JPS63245875A - Electric circuit member - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [Industrial application field] TECHNICAL FIELD The present invention relates to an electric circuit member.

[Prior Art] Conventionally, the following techniques are known as techniques related to electric circuit members configured by electrically connecting electric circuit components.

■Wire bonding method Figures 13 and 14 show typical examples of semiconductor devices connected and sealed by the wire bonding method. Explain how.

In this method, the semiconductor element 4 is fixedly supported on the element mounting part 2 using Ag paste 3 or the like, and then the connection part 5 of the semiconductor element 4 and the desired connection part 6 of the lead frame l are connected with ultrafine material such as gold. This is a method of electrically connecting using metal wires 7.

After the connection, the semiconductor element 4 and the lead frame l are sealed using a resin 8 using a method such as transfer molding, and then the unnecessary portion of the lead frame 1 extending outward from the resin-sealed part is cut off. , bend the semiconductor device 9 into the desired shape.
make.

■T A B (Tape Auto+5ated B
onding) method (for example, JP-A-59-139636
15 shows a typical example of a semiconductor device connected and sealed by the TAB method.

This method is an automatic bonding method using a tape carrier method. That is, to explain based on FIG. 15, after positioning the carrier film substrate 16 and the semiconductor element 4, the inner lead part 17 of the carrier film substrate 16 and the connecting part 5 of the semiconductor element 4 are connected by thermocompression bonding. This is the way to do it. After the connection, the semiconductor device 9 is sealed with resins 20 and 21.

■CCB (Controlled Co11apse
Bonding) law (for example, Special Publication Act 1977
(No. 6, Japanese Unexamined Patent Publication No. 60-57944) FIG. 16 shows a typical example of a semiconductor device connected and sealed by the CCB method. This method will be explained based on FIG. 16. Note that this method is also called a flip chip bonding method.

Solder bumps 31 are provided in advance on the connection portion 5 of the semiconductor element 4,
A semiconductor element 4 provided with solder bumps 31 is positioned and mounted on one circuit board 32.

Thereafter, the semiconductor element 4 is connected to the circuit board 32 by heating and melting the solder, and the semiconductor device 9 is manufactured by sealing after washing with flux.

■The method shown in FIGS. 17 and 18, that is, an insulating film 71 made of polyimide or the like is formed on a portion of the first semiconductor element 4 other than the connection portion 5, and a metal material 70 made of Au or the like is formed on the connection portion 5. Then, the exposed surfaces 73 and 72 of the metal material 70 and the insulating film 71 are flattened. On the other hand, an insulating film 71' made of polyimide or the like is formed on a portion of the second semiconductor element 4'' other than the connecting portion 5', a metal material 70° made of Au or the like is provided at the connecting portion 5°, and then a metal Exposed surfaces 73', 7 of the material 70' and the insulating film 71'
Flatten 2”.

Thereafter, as shown in FIG. 18, the first semiconductor element 4 and the second semiconductor element 4' are positioned.

After positioning, the first semiconductor element 4 is bonded by thermocompression.
The connecting portion 5 of the semiconductor element @2 and the connecting portion 5'' of the semiconductor element 4° of @2 are connected via metal members 70 and 70'.

■The method shown in FIG. 19, that is, an anisotropic conductive film 78 in which conductive particles 79 are dispersed in an insulating material 77 is interposed between the first circuit substrate 75 and the second circuit substrate 75. , the first circuit substrate 75 and the second circuit substrate 75
After positioning the circuit board 75', pressurize or
By applying pressure and heating, the connection portion 76 of the first circuit substrate 75 and the second
This is a method of connecting the connecting portion 76'' of the circuit board 75'.

■The method shown in FIG. 20, that is, an elastic connector in which a metal wire 82 of Fe, Cu, etc. is arranged in a fixed direction in an insulating material 81 between a first circuit substrate 75 and a second circuit substrate 75. 83 and position the first circuit board 75 and the second circuit board 75°, pressurizes the connection part 76 of the first circuit board 75 and the second circuit board 75'. This is a method of connecting the connecting portion 76'.

[Problems to be Solved by the Invention] The conventional bonding method described above has the following problems.

■ Wire bonding method ■ If the connection part 5 of the semiconductor element 4 is designed to be inside the semiconductor element 4, the ultrafine metal wire 7 has an extremely small wire diameter, It becomes easier to contact the outer peripheral edge 11 of the element mounting portion 2 of the lead frame 1. The ultra-fine metal wire 7 is attached to these outer peripheral edges 10 to 11.
It will short circuit if it comes into contact with. Furthermore, the length of the ultra-fine metal wire 7 has to be increased, and when the length is increased, the ultra-fine metal wire 7 becomes easily deformed during transfer molding.

Therefore, the connecting portion 5 of the semiconductor element 4 needs to be placed around the semiconductor element 4, and is inevitably subject to circuit design limitations.

■In the wire bonding method, in order to avoid contact between adjacent ultrafine metal wires 7, the pitch dimension of the connecting parts 5 on the semiconductor element 4 (the distance between the centers of adjacent connecting parts
! t) It is necessary to maintain a certain amount of distance. Therefore, once the size of the semiconductor element 4 is determined, the connection portion 5 must be
The maximum number of is determined.

However, in the wire bonding method, the pitch dimension is usually as large as about 0.2 mm, so the number of connecting parts 5 must be reduced.

■The height h of the ultrafine metal wire 7 measured from the connection part 5 on the semiconductor element 4 is usually 0.2 to 0.4 mm, but it is 0.2 mm.
Since it is relatively difficult to make the device thinner than below, the device cannot be made thinner.

■Wire bonding takes time. In particular, when the number of connection points increases, the bonding time increases and production efficiency deteriorates.

- If the transfer molding condition range is exceeded for some reason, the ultrafine metal wire 7 may be deformed or, in the worst case, may be cut.

In addition, in the connection portion 5 on the semiconductor element 4, since the AIL that is not alloyed with the ultrafine metal wire 7 is exposed, Aj2 corrosion is likely to occur, resulting in a decrease in reliability.

■TAB method■ If the connecting part 5 of the semiconductor element 4 is designed to be inside the semiconductor element 4, the length of the inner lead part 17 of the carrier film substrate 16 becomes longer, so that the inner lead part 17 is easily deformed. Otherwise, the inner lead portion may not be able to be connected to the desired connection portion 5, or the inner lead portion 17 may come into contact with a portion of the semiconductor element 4 other than the connection portion 5.

In order to avoid this, it is necessary to bring the connecting portion 5 of the semiconductor element 4 to the periphery above the semiconductor element 4, which is subject to design limitations.

■Even in the TAB method, the pitch dimension of the connection parts on the semiconductor element 4 must be approximately 0.09 to 0.15 mm.
Therefore, similar to the problem (2) of the wire bonding method, it is difficult to increase the number of connections.

(2) In order to prevent the inner lead portions 17 of the carrier film substrate 16 from coming into contact with portions other than the connection portions 5 of the semiconductor element 4, a desired connection shape of the inner lead portions 17 is required, which increases costs.

(2) In order to connect the connecting portion 5 of the semiconductor element 4 and the inner lead portion 17, gold bumps must be attached to the connecting portion 5 of the semiconductor element 4 or the connecting portion of the inner lead portion 17, which increases the cost.

■ CCB method ■ Solder bumps 31 must be formed on the connection portions 5 of the semiconductor element 4, which increases costs.

■If the amount of solder on a bump is large, bridges (a phenomenon in which adjacent solder bumps come into contact with each other) will occur between adjacent solder bumps.
On the other hand, if the amount is too small, the connecting portion 5 of the semiconductor element 4 and the connecting portion 33 of the substrate 32 will not be connected and electrical continuity will not be established. In other words, the reliability of the connection becomes low. Furthermore, there is a problem that the amount of solder and the solder shape of the connection affect the reliability of the connection (Technical data of the Brazing Technology Research Group, No. 017-'84, published by the Brazing Technology Research Group).

As described above, the amount of solder bumps 31 needs to be controlled because the amount of solder bumps affects the reliability of the connection.

(2) If the solder bumps 31 are present inside the semiconductor element 4, it becomes difficult to visually inspect whether or not the connection has been made well.

■Poor heat dissipation characteristics of semiconductor elements (reference material; Elect
ronic Packaging Technology
y1111B? , 1 (Vol.

3, No. 1) P, 88-71 NIKKEI
MICRO DEVICES.

198E1.5, P. 97-108), therefore, great efforts are required to improve the heat dissipation characteristics.

■Technique shown in FIGS. 17 and 18 ■Exposed surface 72 of insulating film 71 and exposed surface 73 of metal material 70.
Furthermore, the exposed surface 72' of the insulating film 71' and the exposed surface 73° of the metal material 70° must be made flat, which increases the number of steps and costs.

■If there are irregularities on the exposed surface 72 of the insulating film 71 and the exposed surface 73 of the metal material 70, or on the exposed surface 72' of the insulating film 71' and the exposed surface 73° of the metal material 70', the metal material 70 and the metal material 70' may will no longer connect, reducing reliability.

■Technology shown in FIG. 19■ After positioning, when applying pressure to connect the connecting parts 76 and 76', it is difficult to apply constant pressure, so the connection state varies, and as a result, the connecting parts The variation in contact resistance value becomes large. Therefore, the reliability of the connection becomes poor.

In addition, when a large amount of current is passed, phenomena such as heat generation occur, so it is not suitable when a large amount of current is desired to be passed.

■Even if a constant pressure is applied, the anisotropic conductive film 78
Due to the arrangement of the conductive particles 79, variations in the resistance value become large. Therefore, the reliability of the connection becomes poor. Furthermore, it is not suitable for connections requiring large current capacity.

(2) If the pitch between adjacent connecting parts (distance # between the centers of adjacent connecting parts) is narrowed, the resistance value between adjacent connecting parts will decrease, which is not suitable for high-density connections.

■The resistance value changes due to variations in the amount of protrusion hl of the connection part 76.76' of the circuit board 75.75', so h1
It is necessary to accurately control the amount of variation.

■Additionally, anisotropic conductive films can be used to connect semiconductor elements and circuit substrates,
Furthermore, when used to connect the first semiconductor element and the second semiconductor element, in addition to the disadvantages described above (■ to ■), a bump must be provided at the connection part of the semiconductor element, resulting in high cost. occurs.

■Technology shown in Figure 20 ■Pressure is required, and a pressure jig is required.

■The contact resistance between the metal wire 82 of the elastic connector 83 and the connection portion 76 of the first circuit substrate 75 and the connection portion 76° of the second circuit substrate 75° changes depending on the pressing force and surface condition. has poor reliability.

■Since the metal wire 82 of the elastic connector 83 is a rigid body, if the pressing force is large, the elastic connector 83
First circuit substrate 75. If the surface of the second circuit board 75' is damaged during use, and if the pressing force is small, the reliability of the connection will be poor.

■Furthermore, the connection parts 76, 76 of the circuit board 75.75°
' protrusion amount h2. Also elastic connector 83
Since the protrusion amount h3 of the metal wire 82 and its dispersion affect the change in resistance value and damage, it is necessary to take measures to reduce the dispersion.

(2) Further, when an elastic connector is used to connect a semiconductor element and a circuit substrate, or to connect a first semiconductor element and a second semiconductor element, the same drawbacks as in (1) to (2) occur.

The present invention solves all of the above-mentioned problems and proposes a new electrical circuit member that is high in density, highly reliable, and low in cost. High-density multi-point connections can be obtained and various properties such as heat can be improved.

(The following is a blank space) [Means for solving the problem] The present invention provides an electric circuit for electrically connecting a first electric circuit component having a connecting portion and a second electric circuit component having a connecting portion. In the electrical connection member, the electrical connection member includes a plurality of metal members made of metal or an alloy, with one end of the metal members exposed to the first electric component side, and the other end of the metal members exposed to the first electric component side. The connecting portion of the first electric circuit component and the metal exposed on the first electric circuit component side are buried in a holding body made of metal or alloy with an insulating material interposed therebetween. The connection is made by alloying one end of the member, or the connection is made by alloying the connection part of the second electric circuit component and one end of the metal member exposed on the second electric circuit component side. The gist lies in an electric circuit member characterized by:

Examples of the electric circuit components in the present invention include semiconductor elements, circuit boards such as resin circuit boards, ceramic boards, and metal boards (hereinafter sometimes simply referred to as circuit boards), lead frames, and the like. That is, any one of these components may be used as the first electrical circuit component, and any one of these components may be used as the second electrical circuit component.

The object of the present invention is a component having a connection part as an electric circuit component. Although the number of connection parts does not matter, the greater the number of connection parts, the more remarkable the effects of the present invention will be.

Further, although the location of the connection portion does not matter, the effect of the present invention becomes more pronounced as the connection portion is located inside the electric circuit component.

In the electrical connection member according to the present invention, a metal member is embedded in a holder made of metal or an alloy with an insulating material interposed therebetween.

One end of this metal member is exposed to the first electric circuit component side, and the other end is exposed to the second electric circuit component side.

Here, as the material of the metal member, gold is preferable, but any metal or alloy other than gold can also be used. For example, Cu, Au, Sn.

Examples include metals or alloys such as Pb-3n.

Furthermore, the cross section of the metal member can be circular, square, or any other shape.

Further, the thickness of the metal member is not particularly limited, and may be set to, for example, 20 Bmφ or more or 20 ILmφ or less, taking into consideration the pitch of the connecting portions of the electric circuit components.

Note that the exposed portion of the metal member may be on the same surface as the holder, or may be made to protrude from the surface of the holder. This protrusion may be on only one side or on both sides, and if it is made to protrude, it may be bumped. It may be made into a shape.

Furthermore, the spacing between the metal members may be the same as the spacing between the connecting parts of the electrical circuit components, or may be narrower than that, and when the spacing is narrower, the spacing between the electrical circuit components and the electrical connecting members may be the same. It becomes possible to connect the electrical circuit component and the electrical connection member without requiring positioning.

In addition, the metal member does not need to be arranged vertically in the holder;
It may run obliquely from the first electric circuit component side toward the second electric circuit component side.

Furthermore, the electrical connection member may be composed of one layer or multiple layers of two or more layers.

In the present invention, the holder is made of metal or an alloy, and an insulating material is interposed between the holder and the metal member.

Examples of metals or alloys for the holder include Ag, Cu,
Au, AJL, Be, Ca, Mg.

Mo, Ni, Si, W, Fe, Ti, In.

Examples include Sn, Zn and other metals, or alloys thereof.

For example, when the holder is made of a metal or alloy that can be anodized (e.g. AJI, Ti), the metal member of the holder may be buried. A method in which the holding body is anodized after making a hole in the part where the hole is made, and an anodized film is formed on the surface of the holed part (the anodic oxide film is an insulating material), and the metal of the holding body is anodized. After drilling a hole in the part where the component is to be buried, the holder is subjected to oxidation treatment, nitridation treatment, fertilization treatment, carbonization treatment, etc. to form an oxide film, nitride film, or fertilization film on the surface of the hole. , a method of forming a carbide film, etc., a method of making a hole in the part where the metal member of the holder is to be buried, and then thermally spraying or vapor depositing ceramic, etc. to form an insulating material, a method of embedding the metal member of the holder A method of drilling a hole in the part and applying resin to the hole, a method of separating the holding body and the metal member using a special oxidation treatment, nitriding treatment, fertilization treatment, and carbonization treatment (in the case of this method, the holding body and metal parts are the same metal or alloy.)(
Note that the insulating material may be formed by the above method on all sides of the electrical connection member, the surface on the first electric circuit component side, and the surface on the second electric circuit component side. ) A method of arranging an inclusion made of resin or inorganic material between the metal member and the holding body (for example, a method of fitting a tubular body between the metal member and the hole in which the metal member is buried), etc. can give.

Furthermore, among the above-described methods, there is no particular limitation on the type of resin when disposing inclusions made of resin. For example, insulating resin may be used. Furthermore, when using a resin, the type of resin does not matter. Any of thermosetting resin, ultraviolet curing resin, and thermoplastic resin may be used. for example,
Polyimide resin, polyphenylene sulfide resin, polyether sulfone resin, polyetherimide resin,
Polystyrene resin, silicone resin, fluororesin, polycarbonate resin, polydiphenyl ether resin, polybenzylimidazole resin, phenol resin, urea resin, melamine resin, alkyd resin, epoxy resin, polyamideimide resin, polyproblene resin, polyvinyl chloride resin, Polystyrene resin and other resins can be used.

Further, powder or fibers made of a metal material or an inorganic material may be dispersed in these resins. When dispersing, the shape, size, and position of dispersion of the powder or fibers are not particularly limited. However, this is limited to a range where the metal member and the holder are not electrically connected. Furthermore, a plate-shaped body, a rod-shaped body, a spherical body, etc. made of a metal material or an inorganic material may be embedded in these resins. In this case as well, the embedded position, shape, size, quantity, etc. of the plate-shaped body, rod-shaped body, spherical body, etc. are not particularly limited.

In addition, among the above-mentioned methods, when an inclusion made of an inorganic material is disposed between the metal member and the holding body, the inorganic material is, for example, S 102 .

B203, AR, 203, Na20. 20°Cab
, ZnO, Bad, PbO, 5b203.

As203. La2O3, ZrO2, Bad.

P205, TiO2, MgO, SiC, Bed.

BP, BN, AfiN, B4C, TaC.

Ti　B2. CrB2. TiN, Si3N,.

Examples include ceramics such as T a 205, diamond, glass, carbon, boron, and other inorganic materials.

Of the above resins or inorganic materials, if a resin with good thermal conductivity is used, even if the semiconductor element has heat, the heat can be dissipated through the resin or inorganic material, which is more preferable. In the invention, the connection part of the first electric circuit component and one end of the metal member of the electric connection member exposed on the side of the first electric circuit component are connected by alloying, or The connecting portion of the component and one end of the metal member of the electrical connection member exposed to the second electric circuit component are connected by alloying. That is, in the present invention, either the first electric circuit component or the second electric circuit component is alloyed.

In addition, as an alloying method, for example, after bringing the corresponding connection parts into contact with each other, heating may be performed at an appropriate temperature. The heating causes diffusion of atoms and the like in the connecting portions, forming a layer made of a solid solution or an intermetallic compound on the surface of the connecting portions, and alloying the connecting portions. In addition, when Au is used for the metal member of the electrical connection member and Al is used for the connection part of the electric circuit component, 200 to 350
A heating temperature of °C is preferred.

Note that any known method may be used for the connection without alloying. For example, the electrical circuit component and the electrical connection member may be pressed to connect.

[Operation] In the present invention, since the above-described electrical connection member is used to connect the first electrical circuit component and the second electrical circuit component, the connecting portion of the electrical circuit component can be placed inside. This also makes it possible to increase the number of connection parts, which in turn makes it possible to increase the density.

Further, the electrical connection member can be made thinner, and from this point of view as well, it is possible to make the electrical circuit member thinner.

Furthermore, since the amount of metal members used for the electrical connection member is small, the cost is low even if expensive gold is used as the metal member.

In the present invention, since the holder of the electrical connection member is made of metal or an alloy, thermal conductivity from the first electrical circuit component to the second electrical circuit component and from the second electrical circuit component to the first electrical circuit component are improved. Improves thermal conductivity to electrical circuit components. In other words,
The thermal conductivity of the electrical connection member is good, and if an electrical circuit component with a large calorific value is used as the first electrical circuit component, and an electrical circuit component with little heat influence is selected as the second electrical circuit component. In this case, the heat generated from the first electric circuit component is quickly conducted to the second electric circuit component via the electrical connection member, and this heat is radiated from the second electric circuit component. Therefore, it is possible to obtain an electric circuit member with good heat dissipation characteristics.

Furthermore, since the holder is made of metal or an alloy, it is possible to reduce electromagnetic noise emitted from the electric circuit components to the outside world, and it is also possible to reduce noise that enters the electric circuit components from the outside world.

Since one of the electrical circuit components is alloyed via the electrical connection member, there is no variation in contact resistance and the reliability of the connection is high.

In addition, since either the first electric circuit component or the second electric circuit component is alloyed and connected, quality deterioration due to alloying (for example,
When using electrical circuit components that would cause heat-induced deterioration when alloyed by heating, such deterioration can be prevented by connecting the electrical circuit components by pressing, for example, without alloying them. be able to. Also, depending on the application, you may want to make electrical circuit parts removable.
In such a case, if the electric circuit parts are connected by pressing, for example, without alloying, the electric circuit parts can be made detachable.

(Margins below) [Example] (First Example) A first example of the present invention will be described based on FIGS. 1 and 2.

In this embodiment, a circuit board 101, which is a first electric circuit component having a connection part 102, and a second circuit board 101 having a connection part 105 are used.
The circuit board 104, which is an electric circuit component of the circuit board 101,
104, the electrical circuit member 125 connects a plurality of metal members 107 made of metal or alloy, and connects one end of the metal member 107 to a first circuit. While the metal member 10 is exposed on the substrate 101 side,
exposing the other end of 7 to the second circuit board 104 side,
The connecting portion 102 of the first circuit board 101 and the first
connection by alloying one end of the metal member 107 exposed on the circuit board 101 side, or connect the connecting portion 105 of the second circuit board 104 and the metal member 107 exposed on the second circuit board 104 side. It is connected by alloying one end of the

This example will be explained in more detail below.

First, the electrical connection member 125 will be explained while explaining one manufacturing example of the electrical connection member 125.

FIG. 2 shows one manufacturing example.

Holes 142 having an inner diameter larger than 20 μmφ are bored at a pitch of 40 μm in the holder 122 made of aluminum. Next, alumite treatment (anodization treatment) is performed, and after the alumite treatment, a metal wire 121 made of a metal such as gold or an alloy with a diameter of 20 μm is passed through the hole 142 of the holder 122, and the metal wire 121 is connected to the holder 122 made of aluminum. A resin 123 is placed between the resin 121 and the resin 121, and the resin 123 is cured. The cured resin 123 and an alumite film (not shown) formed by alumite treatment become an insulating material. Thereafter, the metal wire 121 is sliced at the dotted line 124 to produce an electrical connection member 125.

The electrical connection member 125 created in this way is
Shown in Figures (b) and (C).

Note that in this example, after the holding body 122 was alumite-treated, the metal wire 121 was passed through and the resin 123 was cured, but the alumite treatment may be performed after the resin 123 is cured. Alternatively, the resin 123 may be uniformly applied to the metal wire 121 and passed through the hole 142 of the holder 122.

Further, the metal wire 121 may be cut in a step before or after the alumite treatment.

Further, in this example, the resin 123 is inserted between the metal wire 121 and the aluminum 122, but any electrically insulating material may be used instead of the resin 123. Furthermore, resin 12
3, the metal wire 121 may be in direct contact with the alumite film of the aluminum 122. In this case, the alumite treatment is performed before passing the metal wire 121 through.

Further, polishing may be performed to eliminate wobbling of the gold B wire 121 after cutting, and furthermore, other methods may be used to eliminate wobbling instead of polishing.

Although this example shows an example in which alumite treatment was performed, since the resin 123 alone serves as an insulating material, alumite treatment may also be performed.

In the electrical connection member 125 created in this way,
The gold fi wire 121 constitutes the metal member 107, and the resin 123
and an alumite film constitute the insulating material 140, and the holding body 1
22, the insulating material 140, and the metal member 107 constitute an electrical connection member 125.

In this electrical connection member 125, metal wires 121 serving as metal members are electrically insulated from each other by resin 123. Further, one end of the metal wire 121 is exposed to the circuit board 101 side, and the other end is exposed to the circuit board 104 side. These exposed portions become connection portions 108 and 109 to the circuit boards 101 and 104, respectively.

Next, the first circuit board 101, the electrical connection member 125,
A second circuit board 104 is prepared. As shown in FIG. 1, the circuit boards 101 and 104 used in this example have a large number of connection parts 102 and 105 therein.

Note that the connection portion 102 of the first circuit board 101 is connected to the connection portion 105 of the second circuit board 104 and the electrical connection member 12.
Metal is exposed at positions corresponding to the connection parts 108 and 109 of No. 5.

Connecting portion 102 of first circuit board 101 and connecting portion 108 of electrical connecting member 125, or
Connection part 1 between the connection part 105 of 04 and the electrical connection member 125
Perform positioning so that 09 corresponds, and after positioning,
Either one is connected by alloying, and the other is connected by another method.

Here, the first circuit board 101, the electrical connection member 1
25. There are the following two methods for connecting the second circuit board 104, and either method may be used.

■ After positioning the first circuit board 101 and the electrical connection member 125, and then alloying and connecting the connection part 102 of the first circuit board 101 and the connection part 108 of the electrical connection member 125, A method in which the circuit board 104 of the second circuit board 104 is positioned, and the connection portion 105 of the second circuit board 104 and the connection portion 109 of the electrical connection member 125 are pressed and connected.

■ After positioning the second circuit board 104 and the electrical connection member 125, and after alloying and connecting the connection part 105 of the second circuit board 104 and the connection part 109 of the electrical connection member 125, A method in which the first circuit board 101 is positioned, and the connection portion 102 of the first circuit board 101 and the connection portion 108 of the electrical connection member 125 are pressed and connected.

When the connection state of the electric circuit member produced as described above was examined, it was found that the connection was highly reliable.

(Second example) FIG. 3 shows a second embodiment.

In this example, a circuit board 51 is used as a first electric circuit component having a connection part 52, and a semiconductor element 4 having a large number of connection parts 5 therein is used as a second electric circuit component.

Note that as the electrical connection member 125, one having dimensions corresponding to the semiconductor element 4 was used.

Other points are similar to the first embodiment.

In this example as well, the connection section was connected with high reliability.

(Third example) FIG. 4 shows a third embodiment.

In this example, the first electric circuit component is the semiconductor element 4, and the second electric circuit component is the circuit board 51.

Note that after connection, the lead frame 1 is placed on the top surface of the circuit board 51.
were connected and sealed with a sealing material 63.

Other points are similar to the first embodiment.

In this example as well, the connection section was connected with high reliability.

(Fourth example) FIG. 5 shows a fourth embodiment.

In this example, the first electric circuit component is a semiconductor element 4',
This is an example in which the second electric circuit component is the semiconductor element 4. In this example, an electrical connection member with dimensions corresponding to the semiconductor element 4 is used, and the lead frame l is connected to the first electrical connection member 125. It is connected to the metal member exposed on the 4° side of the semiconductor element.

The rest is the same as the third embodiment.

In this example as well, the connection section was connected with high reliability.

(Fifth example) FIG. 6 shows a fifth embodiment.

In the fifth embodiment, a circuit board 101 is used as a first electric circuit component and a second electric circuit component, and the portions other than the connecting portions are covered with insulating films 103 and 106.

This is an example in which 104 is used.

Further, as an electrical connection member, one shown in FIG. 7 was used. That is, as shown in FIG. 7, there is an electrical connection member 12 in which a metal member 107 is embedded in a holder 122 made of metal or an alloy through a resin 123 which is an insulating material.
5, the exposed part of the metal member 107 is attached to the holder 12
It sticks out from two sides. Such an electrical connection member 1
25 may be created, for example, by the following method.

First, as in the method described in the first embodiment, after passing the metal wire 121 through the hole of the holding body 122 made of aluminum, applying resin to a thickness of 1101 L or more thicker than the surface of the holding body 122, and then hardening the resin. let After that, cutting is performed at a position protruding about 10 pLm from the surface of the holder 122.Next, the applied resin is removed by etching, and the holder 122 is cut.
An electrical connection member 125 in which the metal fi 121 protrudes by 10 mm from the surface of 22 is obtained.

Note that in this embodiment, the amount of protrusion of the metal wire 121 was set to 10 Bm, but any amount may be used.

Furthermore, the method for making the metal wire 121 protrude is not limited to etching, and other chemical or mechanical methods may be used.

Other points are similar to the first embodiment.

Note that the protruding portion and the electrical connection member 125 are connected to the metal wire 121.
A bump 150 as shown in FIG. 8 may be formed by inserting the metal wire 121 into a mold having a recess at the position and crushing the protrusion 126 of the metal wire 121.

In this case, the metal wire 121 becomes difficult to fall off from the holder 120.

In this example as well, the metal wire 121 constitutes the metal member 107, further constitutes the holder 122- made of aluminum, and the alumite skin g (not shown) and the resin 123 constitute the insulating substance 140.

Note that the bumps may be created by melting the protrusions with heat, or any other method may be used.

In this example as well, the connection section was connected with high reliability.

(6th example) FIG. 9 shows a sixth embodiment.

In this example, a semiconductor element 4 is used as the first electrical circuit component, and a lead frame I is used as the second electrical component.

Other points are similar to the fifth embodiment.

In this example as well, the connection section was connected with high reliability.

(Seventh Example) A seventh embodiment is shown in Fig. 1θ.

In this example, the electrical connection member 125 is different from the electrical connection member shown in the fifth embodiment. That is, in the electrical connection member 125 of this example, the pitch between the metal members is narrower than that shown in the fifth example. That is, in this example, the pitch between the metal members 107 is set to be narrower than the interval between the first circuit board connecting portions.

That is, in the fifth embodiment, the first circuit board lot and the second
An electrical connection member 125 is located at the connection position with the circuit board 104.
Because the connection position was arranged.

Although it was necessary to position the electrical connection member 125, in this example, the first circuit board 101 and the second circuit board 104
Although positioning with the electrical connection member 125 is necessary, positioning with the electrical connection member 125 is not necessary. Therefore, the first circuit board 1
01 and the second circuit board 104 (dll, Fi
It is also possible to connect without positioning by selecting appropriate values for the connection dimensions (d12.PI3) of the electrical connection member.

In this example, a holder made of aluminum was anodized to form an anodized film, and this film was used as an insulating material.

In this example as well, the connection section was connected with high reliability.

(Eighth Example) FIG. 11 shows an electrical connection member used in the eighth example.

FIG. 11(a) is a perspective view of the electrical connection member, FIG.
b) is a sectional view of the electrical connection member.

An example of making such an electrical connection member will be described below.

First, an electrical connection member 12 in which a metal member is embedded in a holder via an insulating material by the manufacturing method shown in the first embodiment.
Prepare three pieces of 8, 129, and 130.

The position of the gold N wire 121 in the first sheet 128 is m row and n column, m
It is displaced from the center by a and nb. The position of the metal wire 121 in the second sheet 129 is in the mth row and nth column, and is displaced from the center by mac and nbc. 3rd piece 130 gold Ji! m121
is located in m rows and n columns, displaced from the center by mad and nbd. a.

The values of b, c, and d are such that the upper and lower gold fi 121 are electrically conductive, but the left and right sides are not electrically conductive with each other. The three electrical connection members are positioned and laminated using a method such as thermocompression bonding to create the electrical connection member 125.

In addition, in this example, the positions of the metals of the electrical connection members were selected according to rules such as m rows and n columns, but the metals on the top and bottom were conductive, and the left and right sides were not electrically conductive with each other. It can be random if you do.

In addition, although this example describes the case where three layers are laminated, two
Any number of sheets may be used as long as it is more than one sheet. Further, although it has been described that the layers are laminated using a thermocompression bonding method, methods such as compression bonding and adhesion may also be used. Furthermore, the electrical connection member of this example is processed to form a seventh
A protrusion may be provided as shown in the figure, or a bump 150 may be provided as shown in FIG.

In this example as well, the connection section was connected with high reliability.

(Ninth Example) FIG. 12 shows an electrical connection member used in the ninth example.

FIG. 12(a) is a cross-sectional view of the electrical connection member during manufacture;
FIG. 12(b) is a perspective view of the electrical connection member,
Figure (C) is the above sectional view.

An example of manufacturing the electrical connection member 125 according to this embodiment will be described.

A hole 142 having a diameter larger than 20 μmφ is made in the holder 122 which has been coated with an insulating film ax in advance. Then 20 in hole 142
Metal wire 121 made of metal or alloy such as gold with μmφ
The resin 123 is put between the holder 122 and the metal wire 121 by passing it through, and the resin 123 is cured. Hardened resin 12
3 and the insulating film become an insulating material. After that, the metal wire 121
A dotted line continuous member 125 is shown in FIGS. 12(b) and 12(C).

Further, the electrical connection member of this example may be processed to provide a protrusion as shown in FIG. 7, or a bump 150 as shown in FIG. 8.

The first circuit component and the second electric circuit component of this example are:
Each of them is one of circuit base materials such as a semiconductor element, a circuit board, and a lead frame.

In this example as well, the connection section was connected with high reliability.

[Effects of the Invention] Since the present invention is configured as described above, the following numerous effects can be obtained.

1. Highly reliable connections can be obtained when connecting semiconductor elements to circuit substrates such as circuit boards and lead frames. Therefore, the conventionally used wire bonding method, TAB
It becomes possible to replace the CCB method.

2. According to the present invention, the connection part of the electric circuit component can be placed in any position (especially inside), so it is possible to connect at more points than the wire bonding method or the TAB method, and it is suitable for connection with a large number of pins. This is the method.

Further, since the presence of an insulating material between adjacent metals of the electrical connection member prevents electrical conduction between adjacent metals, more multi-point connections are possible than in the CCB method.

3. Since the amount of metal members used in the electrical connection member is small compared to the conventional one, even if expensive metal such as gold is used for the metal member, it will be cheaper than the conventional one.

4. High-density semiconductor devices and the like can be obtained.

5. By selecting a material with good thermal conductivity as the electrical insulating material of the electrical connection member, the heat dissipation from the electric circuit components becomes good, and as a result, a semiconductor device with good heat dissipation can be obtained. In particular, in the present invention, since the electrical connection member is made of metal or an alloy except for the contact portion with the metal member, a semiconductor device with particularly good heat dissipation properties can be obtained.

6. Since the holder of the electrical connection member is made of metal or alloy, it can reduce electromagnetic noise from the electrical circuit components to the outside or noise intrusion from the outside into the electrical circuit components, and has good characteristics. A highly reliable electric circuit member and thus a semiconductor device can be obtained.

7. One of the electric circuit components can be detachably attached. In addition, it is possible to connect electrical circuit parts whose quality would otherwise deteriorate when alloyed without causing deterioration.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing a first embodiment. Figure 1(a)
1 shows the state before connection, FIG. 1(b) shows the state after connection, and FIG. 2 is a diagram for explaining an example of a manufacturing method of the electrical connection member used in the first embodiment. , Figure 2(a)
2(b) is a perspective view, and FIG. 2(c) is a sectional view. FIG. 3 shows a second embodiment, with FIG. 3(a) being a perspective view and FIG. 3(b) being a sectional view. FIG. 4 is a sectional view showing the third embodiment. FIG. 5 is a sectional view showing the fourth embodiment. 6 shows a fifth embodiment, FIG. 6(a) is a sectional view showing the state before connection, and FIG. 6(b) is a sectional view showing the state after connection. FIGS. 7 and 8 also show the fifth embodiment, with FIGS. 7(a) and 8(a) being perspective views, and FIGS. 7(b) and 8(b) being sectional views. It is. 9 shows a sixth embodiment, FIG. 9(a) is a perspective view showing the state before connection, and FIG. 9(b) is a sectional view showing the state after connection. FIG. 1O is a sectional view showing the seventh embodiment i,
Figure 1θ (a) shows the state before connection, Figure 1θ (b)
indicates the state after connection. FIG. 11 shows an electrical connection member according to the eighth embodiment, and FIG. 11(a) is a perspective view,
FIG. 11(b) is a sectional view. FIG. 12 shows an example of manufacturing an electrical connection member according to the ninth embodiment, and FIG.
) and (c) are cross-sectional views, and FIG. 12(b) is a perspective view. 13 to 20 show conventional examples, and except for FIG. 1 and 14, they are cross-sectional views, and FIG. 14 is a plan perspective view. 1- Lead frame, element mounting part of 211# lead frame, 3 Silver paste, 4.4' Semiconductor element,
5, 5' - Connection part of semiconductor element, 6 - Connection part of lead frame, 7 - Ultra-fine metal wire, 8 - Resin, 9 - Semiconductor device, lO - - Outer periphery of semiconductor element, 11 ...Outer periphery of the element mounting part of the lead frame, 16..Carrier film substrate, 17..Inner lead portion of carrier film substrate, 20..Resin, 21..Resin, 31..
Solder bump, 32... board, 33... connection part of board, 5
1-1 circuit board, 52... connection part of circuit board, 54 connection part of electric connection member, 55... lead frame, 6
3. Sealing material, 70°70'φ, metal material, 71.71'
Fist: Insulating film, 72, 72': Exposed surface of insulating film, 73, 73'...Exposed surface of metal material, 75.75°
・・Circuit base material, 76.76° ・・Connection part of circuit base material, 77・・Insulating material of anisotropic conductive film, 78・・Fist anisotropic conductive film, 79−・・Conductive particles, 81・・・Elastic Insulating material of connector, 82... Metal wire of elastic connector, 83... Elastic connector, 101φ, circuit board, 102... Connection part, 103... Insulating film, 106... Insulating film, 104... Circuit board, 105・Conflict Connection Department, 107
Metal member, 108... Connection part, 109... Connection part, 11
1... Holder, 121... Metal wire, 122... Insulating material (aluminum), 123... Resin, 124... Dotted line,
125...Electrical connection member, 126...Protrusion, 128,
129, 130... Electrical connection member, 140... Insulating material, 142... Hole, 150... Bump. Figure 1 (0) Figure 1 (b) Figure 3 (a) Figure 3 (b) Figure 4 Figure 5 Figure 6 (0) Figure 6 (b) Figure 8 (a) Figure 8 Figure (b) Figure 9 (a) Figure 10 (a) Figure 10 (b) Figure 11 (0) +1t (b) Whistle 13 Figure 12 (a) Figure 14 Figure 15 Figure 16 Figure 17 Figure 18 Figure 72 7
1'72'4' Figure 19 Figure 20

Claims (1)

[Claims] 1. An electrical connection member for electrically connecting a first electrical circuit component having a connecting portion and a second electrical circuit component having a connecting portion; In an electric circuit member that is interposed between the two and connected at a connecting portion of both electric circuit components, the electric connection member connects a plurality of metal members made of metal or an alloy to one end of the metal member. is exposed to the first electrical component side, while the other end of the metal member is exposed to the second electrical circuit component side, and is embedded in a holder made of metal or alloy with an insulating material interposed therebetween. The connecting portion of the first electric circuit component and one end of the metal member exposed on the side of the first electric circuit component are connected by alloying, or the connecting portion of the second electric circuit component and the end of the metal member exposed on the side of the first electric circuit component are connected by alloying. An electric circuit member, characterized in that the metal member is connected to one end of the metal member exposed on the side of the electric circuit component of No. 2 by alloying. 2. The electric circuit member according to claim 1, wherein the first electric circuit component and the second electric circuit component are each one of a semiconductor element, a circuit substrate such as a circuit board, or a lead frame. 3. The electric circuit member according to claim 1, wherein the insulating material is an anodic oxide film formed by anodizing the holding body.