JPS63224235A - Electric circuit member - Google Patents

Abstract

PURPOSE:To obtain a mechanically strong and very low-fraction defective electric circuit member by a method wherein both of electric circuit components are alloyed through an electrical connection member to connect firmly and reliably the fellow electric circuit components. CONSTITUTION:An electrical connection member 125 is made by a method wherein the respective fellow metal members 107 of a plurality of metal members 107 consisting of a metal or an alloy are electrically insulated, each one end of the members 107 is made to expose on the side of a first circuit board 101, while each other end of the members 107 is made to expose on the side of a second circuit board 104, the members 107 are buried in an insulator 111 to constitute the member 125 and moreover, the insulator 111 is provided with holes to be opened on its outside. The board 101 and the members 107 are connected to each other by alloying connection parts 102 of the board 101 and each one end of the members 107, which is exposed on the side of the board 101, and the board 104 and the members 107 are connected to each other by alloying connection parts 105 of the board 104 and each one end of the members 107, which is exposed on the side of the board 104. Thereby, as the fellow electric circuit components are connected firmly and reliably, an electric circuit member is mechanically strong and its fraction defective becomes very low.

Description

[Detailed description of the invention] [Industrial application field] TECHNICAL FIELD The present invention relates to electrical circuit members.

[Prior Art] Conventionally, the following techniques are known as techniques related to electric circuit members configured by electrically connecting electric circuit components.

■Wire bonding method Figures 13 and 14 show typical examples of semiconductor devices connected and sealed by the wire bonding method. Explain how.

In this method, the semiconductor element 4 is fixedly supported on the element mounting part 2 using Ag paste 3 or the like, and then the connection part 5 of the semiconductor element 4 and the desired connection part 6 of the lead frame 1 (7) are connected with gold or the like. This is a method of electrically connecting using an ultra-fine metal 117.

After the connection, the semiconductor element 4 and the lead frame 1 are sealed using a resin 8 using a method such as transfer molding, and then the unnecessary portion of the lead frame 1 extending outward from the resin-sealed part is cut off. , bend the semiconductor device 9 into the desired shape.
make.

■T A B (Tape Automated Bo
FIG. 15 shows a typical example of a semiconductor device connected and sealed by the TAB method.

This method is an automatic bonding method using a tape carrier method. That is, to explain based on FIG. 15, after positioning the carrier film substrate 16 and the semiconductor element 4, the inner lead part 17 of the carrier film substrate 16 and the connecting part 5 of the semiconductor element 4 are connected by thermocompression bonding. This is the way to do it. After the connection, the semiconductor device 9 is sealed with resins 20 and 21.

■CCB (C: controlled Co11aps
e Bonding) law (e.g., Special Publication Act 1972-20)
(No. 96, Japanese Unexamined Patent Publication No. 60-57944) FIG. 16 shows a typical example of a semiconductor device connected and sealed by the CCB method. This method will be explained based on FIG. 16. The Kiura method is also called the flip chip bonding method.

A solder bump 31 is provided in advance at the connection f+II5 of the semiconductor element 4, and the semiconductor element 4 provided with the solder bump 31 is positioned and mounted on one circuit board 32.

Thereafter, the semiconductor element 4 is connected to the circuit board 32 by heating and melting the solder, and the semiconductor device 9 is manufactured by sealing after washing with flux.

■The method shown in i17 and FIG. 18, that is, an insulating film 71 made of polyimide or the like is formed on the part of the first semiconductor element 4 other than the connection part 5, and a metal material 70 made of Au or the like is provided in the connection part 5. First, the exposed surfaces 73 and 72 of the metal material 70 and the insulating film 71 are flattened. On the other hand, an insulating film 71' made of polyimide or the like is formed on a portion of the second semiconductor element 4' other than the connection part 5'', a metal material 70' made of Au or the like is provided on the connection part 5', and then a metal material 70' made of Au or the like is provided on the connection part 5'. material 70° and exposed surfaces 73', 7 of the insulating film 71'
Flatten 2'.

Thereafter, as shown in FIG. 18, the first semiconductor element 4 and the second semiconductor element 4' are positioned, and after positioning, the connection part 5 of the first semiconductor element 4 and the second The connecting portion 5' of the semiconductor element 4' is made of metal material 70.70'
Connect via.

■The method shown in FIG. 19, that is, the first circuit substrate 75 and the second circuit substrate 75''
An anisotropic conductive film 7B in which conductive particles 79 are dispersed in an insulating material 77 is interposed between the first circuit base material 75 and the second circuit base material 75.
After positioning the circuit board at 75°, apply pressure or
By applying pressure and heating, the connection portion 76 of the first circuit substrate 75 and the second
This is a method of connecting a connecting portion 76' at a 75° angle of a circuit board.

■The method shown in FIG. 20, that is, the first circuit substrate 75 and the second circuit substrate 75°
After positioning the first circuit base material 75 and the second circuit base material 75° by interposing an elastic connector 83 in which metallic silver 82 such as Fe or Cu is arranged in a certain direction in an insulating material 81, , and pressurize the connecting portion 7 of the first circuit board 75.
6 and the connecting portion 76° of the second circuit board 75°.

[Problems to be Solved] The conventional bonding method described above has the following problems.

■ Wire bonding method ■ If the connection part 5 of the semiconductor element 4 is designed to be inside the semiconductor element 4, the ultrafine metal wire 7 has an extremely small wire diameter, It becomes easier to contact the outer peripheral edge 11 of the element mounting portion 2 of the lead frame 1. The ultra-fine metal wire 7 is attached to these outer peripheral edges 10 to 11.
It will short circuit if it comes into contact with. Furthermore, the length of the ultra-fine metal wire 7 has to be increased, and when the length is increased, the ultra-fine metal wire 7 becomes easily deformed during transfer molding.

Therefore, the connecting portion 5 of the semiconductor element 4 needs to be placed around the semiconductor element 4, and is subject to limitations in one circuit design.

■In the wire bonding method, adjacent ultra-fine gold E
In order to avoid contact between 17, the pitch dimension of the connecting parts 5 on the semiconductor element 4 (distance between the centers of adjacent connecting parts)
Therefore, when the size of the semiconductor element 4 is determined, the maximum number of the connecting portions 5 is inevitably determined.

However, in the wire bonding method, the pitch dimension is usually as large as about 0.2 mm, so the number of connecting portions 5 must be reduced.

■Extremely fine metal &I1 measured from the connection part 5 on the semiconductor element 4
The height h of 7 is usually 0.2 to 0.4 mm, but 0.2
Since it is relatively difficult to reduce the thickness to less than mm, it is not possible to reduce the thickness.

■Wire bonding takes time. In particular, when the number of connection points increases, the bonding time increases and production efficiency deteriorates.

- If the transfer molding condition range is exceeded for some reason, the ultrafine metal wire 7 may be deformed or, in the worst case, may be cut.

Furthermore, in the connection portion 5 on the semiconductor element 4, A! is not alloyed with the ultrafine metal wire 7! ; Since L is exposed, corrosion of A is likely to occur, resulting in a decrease in reliability.

■TAB method■ If the connecting part 5 of the semiconductor element 4 is designed to be inside the semiconductor element, the length of the inner lead part 17 of the carrier film substrate 16 becomes longer, and the inner lead part 17 becomes easily deformed. The inner lead portion may not be connected to the desired connection portion 5, or the inner lead portion 17 may come into contact with a portion of the semiconductor element 4 other than the connection portion 5. In order to avoid this, it is necessary to bring the connecting portion 5 of the semiconductor element 4 to the periphery above the semiconductor element 4, which is subject to design limitations.

■Even in the TAB method, the pitch dimension of the connection parts on the semiconductor element 4 must be approximately 0.09 to 0.15 mm.
Therefore, similar to the problem (2) of the wire bonding method, it is difficult to increase the number of connections.

(2) In order to prevent the inner lead portions 17 of the carrier film substrate 16 from coming into contact with portions other than the connection portions 5 of the semiconductor element 4, a desired connection shape of the inner lead portions 17 is required, which increases costs.

(2) In order to connect the connecting portion 5 of the semiconductor element 4 and the inner lead portion 17, gold bumps must be attached to the connecting portion 5 of the semiconductor element 4 or the connecting portion of the inner lead portion 17, which increases the cost.

■ CCB method ■ Solder bumps 31 must be formed on the connection portions 5 of the semiconductor element 4, which increases costs.

■If the amount of solder on a bump is large, bridges (a phenomenon in which adjacent solder bumps come into contact with each other) will occur between adjacent solder bumps.
On the other hand, if the amount is too small, the connecting portion 5 of the semiconductor element 4 and the connecting portion 33 of the substrate 32 will not be connected and electrical continuity will not be established. In other words, the reliability of the connection becomes low. Furthermore, the amount of solder and the solder shape of the connection affect the reliability of the connection! (Brazing Technology Research Group Technical Data, No. 017-'84, Published by Brazing Technology Research Group).

As described above, the amount of solder bumps 31 needs to be controlled because the amount of solder bumps affects the reliability of the connection.

(2) If the solder bumps 31 are present inside the semiconductor element 4, it becomes difficult to visually inspect whether or not the connection has been made well.

■Poor heat dissipation characteristics of semiconductor elements (reference material; Elect
ronic Packaging Technology
y 1987.1 (Vol.

3, No, l) P, 68-71. NIKKEI M
ICRO[]EVICE'J, May 1988, P.
97 to 08), a great deal of effort is required to improve the heat dissipation characteristics.

■Technique shown in FIGS. 17 and 18■Exposed surface 72 of insulating film 71 and exposed surface 73 of metal material 70,
Furthermore, the exposed surface 72' of the insulating film 71' and the exposed surface 73' of the metal material 70' must be made flat, which increases the number of steps and costs.

■If there are irregularities between the exposed surface 72 of the insulating film 71 and the exposed surface 73 of the metal material 70, or the exposed surface 72' of the insulating film 71' and the exposed surface 73' of the metal material 70', the metal material 70 and the metal material 70° 2 will not connect and reliability will decrease.

■Technology shown in Fig. 19■ After positioning, when applying pressure to connect the connecting portion 76 and the connecting portion 76', it is difficult to apply constant pressure, resulting in variations in the connection state, resulting in VC connection. The variation in contact resistance value between parts becomes large. Therefore, the reliability of the connection becomes poor.

In addition, when a large amount of current is passed, phenomena such as heat generation occur, so it is not suitable when a large amount of current is desired to be passed.

■Even if a constant pressure is applied, anisotropic conductivity fi7
The arrangement of the conductive particles 79 of No. 8 increases the variation in resistance value. Therefore, the reliability of the connection becomes poor. Also,
It is not suitable for connections that require large current capacity.

(2) If the pitch between adjacent connecting parts (the distance between the centers of adjacent connecting parts) is narrowed, the resistance value between adjacent connecting parts will decrease, which is not suitable for high-density connections.

■The resistance value changes due to variations in the amount of protrusion hl at the connection part 76.76° of the circuit board 75.75°.
It is necessary to accurately control the amount of variation.

■Additionally, anisotropic conductive films can be used to connect semiconductor elements and circuit substrates,
Furthermore, when used to connect the first semiconductor element and the second semiconductor element, in addition to the disadvantages mentioned above, bumps must be provided at the connection part of the semiconductor element, which increases the cost. occurs.

■Technology shown in Figure 20 ■Pressure is required, and a pressure jig is required.

[Phase] The contact resistance between the metal wire 82 of the elastic connector 83 and the connecting portion 76 of the first circuit substrate 75 and the connecting portion 76 of the second circuit substrate 75' changes depending on the pressing force and surface condition. Therefore, the reliability of the connection is poor.

■Since the metal wire 82 of the elastic connector 83 is a rigid body, if the pressing force is large, the elastic connector 83
If the surfaces of the first circuit base material 75 and the second circuit base material 75' are susceptible to damage, and if the pressing force is low, the reliability of the connection will be poor.

■Furthermore, the connection portions 76.7 of the circuit substrates 75, 75'
6° protrusion ih2 and elastic connector 83
Since the protrusion amount h3 of the metal wire 82 and its dispersion affect the change in resistance value and damage, it is necessary to take measures to reduce the dispersion.

(2) Further, when an elastic connector is used to connect a semiconductor element and a circuit substrate, or to connect a first semiconductor element and a second semiconductor element, the same drawbacks as in (1) to (2) occur.

The present invention solves all of the above-mentioned problems and proposes a new electrical circuit member that is high in density, highly reliable, and low in cost. A high-performance multi-point connection can be obtained, and various properties such as heat can be improved.

(Left below) [Means for Solving the Invention] The present invention provides a first electrical circuit component having a connecting portion and a second electrical circuit component having a connecting portion.
An electric circuit member configured by intervening an electric connecting member for electrical connection between the two electric circuit parts and connecting the two electric circuit parts at the connecting portion.

The electrical connection member includes a plurality of metal members made of metal or an alloy, each of which is electrically insulated from each other, and one end of the metal member is exposed to the first electrical component side. On the other hand, the other end of the metal member is exposed to the electric circuit component side of the f52 and embedded in an insulator, and the insulator has at least one hole opening to the outside. I'm here.

The connecting portion of the first electric circuit component and one end of the metal member exposed on the first electric circuit component side are connected by alloying, and the connecting portion of the second electric circuit component and the second electric circuit component are connected by alloying. The gist lies in an electric circuit member characterized in that it is connected to one end of a metal member exposed on the side of a circuit component by alloying it.

Examples of the electric circuit components in the present invention include semiconductor elements, resin circuit boards, ceramic tS plates, circuit boards such as metal boards (hereinafter sometimes simply referred to as circuit boards), lead frames, and the like. That is, any one of these components may be used as the first electrical circuit component, and any one of these components may be used as the second electrical circuit component.

The object of the present invention is a component having a connection part as an electric circuit component. Although the number of connection parts does not matter, the greater the number of connection parts, the more remarkable the effects of the present invention will be.

Further, although the location of the connection portion does not matter, the effect of the present invention becomes more pronounced as the connection portion is located inside the electric circuit component.

In the present invention, a first electrical circuit component and a second electrical circuit component are connected using an electrical connection member.

The electrical connection member according to the present invention is constructed by embedding a plurality of metal members in an insulator. The metal members are each insulated by an insulator, and one end of the metal member is exposed to the first electric circuit component side, and the other end is exposed to the second electric circuit component side. Furthermore, the insulator has at least one hole opening to its exterior.

Here, as the material of the metal member, gold is preferable, but any metal or alloy other than gold may also be used. For example, Cu, Al, Sn.

Examples include metals or alloys such as Pb-5n.

Furthermore, the cross section of the metal member can be circular, square, or any other arbitrary shape.

Further, the thickness of the metal member is not particularly limited, and may be set to 1, for example, 20 ALmφ or more or 20 gmφ or less, taking into consideration the pitch of the connecting portions of the electric circuit components.

Note that the exposed portion of the metal member may be on the same surface as the insulator, or it may be made to protrude from the surface of the insulator. It may be made into a shape.

Furthermore, the spacing between the metal members may be the same as the spacing between the connecting parts of the electrical circuit components, or may be narrower than that, and when the spacing is narrower, the spacing between the electrical circuit components and the electrical connecting members may be the same. It becomes possible to connect the electrical circuit component and the electrical connection member without requiring positioning.

Also, metal members do not need to be placed vertically in the insulator;
It may run obliquely from the first electric circuit component side toward the second electric circuit component side.

Furthermore, the electrical connection member may be composed of one layer or multiple layers of two or more layers.

The electrical connection member may have one or more holes, and the size, shape, and position of the hole should be such that the metal members buried in the insulator come into contact with each other and do not cause a short circuit. If it is within, it is optional.

The hole may penetrate from the first electric circuit component side to the second electric circuit component side, or may be closed. The opening direction of this hole may be parallel to or perpendicular to the direction in which the metal member is exposed.

The insulator of the electrical connection member is not particularly limited as long as it is an insulating material; for example, an insulating resin may be used;
When using a resin, the type of resin does not matter; it may be either a thermosetting resin or a thermoplastic resin. For example, polyimide resin, polyphenylene sulfide resin, polyether sulfone resin, polyetherimide resin, polystyrene resin, silicone. Resin, fluororesin, polycarbonate resin, polydiphenyl ether resin, polybenzylimidazole resin, phenol resin, urea resin, melamine resin, algide resin, epoxy resin, polyamideimide resin, polyproblene resin, polyvinyl chloride resin, polystyrene resin, etc. Resin can be used. Among these resins, it is more preferable to use a resin with good thermal conductivity because even if the circuit board has heat, the heat can be dissipated through the resin. By selecting a material having the same or similar coefficient of thermal expansion as the substrate, it becomes possible to further prevent a decrease in reliability of the device due to thermal expansion/shrinkage.

In the present invention, the connection portion of the first electric circuit component and the first
one end of the metal member of the electrical connection member exposed to the electrical circuit component side is connected by alloying, and the connection portion of the second electrical circuit component and the electrical connection exposed to the second electrical circuit component side. The member is connected to one end of the metal member by alloying the member with one end of the metal member.

That is, in the present invention, both the first electric circuit component and the second electric circuit component are alloyed.

In addition, as an alloying method, for example, the corresponding connection parts may be brought into contact with each other and then heated at an appropriate temperature.Heating causes diffusion of atoms in the connection parts, and a solid solution or metal is formed on the surface of the connection parts. A layer of intercalary compound is formed and the connections are alloyed. In addition, when Au is used for the metal member of the electrical connection member and An is used for the connection part of the electric circuit component, the heating temperature is preferably 200 to 350°C.

[Function] Since the present invention uses the above-mentioned electrical connection member, it is also possible to arrange the connection parts of the electric circuit components inside, and the number of connection parts can be increased. It becomes possible to

Further, the electrical connection member can be made thinner, and from this point of view as well, it is possible to make the electrical connection member thinner.

Furthermore, since the amount of metal members used for the electrical connection member is small, the cost is low even if expensive gold is used as the metal member.

In the present invention, both of the electrical circuit components are alloyed through the electrical connection member, and the electrical circuit components are firmly (strong in terms of strength) and reliably connected to each other. An extremely low cost electric circuit member can be obtained.

Furthermore, since both of the electrical circuit components are alloyed via the electrical connection member, there is no need to use a jig or the like to hold the electrical circuit components during and after the production process of the electrical circuit component. 71! It is easy to create the air circuit member and to manage it after it is created.

Since both of the electrical circuit components are alloyed via the electrical connection member, the contact resistance between the electrical circuit components is smaller than when only one of the electrical circuit components is alloyed.

Furthermore, in the present invention, since the holes are present in the insulator of the electrical connection member, even if heat is applied to the electrical circuit member or the electrical connection member (during the assembly process or during product reliability testing) (heat is applied to), the holes alleviate thermal stress, preventing disconnection of electrical connection members that may occur due to thermal stress, or disconnection or poor contact between electrical connection members and electrical circuit components. can,
It is possible to prevent poor or difficult conduction caused by disconnection or poor contact.

[Example] (First Example) A first example of the present invention will be described based on FIGS. 1 and 2.

In this embodiment, a circuit board 101, which is a first electric circuit component having a connection part 102, and a second circuit board 101 having a connection part 105 are used.
The circuit board 104, which is an electric circuit component of the circuit board 104, is connected to the circuit board 104 by interposing an electrical connection member 125 between them for electrically connecting both the circuit boards 101 and 104.
In an electric circuit component structure configured by connecting at connection portions 102 and 105 of 104.

The electrical connection member 125 electrically insulates the plurality of metal members 107 made of metal or alloy from each other, and connects one end of the metal member 107 to a first
The metal member 1 is exposed on the circuit board 101 side.
07 is embedded in the insulator 111 with the other end exposed to the second circuit board 104 side, and
The insulator 111 has a hole (not shown in FIG. 1) that opens to the outside, and connects the connecting portion 102 of the first circuit board 101 and the metal exposed on the first circuit board 101 side. The connection is made by alloying one end of the member 107, and the connection is made by alloying the connecting portion 105 of the second circuit board 104 and one end of the metal member 107 exposed on the second circuit board 104. It is.

This example will be explained in more detail below.

First, the electrical connection member 125 will be explained while explaining one manufacturing example of the electrical connection member 125.

FIG. 2 shows one manufacturing example.

First, as shown in FIG. 2(a), metal wires 121 made of metal or alloy such as gold and having a diameter of 20 ILmφ are connected at a pitch of 4.
0gm around the rod 122, and after wrapping the rod 12 between the metal wires 121 so as not to touch the metal wires 121.
After that, the metal wire 121 and rod 127 are embedded in a resin 123 such as polyimide, and after embedding, the resin 123 is hardened. The cured resin 123 becomes an insulator. After curing, the rod 127 is removed. Thereafter, the electrical connection member 12 is cut into slices at the dotted line 124.
Create 5. Furthermore, after the rod 127 is removed, a hole 120 is formed at that position.

The electrical connection member 125 created in this way is
Shown in Figures (b) and (C).

In the electrical connection member 125 created in this way,
The metal wire 121 constitutes the metal member 107, and the resin 123 constitutes the insulator 111.

The rod 127 may be the same metal wire as the metal wire 121, or may be made of any other material.The rod 127 may be inserted or wound around the rod 122.Furthermore, the rod 127 may be cut into slices. You can remove it later.

In this electrical connection member 125, metal wires 121 serving as metal members are electrically insulated from each other by resin 123. Further, one end of the metal wire 121 is exposed to the circuit board 101 side, and the other end is exposed to the circuit board 104 side. These exposed portions become connection portions 108 and 109 to the circuit boards 101 and 104, respectively.

Next, the first circuit board 101, the electrical connection member 125,
Preparing the second circuit board 104 The circuit boards 101 and 104 used in this example have a large number of connection parts 102 and 105 therein, as shown in FIG.

Note that the connection portion 102 of the first circuit board lot is connected to the connection portion 105 of the second circuit board 104 and the electrical connection member 12.
Metal is exposed at positions corresponding to the connection parts 108 and 109 of No. 5.

Connecting portion 102 of first circuit board 101 and connecting portion 108 of electrical connecting member 125, or
Connection part 1 between the connection part 105 of 04 and the electrical connection member 125
Perform positioning so that 09 corresponds to 1. After positioning, 1.
Alloy and connect both.

Here, the first circuit board 101, the electrical connection member 1
25. There are the following three methods for connecting the second circuit board 104, and any of these methods may be used.

■First circuit board 101, electrical grounding member 125, second
After positioning the first circuit board 104, the first circuit board 1
01 connection fi 102 and the connection part 108 of the electrical connection member 125, and the connection part 105 of the second circuit board 104.
and the connection portion 109 of the electrical connection member 125 are simultaneously alloyed and connected.
5 and the connecting portion 10 of the first circuit board 101.
2 and the connection portion 10B of the electrical connection member 125 are alloyed and connected, the second circuit board 104 is positioned, and the connection portion 109 of the electrical connection member 125 and the second circuit board 10 are connected.
A method of alloying and connecting the connecting portion 105 of No. 4.

■ After positioning the second circuit board 104 and the electrical connection member 125 and alloying and connecting the connection part 105 of the second circuit board 104 and the connection part 109 of the electrical connection member 1/25, A method of positioning a first circuit board 101 and alloying and connecting the connection part 108 of the electrical connection member 125 and the connection part 102 of the first circuit board 101.

When the connectivity of the connection portions of the electrical circuit members produced as described above was examined, the connections were found to be highly reliable.

In addition, no conduction failure or difficulty occurred due to heating.

(Second example) FIG. 3 shows a second embodiment.

In this example, a circuit board 51 is used as a first electric circuit component having a connection part 52, and a semiconductor element 4 having a large number of connection parts 5 therein is used as a second electric circuit component.

The alloying is performed on the connecting portion 5 of the semiconductor element 4, the connecting portion 52 of the circuit board 51, and the electrical connecting member 125 having the hole 120.
This was done between the connecting portion 54 of the

Note that as the electrical connection member 125 having the hole 120, one having a size corresponding to the semiconductor element 4 was used.

After alloying and connecting, a lead frame 55 was connected to the lower surface of the circuit board 51.

Other points are similar to the first embodiment.

In this example as well, the connection section was connected with high reliability. In addition, no conduction failure or difficulty occurred due to heating.

(Third example) FIG. 4 shows a third embodiment.

In this example, the first electric circuit component is the semiconductor element 4, and the second electric circuit component is the circuit board 51.

Note that after connection, the lead frame 1 is placed on the top surface of the circuit board 51.
were connected and sealed with a sealant 63.

Other points are similar to the first embodiment.

In this example as well, the connection section was connected with high reliability. In addition, heating also causes poor conductivity during the first second.
No condition occurred.

(Fourth example) FIG. 5 shows a fourth embodiment.

In this example, the first electric circuit component is a semiconductor element 4゛,
This is an example in which the second electric circuit component is the semiconductor element 4. In this example, an electrical connection member having a size corresponding to the semiconductor element 4 is used, and the lead frame 1 is connected to the first electrical connection member 125. It is connected to the metal member exposed on the semiconductor element 4' side.

The rest is the same as the third embodiment.

In this example as well, the connection section was connected with high reliability. In addition, there were no problems with poor conductivity or difficulties due to heating.

(Fifth example) FIG. 6 shows a fifth embodiment.

The fifth embodiment is an example in which circuit boards 101 and 104 whose parts other than the connecting portions are covered with insulating films 103 and 106 are used as the first electric circuit component and the second electric circuit component. .

Further, as an electrical connection member, one shown in FIG. 7 was used. That is, in the electrical connection member 125 having the hole 120 shown in FIG. 7, the exposed portion of the metal member 107 protrudes from the surface of the resin insulator 111. The electrical connection member 125 may be created by, for example, the following method.

First, by the method described in the first embodiment, as shown in FIG. 2(b),
After preparing the electrical connection member shown in (c), both surfaces of the electrical connection member may be etched until the metal wire 121 protrudes from the polyimide resin 123 by about 10 m.

Note that in this embodiment, the protrusion amount of the metal wire 121 is 1101L.
However, any amount may be used.

Furthermore, the method for making the metal wire 121 protrude is not limited to etching, and other chemical or mechanical methods may be used.

Other points are similar to the first embodiment.

Note that the protruding portion and the electrical connection member 125 are connected to the metal wire 121.
A bump 150 as shown in FIG. 8 may be formed by inserting the metal wire 121 into a mold having a recess at the position and crushing the protrusion 126 of the metal wire 121.

In this case, the metal wire 121 becomes difficult to fall off from the insulator 111.

In this example as well, the metal 1ji 121 constitutes the metal member 107, and the resin 123 constitutes the insulator 111.

Note that the bumps may be created by melting the protrusions with heat, or any other method may be used.

In this example as well, the connection section was connected with high reliability. In addition, even with heating, there was no problem of poor conductivity.

(6th example) FIG. 9 shows a sixth embodiment.

In this example, a semiconductor element 4 is used as the first electrical circuit component, and a lead frame 1 is used as the second electrical component.

Other points are similar to the fifth embodiment.

In this example as well, the connection section was connected with high reliability. In addition, even with heating, there was no problem of poor conductivity.

(Seventh Example) FIG. 10 shows a seventh embodiment.

In this example, the electrical connection member 125 is different from the electrical connection member shown in the fifth embodiment, that is, the electrical connection member 125 of this example is different from the electrical connection member shown in the fifth embodiment.

The pitch between the fully bent members is narrower than that shown in the fifth embodiment. That is, in this example, the pitch between the metal members 107 is set to a spacing that is more precise than the spacing between the first circuit board connecting portions.

That is, in the fifth embodiment, the first circuit board 101 and the second
An electrical connection member 125 is located at the connection position with the circuit board 104.
Because the connection position was arranged.

Although it was necessary to position the electrical connection member 125, in this example, the first circuit board 101 and the second circuit board 104
Although positioning with the electrical connection member 125 is necessary, positioning with the electrical connection member 125 is not necessary. Therefore, the first circuit board l
Connection dimensions between O1 and second circuit board 104 (dll, pH
) and the connection dimensions (d12.PI3) of the electrical connection member to appropriate values, it is also possible to connect without positioning.

In this example as well, the connection section was connected with high reliability. In addition, the π state of poor or difficult conduction did not occur even after heating.

(Eighth Example) FIG. 11 shows an electrical connection member used in the eighth example.

FIG. 11(a) is a perspective view of the electrical connection member, FIG.
b) is a sectional view of the electrical connection member.

An example of making such an electrical connection member will be described below.

First, three electrical connection members 128, 129, and 130 having holes 120 are prepared using the manufacturing method shown in the first embodiment.

The position of the metal wire 121 in the first sheet 12B is m row and n column, m
It is displaced from the center by a and nb. The position of the metal wire 121 in the second sheet 129 is in the mth row and nth column, and is displaced from the center by mac and nbc. The position of the metal wire 121 in the third sheet 130 is m rows and n columns, and is displaced from the center by mad and nbd.The values of a, b, c, and d indicate that the upper and lower metal wires 121 are electrically conductive, but the left and right sides are electrically connected to each other. It takes a value that does not cause electrical conduction. The three electrical connection members are positioned and layered using a method such as thermocompression bonding to create the electrical connection member 125.

In addition, in this example, the positions of the metals of the electrical connection members were selected according to rules such as m rows and n columns, but the metals on the top and bottom were conductive, and the left and right sides were not electrically conductive with each other. It can be random if you do.

In addition, although this example describes the case where three layers are laminated, two
Any number of layers may be used as long as the electrical connection member of this example is processed.Although it has been described that the layers are planted using a thermocompression bonding method, methods such as compression bonding or gluing may also be used. 7th
A protrusion may be provided as shown in the figure, or a bump 150 may be provided as shown in FIG.

In this example as well, the connection section was connected with high reliability. In addition, even with heating, there was no problem of poor conductivity.

(Ninth Example) FIG. 12 shows an electrical connection member used in the ninth example.

FIG. 12(a) is a cross-sectional view of the electrical connection member during manufacture;
FIG. 12(b) is a perspective view of the electrical connection member,
Figure (c) is the above sectional view.

First, metal wire guide plates 131 and 132 are prepared. Then, the metal wire 121 and rod 127 are passed through desired holes 133 and 134 made in the metal wire guide plates 131 and 132, and stretched to a desired tension. After that, the metal wire guide plate 131.1
Resin 123 is poured between 32 and hardened. after that,
Remove the rod 127. After that, remove the information board and
Electrical connection member 125 is created. After removing the rod 127, a hole 120 is formed at that position. In addition, rod 12
7 may be the same metal wire as the metal 1!121 mentioned above,
Any other material may also be used.

Further, the rod 127 may be removed after removing the guide plate, or the electrical connection member of this example may be processed to form the seventh
A protrusion may be provided as shown in the figure, or a bump 150 may be provided as shown in FIG.

The first circuit component and the second electric circuit component of this example are:
Each of them is one of circuit base materials such as a semiconductor element, a circuit board, and a lead frame.

In this example as well, the connection section was connected with high reliability. In addition, no conduction failure or difficulty occurred due to heating.

[Effects of the Invention] Since the present invention is configured as described above, the following numerous effects can be obtained.

1. Highly reliable connections between semiconductor elements and circuit substrates such as circuit boards and lead frames can be obtained. Therefore, the conventionally used wire bonding method, TAB
It becomes possible to replace the CCB method.

2. According to the present invention, the connection part of the electric circuit component can be placed in any position (especially inside), so it is possible to connect at more points than the wire bonding method or the TAB method, and it is suitable for connection with a large number of pins. This is the method.

Furthermore, due to the presence of an insulating material between adjacent metals of the electrical connection member, there is no electrical conduction between the adjacent metals.
More multi-point connections are possible than with the CB method.

3. Since the amount of metal members used in the electrical connection member is small compared to the conventional one, even if expensive metal such as gold is used for the metal member, it will be cheaper than the conventional one.

4. High-density semiconductor devices and the like can be obtained.

5. Both electrical circuit components are alloyed through electrical connection members, making them strong (strong in terms of strength)
In addition, since the connection is reliable, it is possible to obtain an electrical circuit member that is mechanically strong and has an extremely low defective rate.

6. Since both the electrical circuit components are alloyed via the electrical connection member, there is no need to use a jig or the like to hold the electrical circuit components during and after the production process of the electrical circuit components. It is easy to create electric circuit members and to manage them after they are created.

7. Since both of the electrical circuit components are alloyed via the electrical connection member, the contact resistance between the electrical circuit components is smaller than when only one of them is alloyed.

8. By selecting a material with good thermal conductivity as the electrical insulating material of the electrical connection member, heat dissipation from the electric circuit components becomes good, and a semiconductor device with good heat dissipation can be obtained.

Even if heat is applied to the 9.7ft air circuit member or electrical connection member, the holes will alleviate thermal stress and prevent disconnection and poor contact of metal members that may occur due to thermal stress. can. Note that this effect is remarkable when there is a difference in coefficient of thermal expansion between the first electric circuit component and the second electric circuit component.

Of course, a highly reliable semiconductor device can be obtained by selecting a material having the same or similar coefficient of thermal expansion as the semiconductor element and the circuit substrate as the electrically insulating material of the electrical connection member.

By embedding or laminating other substances in the insulator of the electrical connection member, an electrical circuit member with good heat dissipation, low stress, and shielding efficiency can be obtained.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing a first embodiment. Figure 1(a)
2 shows the state before connection, and FIG. 2(b) shows the state after connection. FIG. 2 is a diagram for explaining an example of a manufacturing method of the electrical connection member used in the first embodiment. , Figure 2(a)
is a sectional view, FIG. 2(b) is a perspective view, and FIG. 2(C) is a sectional view. FIG. 3 shows a second embodiment, with FIG. 3(a) being a perspective view and FIG. 3(b) being a sectional view. FIG. 4 is a sectional view showing the third embodiment. FIG. 5 is a sectional view showing the fourth embodiment. 6 shows a t55 embodiment, FIG. 6(a) is a sectional view showing the state before connection, and FIG. 6(b) is a sectional view showing the state after connection. 7 and 8 also show the fifth embodiment, and FIG. 7(a) and FIG. 8(a) are perspective views,
FIG. 7(b) and FIG. 8(b) are cross-sectional views. 9 shows a sixth embodiment, FIG. 9(a) is a perspective view showing the state before connection, and FIG. 9(b) is a sectional view showing the state after connection. FIG. 10 is a sectional view showing the seventh embodiment, FIG. 10(a) shows the state before connection, and FIG. 10(b)
) shows the state after connection, FIG. 11 shows the electrical connection member according to the eighth embodiment, FIG. 11(a) is a perspective view, and FIG. 11(b) is a sectional view. FIG. 12 shows an example of manufacturing an electrical connection member according to the ninth embodiment, and FIG.
12(a) and 12(c) are cross-sectional views, and FIG. 12(b) is a perspective view. 13 to 20 show conventional examples, except for FIG. 14, which are cross-sectional views, and FIG. t514 is a plan perspective view. 1. Lead frame, 2. Element mounting part of Φ lead frame, 3. Silver paste, 4, 4'... Semiconductor element, 5
．． 5'... Connecting part of semiconductor element, 6... Connecting part of lead frame, 7... Ultrafine metal wire, 8... Resin, 9... Semiconductor device, 10... Outer periphery of semiconductor element, 11... Outer periphery of element mounting portion of lead frame, 16. Carrier film substrate, 17. Inner lead portion of carrier film substrate, 20. Resin, 21. Resin, 31. Solder bump, 32. Substrate, 33... Connection part of the board, 54
Fist/electrical VC connection face member connection portion, 55...Lead frame, 63@・M retaining material, 7o. 70' fist, metal material, 71.71', insulating film, 72
．． 72°...Exposed surface of insulating film, 73,73°...Exposed surface of metal material, 75.75°...Circuit base material, 76.76'
・・Connection part of circuit base material, 77・Insulating material of anisotropic conductive film, 78・・Anisotropic conductive film, 79・・Conductive particle, 8
1...Insulating material of elastic connector, 82...Metal wire of elastic connector, 83...Elastic connector, 101...Circuit board, 102...Connection part, 103
...Insulating film, 106...Insulating film, 104...Circuit board,
lO5...Connection part, 107 Metal member, lO8...Connection part, 109...Connection part, 111...Insulator, 120...Hole, 121...Metal wire, 122...Bar% 123...Resin,
124... Dotted line, 125... Electrical connection member, 126...
・Protrusion, 127 ・Rod, 128, 129, 130 @Φ Electrical connection member, 131.132...Metal wire guide plate, 13
3.134--hole, 150◆police bump. Figure 1 (a) Figure 1 (b) Figure 2 (c) Figure 3 (a) Figure 3 (b) Figure 4 Figure 5 Figure 6 (a) Figure 6 (b) Figure 7 Figure (a) Figure 7 (b) Figure 9 (a) Figure 9 (b) Figure 10 (a) Figure 10 (b) Figure 11 (a) Figure 11 (b) Figure 12 ( a) P) 1 Figure 13 Figure 14 Figure 15 Figure 16 131pj Figure 17 Old diagram

Claims (1)

[Claims] 1. An electrical connection member for electrically connecting a first electric circuit component having a connecting portion and a second electric circuit component having a connecting portion to both of them. In an electric circuit member constructed by intervening between the two electric circuit parts and connecting them at the connecting part, the electric connecting member connects a plurality of metal members made of metal or an alloy to each other. electrically isolated,
and one end of the metal member is exposed to the first electric component side, while the other end of the metal member is exposed to the second electric circuit component side, and is embedded in an insulator. and the insulator has at least one hole opening to the outside, and the connecting portion of the first electric circuit component and one end of the metal member exposed on the side of the first electric circuit component are connected by an alloy. An electric circuit member characterized in that the connection is made by alloying the connecting portion of the second electric circuit component and one end of the metal member exposed on the side of the second electric circuit component. . 2. The electric circuit member according to claim 1, wherein the first electric circuit component and the second electric circuit component are each one of a semiconductor element, a circuit substrate such as a circuit board, or a lead frame.