even more multi-point connections than in the CB system are required.

3. Since the amount of metal members used in the electrical connection member is small compared to the conventional one, even if expensive metal such as gold is used for the metal member, it will be cheaper than the conventional one.

4. High-density semiconductor devices and the like can be obtained.

5. One of the electric circuit components can be detachably attached. In addition, even electrical circuit parts whose quality would deteriorate when alloyed can be connected without causing deterioration.

6. Since one or both of the metal body and the inorganic material body are embedded in the insulator of the electrical connection member, even if heat is generated in the first electric circuit component or the second electric circuit component, the electric The heat is radiated to the outside via the target connecting member. Therefore,
An electric circuit member with good heat dissipation properties can be obtained.

For example, if you select an inorganic material with a coefficient of thermal expansion close to that of electrical circuit components and embed it in the insulator of an electrical connection member, thermal stress will not occur even when heat is applied. Highly reliable electrical circuit components with less
A semiconductor device is obtained.

Of course, a highly reliable semiconductor device can be obtained by selecting a material having the same or similar coefficient of thermal expansion as the semiconductor element and the circuit substrate as the electrically insulating material of the electrical connection member.

Note that when a metal body is embedded in the insulator of the electrical connection member, an electrical circuit member with good heat dissipation, low stress, and high shielding efficiency can be obtained.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing a first embodiment. Figure 1(a)
2 shows the state before connection, and FIG. 2(b) shows the state after connection. FIG. 2 is a diagram for explaining an example of a manufacturing method of the electrical connection member used in the first embodiment. , Figure 2(a)
2(b) is a perspective view, and FIG. 2(c) is a sectional view. FIG. 3 shows a second embodiment, FIG. 3(&) is a perspective view, and FIG. 3(b) is a sectional view. FIG. 4 is a sectional view showing the third embodiment. FIG. 5 is a sectional view showing the fourth embodiment. 6 shows a fifth embodiment, FIG. 6(a) is a sectional view showing the state before connection, and FIG. 6(b) is a sectional view showing the state after connection. FIGS. 7 and 8 also show the fifth embodiment, with FIGS. 7(a) and 8(a) being perspective views, and FIGS. 7(b) and 8(b) being sectional views. It is. 9 shows a sixth embodiment, FIG. 9(a) is a perspective view showing the state before connection, and FIG. 9(b) is a sectional view showing the state after connection. FIG. 1θ is a sectional view showing the seventh embodiment,
Figure 1θ (L) shows the state before connection, Figure 1θ (b)
11 shows the electrical connection member according to the eighth embodiment, and FIG. 11(a) is a perspective view,
FIG. 11(b) is a sectional view. FIG. 12 shows an example of a single-hair structure of the electrical connection member according to the ninth embodiment, and FIG.
), CC') are cross-sectional views, and FIG. 12(b) is a perspective view. 13 to 20 show conventional examples, except for FIG. 14, which is a sectional view, and FIG. 14 is a plan perspective view. l- Lead frame, 2... Element mounting part of lead frame, 3... Silver paste, 4.4'... Semiconductor element,
5.5'-・Connection part of semiconductor element. 6. Connection part of lead frame, 7. Ultra-fine metal wire, Q
...Resin, 9.. Semiconductor device, lO.. Outer periphery of semiconductor element, 11.. Outer periphery of element mounting part of lead frame, is-. Carrier film substrate, 17. Inner lead of e carrier film substrate. Part, 20...Resin, -2
1. Resin, 310. Solder bump, 32.・Substrate, 33
- Connection part of one board, 51...Circuit board, 52...Connection part of circuit board, 54.Connection part of Φ electrical connection member, 55.
・Lead frame, 63... Sealing material, 70°70'...
Metal material, 71.71°...Insulating film, 72.72'...
Exposed surface of insulating film, 73.73°・Exposed surface of fist metal material, 7
5.75'--Circuit base material, 76.76° 0-Connection part of circuit base material, 77--Insulating material of anisotropic conductive film, 78-Fist anisotropic conductive film, 79--Conductive particles, 81...Insulating material of elastic connector, metal wire of 820-section elastic connector, 83...Elastic connector, 101...
Circuit board, 102... Connection portion, 103... Insulating film, 10
6...Insulating film, 104...Circuit board, 105...Connecting part, 107 Metal member, 108...Connecting part, 109...Connecting part, 111...Insulator, 121...Metal wire, 123...Resin . 124... Dotted line, 125@- electrical connection member, 126-
・Protrusion, 128, 129, 130-・Electrical connection member,
131,132...Metal wire guide plate. 150...Bump, insulation sheet 0.155°156...
Iron plate, 157... holes. Figure 1 (a) Figure 1 (b) Figure 2 (a) L) 1 Figure 2 (b) Figure 2 (c) Figure 3 (a) Figure 3 (b) Figure 4 Figure 5 Figure 6(a) Figure 6(b) Figure 8(a) Figure 8(b) H-1:'. Figure 10 (a) Figure 10 (b) Figure 11 (a) Figure 11 (b) Figure 12 (a) Figure 12 (b) Figure 12 (c) Figure 13 Figure 14 Figure 15 Figure 16 Figure 17 Figure 18 Figure 19 Figure 2Q

Claims (2)

[Claims] 1. A first electrical circuit component having a connecting portion and a second electrical circuit component having a connecting portion, with an electrical connecting member for electrically connecting both electrical circuit components interposed therebetween, In an electrical circuit member configured by connecting both electrical circuit components at a connecting portion, the electrical connection member includes a plurality of metal members made of metal or an alloy, with one end of the metal member facing the first electrical component side. The other end of the metal member is exposed to the second electric circuit component side, and the metal members are embedded in an insulator so as to be electrically insulated from each other. Ori,
In addition, one or both of a metal body or an inorganic material body having a desired shape is embedded in the insulator, and the connection portion of the first electric circuit component and the metal member exposed on the first electric circuit component side are embedded in the insulator. or by alloying the connecting portion of the second electric circuit component and one end of the metal member exposed on the second electric circuit component side. Characteristic electrical circuit components. 2. 2. The electric circuit member according to claim 1, wherein the first electric circuit component and the second electric circuit component are each one of a semiconductor element, a circuit board, a lead frame, or other circuit base material.