JPS63239787A - Electric circuit member - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [Industrial application field] TECHNICAL FIELD The present invention relates to electrical circuit members.

[Prior Art] Conventionally, the following techniques are known as techniques related to electric circuit members configured by electrically connecting electric circuit components.

■Wire bonding method Figures 13 and 14 show typical examples of semiconductor devices connected and sealed by the wire bonding method. Explain how.

In this method, the semiconductor element 4 is fixedly supported on the element mounting part 2 using Ag paste 3 or the like, and then the connection part 5 of the semiconductor element 4 and the desired connection part 6 of the lead frame 1 are connected with ultrafine material such as gold. This is a method of electrically connecting using metal wires 7.

After the connection, the semiconductor element 4 and the lead frame 1 are sealed 1 using a resin 8 using a method such as a transfer molding method.
Then, the unnecessary portion of the lead frame 1 extending outside the resin-sealed portion is cut.

A semiconductor device 9 is made by bending it into a desired shape.

■TAB (Tape Automated Bond
FIG. 15 shows a typical example of a semiconductor device connected and sealed by the TAB method.

This method is an automatic bonding method using a tape carrier method. That is, to explain based on FIG. 15, after positioning the carrier film substrate 16 and the semiconductor element 4, the inner lead part 17 of the carrier film substrate 16 and the connecting part 5 of the semiconductor element 4 are connected by thermocompression bonding. This is the way to do it. After the connection, the semiconductor device 9 is sealed with resins 20 and 21.

■CCB (Controlled Co11apse
Bonding) law (for example, Special Publication Act 1977
(No. 6, Japanese Unexamined Patent Publication No. 60-57944) FIG. 16 shows a typical example of a semiconductor device connected and sealed by the CCB method. This method will be explained based on FIG. S16. Note that this method is also called a flip chip bonding method.

Solder bumps 31 are provided in advance on the connection portion 5 of the semiconductor element 4,
A semiconductor element 4 provided with solder bumps 31 is positioned and mounted on one circuit board 32.

Thereafter, the semiconductor element 4 is connected to the circuit board 32 by heating and melting the solder, and the semiconductor device 9 is manufactured by cleaning the solder and sealing it.

(ΦThe method shown in FIG. 17 and FIG. Then, the exposed surfaces 73 and 72 of the metal material 70 and the insulating film 71 are made moly. On the other hand, an insulating film 71' made of polyimide or the like is formed on the part other than the connection part 5'' of the second semiconductor element 4'. A metal material 70' made of Au or the like is provided at the connecting portion 5', and then exposed surfaces 73' of the metal material 70' and the insulating film 71',
Flatten 72'.

Thereafter, as shown in FIG. 18, the first semiconductor M element 4 and the second conductor element 4' are positioned, and after positioning,
By thermocompression bonding, the connecting portion 5 of the first semiconductor element 4 and the connecting portion 5'' of the second semiconductor element 4' are bonded to the metal materials 70, 7.
Connect via 0'.

■The method shown in FIG. 19, that is, the first circuit substrate 75 and the second circuit substrate 75'
An anisotropic conductive film 78 in which conductive particles 79 are dispersed in an insulating material 77 is interposed between the first circuit base material 75 and the second circuit base material 75.
After positioning the circuit board 75', pressurize or
By applying pressure and heating, the connection portion 76 of the first circuit substrate 75 and the second
This is a method of connecting the connecting portion 76' of the circuit board at 75°.

■The method shown in Fig. 20, namely: first circuit substrate 75 and second circuit substrate 75°
After positioning the first circuit base material 75 and the second circuit base material 75'' by interposing an elastic connector 83 in which a metal wire 82 of Fe, Cu, etc. is arranged in a certain direction in an insulating material 81, , and pressurize the connecting portion 7 of the first circuit board 75.
6 and the connecting portion 76'' of the second circuit board 75''.

[Problems to be Solved by the Invention] The conventional b-pounding method described in -E has the following problems.

■Wire bonding method■ If the connection part 5 of the semiconductor element 4 is designed to be inside the semiconductor element 4, the ultra-fine metal wire 7 will be connected to the &! Since the diameter is extremely small, it easily comes into contact with the outer peripheral edge 10 of the semiconductor element 4 or the outer peripheral edge 11 of the element mounting section 2 of the lead frame 1. The ultra-fine metal wire 7 covers these outer peripheral edges 10 to 1.
If it touches 1, it will short circuit. Furthermore, the length of the ultra-fine metal wire m7 has to be increased, and if the length is increased, the ultra-fine metal wire 7 becomes easily deformed during transfer molding.

Therefore, the connecting portion 5 of the semiconductor element 4 needs to be placed around the semiconductor element 4, and is inevitably subject to circuit design limitations.

■In the wire bonding method, in order to avoid contact between adjacent ultrafine metal wires 7, the pitch dimension of the connecting parts 5 on the semiconductor element 4 (the distance fa between the centers of adjacent connecting parts
) Therefore, the size of the semiconductor element 4 is determined by the connection part 5.
The maximum number of is determined.

However, in the wire bonding method, this pitch dimension is usually as large as about 0.2 mm.

The number of connection parts 5 has to be reduced.

■The height h of the ultrafine metal wire 7 measured from the connection part 5 on the semiconductor element 4 is usually 0.2 to 0.4 mm, but it is 0.2 mm.
Since it is relatively difficult to make the device thinner than below, the device cannot be made thinner.

■Wire bonding takes time. In particular, when the number of connection points increases, the bonding time increases and production efficiency deteriorates.

- If the transfer molding condition range is exceeded for some reason, the ultrafine metal wire 7 may be deformed or, in the worst case, may be cut.

Furthermore, in the connection portion 5 on the semiconductor element 4, since Ai that is not alloyed with the ultrafine metal wire 7 is exposed, AIR corrosion is likely to occur, resulting in a decrease in reliability.

■TAB method■ If the connecting part 5 of the semiconductor element 4 is designed to be inside the semiconductor element 4, the length of the inner lead part 17 of the carrier film substrate 16 becomes longer, so that the inner lead part 17 is easily deformed. Otherwise, the inner lead portion may not be able to be connected to the desired connection portion 5, or the inner lead portion 17 may come into contact with a portion of the semiconductor element 4 other than the connection portion 5.

In order to avoid this, it is necessary to bring the connecting portion 5 of the semiconductor element 4 to the periphery above the semiconductor element 4, which is subject to design limitations.

■Even in the TAB method, the pitch dimension of the connection parts on the semiconductor element 4 must be approximately 0.09 to 0.15 mm.
Therefore, similar to the problem (2) of the wire bonding method, it is difficult to increase the number of connections.

(2) In order to prevent the inner lead portions 17 of the carrier film substrate 16 from coming into contact with portions other than the connection portions 5 of the semiconductor element 4, a desired connection shape of the inner lead portions 17 is required, which increases costs.

(2) In order to connect the connecting portion 5 of the semiconductor element 4 and the inner lead portion 17, gold bumps must be attached to the connecting portion 5 of the semiconductor element 4 or the connecting portion of the inner lead portion 17, which increases the cost.

(2) CCB method (2) Solder bumps 31 must be formed at the connection portions 5 of the semiconductor element 4, resulting in high costs.

■If the amount of solder on a bump is large, bridges (a phenomenon in which adjacent solder bumps come into contact with each other) will occur between adjacent solder bumps.
On the other hand, if the amount is too small, the connecting portion 5 of the semiconductor element 4 and the connecting portion 33 of the substrate 32 will not be connected and electrical continuity will not be established. In other words, the reliability of the connection becomes low. Furthermore, there is a problem in that the amount of solder and the solder shape of the connection affect the reliability of the connection (Technical Data of the Brazing Technology Research Group, No. 017-'84, published by the Brazing Technology Research Group).

As described above, since the amount of solder bumps affects the reliability of the connection, it is necessary to control e of the solder bumps 31.

(2) If the solder bumps 31 are present inside the semiconductor element 4, it becomes difficult to visually inspect whether or not the connection has been made well.

■Poor heat dissipation characteristics of semiconductor elements (reference material; Elect
ronic Packaging
ogy 1987. 1 (Vol.

3, No. 1) P, 68-71 NIKKEI
M [RODEVICES.

(May 1988, P. 97-108), therefore, great efforts are required to improve heat dissipation characteristics.

■Technique shown in FIGS. 17 and 18■Exposed surface 72 of insulating film 71 and exposed surface 73 of metal material 70,
Furthermore, the exposed surface 72° of the insulating film 71' and the exposed surface 73° of the metal material 70' must be made flat, which increases the number of steps and costs.

■Insulation It! Exposed surface 72 of 71 and exposed surface 7 of metal material 70
3 or insulation 11171° exposed surface 72゛ and metal material 7
If there are irregularities on the exposed surface 73'' at 0°, the metal material 70 and the metal material 70' will not be connected, resulting in a decrease in reliability.

■Technology shown in Figure 19■ After positioning, when applying pressure to connect the connecting part 76 and the connecting part 76', it is difficult to apply constant pressure, resulting in variations in the connection state, and as a result, the connection The variation in contact resistance value between parts becomes large. Therefore, the reliability of the connection becomes poor.

In addition, when a large amount of current is passed, phenomena such as heat generation occur, so it is not suitable when a large amount of current is desired to be passed.

■Even if a constant pressure is applied, the anisotropic conductive film 78
Due to the arrangement of the conductive particles 79, variations in the resistance value become large. Therefore, the reliability of the connection becomes poor. Furthermore, it is not suitable for connections requiring large current capacity.

(2) If the pitch between adjacent connecting parts (distance # between the centers of adjacent connecting parts) is narrowed, the resistance value between adjacent connecting parts will decrease, which is not suitable for high-density connections.

<ゐSince the resistance value changes due to the variation in the protrusion ihl of the connection portion 76.76° of the circuit substrates 75 and 75', it is necessary to accurately control the amount of variation in h1.

■Additionally, anisotropic conductive films can be used to connect semiconductor elements and circuit substrates,
Furthermore, when used to connect the first semiconductor element and the second semiconductor element, in addition to the disadvantages described above (■ to ■), a bump must be provided at the connection part of the semiconductor element, resulting in high cost. occurs.

・Technology shown in Figure 20 1) Pressure is required, and a pressure jig is required.

(2) The connection portion 76 between the metal wire 82 of the elastic connector 83 and the first circuit substrate 75. The contact resistance between the second circuit substrate 75° and the connecting portion 76' changes depending on the pressing force and the surface condition, so the reliability of the connection is poor.

■Since the metal &I;I82 of the elastic connector 83 is a rigid body, if the pressing force is large, the elastic connector 83 and the first circuit base material 75. If the surface of the second circuit board 75' is likely to be damaged, and if the pressing force is small, the reliability of the connection will be poor.

■Furthermore, the connection portions 76.7 of the circuit substrates 75, 75'
6' protrusion amount h2. Also elastic connector 83
Since the protrusion amount h3 of the metal wire 82 and its dispersion affect the change in resistance value and damage, it is necessary to take measures to reduce the dispersion.

(2) Further, when an elastic connector is used to connect a semiconductor element and a circuit substrate, or to connect a first semiconductor element and a second semiconductor element, the same drawbacks as in (1) to (2) occur.

The present invention solves all of the above-mentioned problems and proposes a new high-density, high-reliability, and low-cost computer circuit component, which can of course replace the conventional connection method. High-density multi-point connections can be obtained and various properties such as heat can be improved.

(Left below) [Means for Solving Problems 1] The present invention provides a first electrical circuit component having a connecting portion and a second electrical circuit component having a connecting portion, by electrically connecting both electrical circuit components. In an electric circuit member configured by connecting two electric circuit parts at a connecting part with an electric connecting member interposed between the two, the electric connecting member is made of metal or an alloy. IhI
The metal members are connected to each other by exposing one end of the metal member to the first electric component side and exposing the other end of the metal member to the second electric circuit component side. is embedded in an insulator so as to be electrically insulated, and one or both of powder and fibers made of metal or alloy are dispersed in the insulator, and the first The connecting portion of the electric circuit component and one end of the metal member exposed on the side of the first electric circuit component are connected by alloying, and the connecting portion of the second electric circuit component and the second electric circuit component are connected by alloying. The gist lies in an electric circuit member characterized in that it is connected to one end of a metal member exposed on the side by alloying it.

Examples of electric circuit components in the present invention include semiconductor elements, circuit boards such as resin circuit boards, ceramic boards, and metal boards (hereinafter sometimes simply referred to as circuit boards), lead frames, and the like. That is, any one of these components may be used as the electric circuit component of @l, and any one of these components may be used as the second electrical circuit component.

The object of the present invention is a component having a connection part as an electric circuit component. Although the number of connection parts does not matter, the greater the number of connection parts, the more remarkable the effects of the present invention will be.

Further, although the location of the connection portion does not matter, the effect of the present invention becomes more pronounced as the connection portion is located inside the electric circuit component.

In the present invention, a first electrical circuit component and a second electrical circuit component are connected using an electrical connection member.

The electrical connection member according to the present invention is constructed by embedding a plurality of metal members in an insulator. Each metal member is insulated from each other by an insulator.

Moreover, one end of the metal member is exposed to the first electric circuit component side, and the other end is exposed to the second electric circuit component side. Furthermore, one or both of powder and m-fibers made of metal or alloy are dispersed in the insulator.

Here, as the material of the metal member, gold is preferable, but any metal or alloy other than gold may also be used.For example, Cu, A metal, and Sn.

Examples include metals or alloys such as Pb-5n.

Furthermore, the cross section of the metal member can be circular, square, or any other arbitrary shape.

Further, the thickness of the metal member is not particularly limited. In consideration of the pitch of the connecting portions of the electric circuit components, the pitch may be set to, for example, 20 μm or more or 20 gmφ or less.

Note that the exposed portion of the metal member may be on the same surface as the insulator, or it may be made to protrude from the surface of the insulator. This protrusion may be on one side or on both sides. It may be made into a shape.

Furthermore, the spacing between the metal members may be the same as the spacing between the connecting parts of the electrical circuit components, or may be narrower than that, and when the spacing is narrower, the spacing between the electrical circuit components and the electrical connecting members may be the same. It becomes possible to connect the electrical circuit component and the electrical connection member without requiring positioning.

Also, metal members do not need to be placed vertically in the insulator;
It may run obliquely from the first electric circuit component side toward the second electric circuit component side.

Furthermore, the electrical connection member may be composed of one layer or multiple layers of two or more layers.

In the present invention, one or both of powder and wt miscellaneous materials made of metal or alloy are dispersed in the insulator.

Here, the powder and mta are made of metal or alloy. Examples of metals include Ag.

Cu, Au, Al, Be, Ca
, M g , M o .

Examples include Ni, Si, W, etc., and examples of alloys include alloys of the above metals. One or more of powders or miscellaneous materials made of these metals or alloys may be used. Further, either the powder or the wL fibers may be used, or both may be used.

In addition, powder and! The male a may or may not be subjected to surface treatment such as plating.

The size and shape of the powder and fibers to be dispersed, as well as the dispersed position and quantity within the insulator, should be determined in such a way that metal members embedded in the insulator may come into contact or short circuit due to the powder or fibers. It is optional as long as it does not cut. However, the size of the powder and fibers is preferably smaller than the distance between adjacent metal members, that is, it is preferable that the metal members do not come into contact with each other even through the powder and TA fibers. Powder and fibers may or may not be exposed to the outside of the insulator, as long as the desired electrical connection between electrical circuit components is achieved.
The fibers may or may not be in contact with each other.

The insulator of the electrical connection member is not particularly limited as long as it is an insulating material; for example, an insulating resin may be used;
When using a resin, the type of resin does not matter; it may be either a thermosetting resin or a thermoplastic resin. For example, polyimide resin, polyphenylene sulfide resin, polyether sulfone resin, polyetherimide resin, polystyrene resin, silicone. Resin, fluororesin, polycarbonate resin, polydiphenyl ether resin, polybenzylimidazole resin, phenol resin, urea resin, melamine resin, alkyd resin, epoxy resin, polyamideimide resin, polyproblene resin, polyvinyl chloride resin, polystyrene resin, etc. Resin can be used.

When using the above resin as a material for the insulator, in order to disperse the powder or fibers in the insulator, the powder or fibers may be added to the resin and the resin may be stirred. Of course, by such a method. The powder or fibers may be dispersed in the insulation by any other method.

It should be noted that it is more preferable to use a resin with good thermal conductivity among these trees, since even if the semiconductor element has heat, the heat can be radiated through the resin.Furthermore, as a resin, If a material having the same or similar coefficient of thermal expansion as the circuit board is selected, it will be possible to further prevent the reliability of the device from decreasing due to thermal expansion/shrinkage.

In the present invention, the connection portion of the first electric circuit component and the first
One end of the metal member of the electrical connection member exposed on the electrical circuit component side is connected by alloying, and the connecting portion of the second electrical circuit component and the second; Connection is made by alloying one end of the metal member of the electrical connection member.

That is, in the present invention, both the first electric circuit component and the second electric circuit component are alloyed.

One alloying method is, for example, by bringing the corresponding connection parts into contact and then heating them at an appropriate temperature.Heating causes diffusion of atoms in the connection parts, and forms a solid solution or a total alloy on the surface of the connection parts. A layer of living compound is formed and the connections are alloyed together. In addition, Au is used for the metal member of the electrical connection member, and A! is used for the connection part of the electric circuit component. ; When L is used, 200 to 350
A heating temperature of °C is preferred.

[Function] Since the present invention uses the above-mentioned electrical connection member, it is also possible to arrange the connection parts of the electric circuit components inside, and the number of connection parts can be increased. It becomes possible to

Further, the electrical connection member can be made thinner, and from this point of view as well, making it thinner makes it easier to maintain the thickness.

Furthermore, since the amount of metal members used for the electrical connection member is small, the cost is low even if expensive gold is used as the metal member.

In the present invention, both of the electrical circuit components are alloyed through the electrical connection member, and the electrical circuit components are firmly (strong in terms of strength) and reliably connected to each other. An extremely low cost electric circuit member can be obtained.

Furthermore, since both of the electrical circuit components are alloyed via the electrical connection member, there is no need to use a jig or the like to hold the electrical circuit components during and after the production process of the electrical circuit component. It is easy to create electric circuit members and to manage them after they are created.

Since both of the electrical circuit components are alloyed via the electrical connection member, the contact resistance between the electrical circuit components is smaller than when only one of the electrical circuit components is alloyed.

In the present invention, since the powder or fibers are dispersed in the insulator of the electrical connection member, the electrical connection member has good thermal conductivity. If a large electrical circuit component is used and an electrical circuit component with little heat influence is selected as the second electrical circuit component, the heat generated from the first electrical circuit component will be transferred to the second electrical circuit component via the electrical connection member. The heat is conducted to the second electrical circuit component, and the heat is radiated from the second electrical circuit component. Therefore, it is possible to obtain an electric circuit member with good heat dissipation characteristics.

[Example] (First Example) A first example of the present invention will be described based on FIGS. 1 and 2.

In this embodiment, a circuit board 101, which is a first electric circuit component having a connection part 102, and a second circuit board 101 having a connection part 105 are used.
The circuit board 104, which is an electric circuit component of the circuit board 101., is connected to the circuit board 101.
In the electrical circuit member configured by connecting at the connecting portions 102 and 105 of 104, the electrical connecting member 125 electrically insulates the plurality of metal members 107 made of metal or alloy from each other. and one end of the metal member 107 is connected to the first
The side of the circuit board 101 is exposed, while the metal member 1
07 is embedded in the insulator 111 with the other end exposed to the second circuit board 104 side, and
The insulator 111 is made of powder or fiber made of multiple metals or alloys! ! (not shown) are dispersed, and are connected by alloying the connecting portion 102 of the first circuit board 101 and one end of the metal member 107 exposed on the first circuit board 101 side. , and the connection is made by alloying the connecting portion 105 of the second circuit board 104 and one end of the metal member 107 exposed on the second circuit board 104 side.

This example will be explained in more detail below.

First, an example of manufacturing the electrical connection member 125 will be explained. The connecting member 125 will be explained.

FIG. 2 shows one manufacturing example.

First, as shown in FIG. 2(a), metal wires 121 made of a metal such as gold or an alloy with a diameter of 20 pm are wired at a pitch of 40.
Wrap it around rod 122 as gm.

After wrapping, the above gold JN is wrapped in resin 123 such as polyimide.
Before embedding the A wire 121, powder made of Ag is blended into the resin and stirred to disperse the powder into the resin. After embedding, the resin 123 is cured. The cured resin 123 becomes an insulator.

Thereafter, it is sliced at the dotted line 124 to create an electrical connection member 125. The electrical connection member 125 created in this way is shown in FIGS. 2(b) and 2(C).

In this example, the resin was dispersed in a powder form by stirring, but the resin may be dispersed in a powder form by other methods.

In the electrical connection member 125 created in this way,
The metal wire i21 constitutes the metal member 107, and the resin 123 constitutes the insulator 111.

In this electrical connection member 125, metal wires 121 serving as metal members are electrically insulated from each other by resin 123. Further, one end of the metal wire 121 is exposed to the circuit board 101@, and the other end is exposed to the circuit board IO4 side. Each of these exposed parts is a circuit board lot, 104
It becomes the connection part 108, 109 with.

Next, the first circuit board 101, the electrical connection member 125,
A second circuit board 104 is prepared. As shown in FIG. 1, the circuit boards 101 and 104 used in this example have a large number of connection parts 102 and 105 therein.

a o, :frJl (7) Circuit board 101 (7)
The connection portion 102 is connected to the connection portion 105 of the second circuit board 104.
And metal is exposed at positions corresponding to the connection parts 108 and 109 of the electrical connection member 125.

Connecting portion 102 of first circuit board 101 and connecting portion 108 of electrical connecting member 125, or
Connection part 1 between the connection part 105 of 04 and the electrical connection member 125
Perform positioning so that 09 corresponds, and after positioning 1
Alloy and connect both.

Here, the first circuit board 101, the electrical connection member 1
25. There are the following three methods for connecting the second circuit board 104, and any of these methods may be used.

■First circuit board 101, electrical connection member 125, second
After positioning the first circuit board 104, the first circuit board 1
Connection part 1 between the connection part 102 of 01 and the electrical connection member 125
08, and the connecting portion 105 of the second circuit board 104 and the connecting portion 109 of the inspiratory connecting member 125 are simultaneously alloyed to connect the first circuit board 101 and the electrical connecting member 12.
5 and the connecting portion 10 of the first circuit board 101.
2 and the connecting portion 108 of the electrical connecting member 125 are alloyed and connected, the second circuit board 104 is positioned, and the connecting portion 109 of the electrical connecting member 125 and the second circuit board 10 are connected.
A method of alloying and connecting the connecting portion 105 of No. 4.

■ After positioning the second circuit board 104 and the electrical connection member 125 and alloying and connecting the connection part 105 of the second circuit board 104 and the connection part 109 of the electrical connection member 125, A method of positioning a circuit board 101 and alloying and connecting the connection part 108 of the electrical connection member 125 and the connection part 102 of the first circuit board 101.

When the connectivity of the connection portions of the electrical circuit members produced as described above was examined, the connections were found to be highly reliable.

Furthermore, the heat dissipation properties were also good.

(:52 examples) FIG. 3 shows a second embodiment.

In this example, a circuit board 51 is used as a first electric circuit component having a connection part 52, and a semiconductor element 4 having a large number of connection parts 5 therein is used as a second electric circuit component.

Alloying is performed between the connecting portion 5 of the semiconductor element 4 and the connecting portion 52 of the circuit board 51, and the connecting portion 54 of the electrical connecting member 125 in which one or both of powder or m-fiber made of metal or alloy is dispersed. I did it.

The electrical connection member 125 in which one or both of powder and fiber made of metal or alloy is dispersed had a size corresponding to the semiconductor element 4.

After alloying and connecting, a lead frame 55 was connected to the lower surface of the circuit board 51.

Other points are similar to the first embodiment.

In this example as well, the connection section was connected with high reliability.

In addition, the heat dissipation characteristics were also good. (Third example) FIG. 4 shows a third embodiment.

In this example, the first electric circuit component is the semiconductor element 4, and the second electric circuit component is the circuit board 51.

Note that after connection, the lead frame 1 is placed on the top surface of the circuit board 51.
were connected and sealed with a sealing material 63.

Other points are similar to the first embodiment.

In this example as well, the connection section was connected with high reliability.

Furthermore, the heat dissipation properties were also good.

(Fourth Example) The fourth example is shown in FIG. can be,
In this example, a member having a size corresponding to the semiconductor element 4 is used as the electrical connection member, and the lead frame 1 is connected to the metal member exposed on the first semiconductor element 4' side of the electrical connection member 125. .

Others: The same as the fS3 embodiment.

In this example as well, the connection section was connected with high reliability.

Furthermore, the heat dissipation properties were also good.

(Fifth example) FIG. 6 shows a fifth embodiment.

The fifth embodiment is an example in which circuit boards 101 and 104 whose portions other than the connecting portions are covered with insulating films 103 and 106 are used as the first electric circuit component and the second electric circuit component. .

Further, as the electrical connection member, the one shown in Figure @7 was used. That is, in the electrical connection member 125 shown in FIG. protrudes from the surface.

Such electrical connection member 125 may be created, for example, by the following method.

First, by the method described in the :tSf example,
), (C) are prepared. Next, both surfaces of the electrical connection member may be etched until the metal wire 121 protrudes from the polyimide resin 123 by about 10 pm.

In this example, the amount of protrusion of the metal 1121 is 10J, L.
m, but any amount may be used.

Furthermore, the method for protruding the gold Em121 is not limited to etching, and other chemical or mechanical methods may be used.

Other points are similar to the first embodiment.

Note that the protruding portion and the electrical connection member 125 are connected to the metal wire 121.
A bump 150 as shown in FIG. 8 may be formed by inserting it into a mold having a recess at position t and crushing the protrusion 126 of the metal wire 121.

In this case, the metal wire 121 becomes difficult to fall off from the insulator tti.

Note that in this example as well, the metal wire 121 constitutes the metal member 107, and furthermore, the resin 123 constitutes the insulator 111.

Note that the bumps may be created by melting the protrusions with heat, or any other method may be used.

Even in wooden figurines, the joints were connected with high reliability.

In addition, the 8# radiation properties were also good.

(6th example) FIG. 9 shows a sixth embodiment.

In this example, a semiconductor element 4 is used as the first electrical circuit component, and a lead frame I is used as the second electrical component.

Other points are similar to the fifth embodiment.

In this example as well, the connection section was connected with high reliability.

Furthermore, the heat dissipation properties were also good.

(Seventh Example) FIG. 10 shows a seventh embodiment.

In this example, the electrical connection member 125 is different from the electrical connection member shown in the fifth embodiment. That is, in the electrical connection member 125 of this example, the pitch between the metal members is narrower than that shown in the fifth example. That is, in this example, the pitch between the metal members 107 is set to be narrower than the interval between the first circuit board connecting portions.

That is, in the fifth embodiment, the first circuit board 101 and the second
An electrical connection member 125 is located at the connection position with the circuit board 104.
In this example, although it is necessary to determine the distance between the f51 circuit board 101 and the second circuit board 104, Positioning with the connecting member 125 becomes unnecessary. Therefore, the first circuit board 101 and the second circuit board 1
It is also possible to connect without positioning by selecting appropriate values for the connection dimensions (dll, pH) of 04 and the connection dimensions (d12.PI3) of the electrical connection member.

In this example as well, the connection section was connected with high reliability.

Furthermore, the heat dissipation properties were also good.

(Eighth Example) FIG. 11 shows an electrical connection member used in the eighth example.

FIG. 11(a) is a perspective view of the electrical connection member, FIG.
b) is a sectional view of the electrical connection member.

An example of making such an electrical connection member will be described next.

First, three electrical connection members 128° 129.130 in which one or both of powder and fiber made of metal or alloy are dispersed in an insulator are prepared using the manufacturing method shown in the first embodiment.

The position of the metal wire 121 in the first sheet 128 is m row and n column.
It is displaced from the center by a and nb.

The position of the metal wire 121 in the second sheet 129 is ma at row m and column n.
It is displaced from the center by c and nbc.

The position of the metal wire 121 in the third sheet 130 is mad in m rows and n columns.
, nbd from the center. a.

The values of b, c, and d are such that the upper and lower metals 121 are electrically conductive, but the left and right sides are not electrically conductive with each other. The three electrical connection members are positioned and laminated using a method such as thermocompression bonding to create the electrical connection member 125.

In addition, in this example, the positions of the metals of the electrical connection members were selected according to rules such as m rows and n columns, but the metals on the top and bottom were conductive, and the left and right sides were not electrically conductive with each other. It can be random if you do.

In addition, although this example describes the case where three layers are laminated, two
Any number of layers may be used as long as the electrical connection member of this example is laminated using a thermocompression bonding method. $7
A protrusion may be provided as shown in the figure, or a bump 150 may be provided as shown in FIG.

In this example as well, the connection section was connected with high reliability.

Furthermore, the heat dissipation properties were also good.

(Ninth embodiment) Fig. 12 shows an electrical connection member used in the ninth embodiment 6 Fig. 12(a) is a cross-sectional view of the electrical connection member during manufacture;
FIG. 12(b) is a close-up view of the electrical connection member,
Figure (c) is the above sectional view.

First, gold Ji1 line guide plates 131 and 132 are prepared. Then, the metal wire 121 is passed through desired holes 133 and 134 made in the metal wire guide plates 131 and 132, and stretched to a desired tension. Thereafter, resin 123 is poured between the metal wire guide plates 131 and 132 and hardened. Note that before pouring the resin 123, powder or m! is added into the resin 123 in advance. 1 to disperse the powder or mai in the resin.

After that, remove the guide plate and connect the electrical connection member 125.
Create.

Further, the electrical connection member of this example may be processed to provide a protrusion as shown in Figure f57, or a bump 150 as shown in Figure 8.

The first circuit component and the second electric circuit component of this example are:
Each of them is one of circuit base materials such as a semiconductor element, a circuit board, and a lead frame.

In this example as well, the connection section was connected with high reliability.

Furthermore, the heat dissipation properties were also good.

[Effect 1 of the Invention Since the present invention is configured as described above, the following numerous effects can be obtained.

1. Highly reliable connections between semiconductor elements and circuit substrates such as circuit boards and lead frames can be obtained. Therefore, the conventionally used wire bonding method, TAB
It becomes possible to replace the CCB method.

2. According to the present invention, the connection part of the electric circuit component can be placed in any position (especially inside), so it is possible to connect at more points than the wire bonding method or the TAB method, and it is suitable for connection with a large number of pins. This is the method.

Furthermore, due to the presence of an insulating material between adjacent metals of the electrical connection member, there is no electrical conduction between the adjacent metals.
Even more multi-point connections than in the CB system are required.

3. Since the amount of metal members used in the electrical connection member is small compared to the conventional one, even if an expensive metal material such as gold is used for the metal member, it will be cheaper than the conventional one.

4. High-density semiconductor devices and the like can be obtained.

Both of the 5.7tL air circuit components are alloyed via electrical connection members, and the electrical circuit components are firmly (strong in terms of strength) and reliably connected to each other, so they are mechanically strong and have a very low defect rate. A low cost electric circuit member can be obtained.

6. Since both the electrical circuit components are alloyed via the electrical connection member, there is no need to use a jig or the like to hold the electrical circuit components during and after the production process of the electrical circuit components. It is easy to create electric circuit members and to manage them after they are created.

7. Since both the Ti and the electrical circuit components are alloyed via the TrL electrical connection member, the contact resistance between the electrical circuit components is smaller than when only one is alloyed.

8. By selecting a material with good thermal conductivity as the electrical insulating material of the electrical connection member, heat dissipation from the electric circuit components becomes good, and a semiconductor device with good heat dissipation can be obtained.

9. Since powder or fibers are dispersed in the insulator of the electrical connection member, even if heat is generated in the first electrical circuit component or the second electrical circuit component, it will not be absorbed through the electrical connection member. The heat is radiated to the outside. Therefore, an electric circuit member with good heat dissipation properties can be obtained.

Of course, a highly reliable semiconductor device can be obtained by selecting a material having the same or similar coefficient of thermal expansion as the semiconductor element and the circuit substrate as the electrically insulating material of the electrical connection member.

By embedding another substance in the insulator of the electrical connection member or forming an end layer, it is possible to obtain an electrical circuit member with good heat dissipation, low stress, and shielding efficiency.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing a first embodiment. Figure 1(a)
2 shows the state before connection, and FIG. 2(b) shows the state after connection. FIG. 2 is a diagram for explaining an example of a manufacturing method of the electrical connection member used in the first embodiment. , Figure 2(a)
2(b) is a perspective view, and FIG. 2(c) is a sectional view. FIG. 3 shows a second embodiment, where FIG. 3(a) is a perspective view and FIG. 351Cb) is a sectional view. FIG. 4 is a sectional view showing the third embodiment. :f55 is a sectional view showing the fourth embodiment. 6 shows a fifth embodiment, FIG. 6(a) is a sectional view showing the state before connection, and FIG. 6(b) is a sectional view showing the state after connection. FIGS. 7 and 8 also show the fifth embodiment, with FIGS. 7(a) and 8(a) being perspective views, and FIGS. 7(b) and 8(b) being sectional views. It is. FIG. 9 shows the sixth embodiment, and FIG. 9(a) shows the state f before connection.
FIG. 9(b) is a sectional view showing the state after connection. Figure 1O is the 7th actual tktM le;
FIG. 10(b) shows the state before connection, FIG. 11 shows the electrical connection member according to the eighth embodiment, and FIG. 11(L) is a perspective view. , FIG. 11(b) is a sectional view. FIG. 12 shows an example of manufacturing an electrical connection member according to the ninth embodiment, FIGS. 12(a) and 12(c) are sectional views, and FIG. 12(b) is a perspective view. 13 to 20 show conventional examples, except for FIG. 14, which is a sectional view, and FIG. 14 is a plan perspective view. l#-Lead frame, 2...Element mounting part of lead frame, 3...Silver paste, 4.4"...Semiconductor element, 5
．． 5'... Connecting part of semiconductor element, 6... Connecting part of lead frame, 7... Ultrafine metal wire, 8... Resin, 9... Semiconductor device, 10... Outer periphery of semiconductor element, 11... Outer periphery of element mounting part of lead frame, 16...Carrier film board, 17 - Inner lead part of carrier film board, 2011.Resin, 21°...Resin, 31.
・Solder bump, 32... Board, 33... 4a connection part of board, 51... Circuit board, 52... Connection part of circuit board, 54
... Connecting portion of electrical connection member, 55 ... Lead frame, 63 ... Sealing material, 70° 70° - Participating metal material, 71.7
1'...Insulating film, 72.72°...Exposed surface of insulating film, 73, 73'...Exposed surface of metal material, 75.75'
・・Circuit base material, 76.76' ・・Connection part of circuit base material, 77・・Insulating material of anisotropic conductive film, 78・・Anisotropic conductive film, 79・・Conductive particles, 81・・・Elastic Insulating material of connector, 82... Gold Em of elastic connector, 83... Elastic connector, 101--circuit board, 102... Connection portion, 103... Insulating film, 106...
・Insulating film, 104...Circuit board, 105...Connection part, 1
07 Kinku member, 108...Connection part, 109...Connection part,
111...Insulator, 121...Metal wire, 122...Bar,
123-Structural resin, 124--Dotted line, 125--Electrical connection member, -126--Protrusion, 128° 129.130-
- Electrical connection member, 13i. 132Φ・Metal wire guide plate, 150・・Banbu. Figure 1 (a) Figure 1 (b) Figure 2 (a) Figure 2 (b) Figure 2 (b) Figure 3 (a) Figure 3 (b) Figure 4 Figure 5 Figure 6 (a) Figure 6 (b) Figure 9 (a) Figure 10 (a) Figure 10 (b) Figure 11 (a) Figure 11 (b) Figure 12 (a) Figure 12 (b) ) Figure 12 (c) Figure 13 Figure 14 Figure 15 Figure 16 Figure 17 Figure 18 Figure 19 Figure 20

Claims (1)

[Claims] 1. An electrical connection member for electrically connecting a first electrical circuit component having a connecting portion and a second electrical circuit component having a connecting portion; In an electric circuit member that is interposed between the two and connected at a connecting portion of both electric circuit components, the electric connection member connects a plurality of metal members made of metal or an alloy to one end of the metal member. is exposed to the first electric component side, and the other end of the metal member is exposed to the second electric circuit component side, so that the respective metal members are electrically insulated from each other. The insulator is configured to be embedded in the body, and one or both of powder and fiber made of metal or alloy is dispersed in the insulator, and the connection part of the first electric circuit component and the first one end of the metal member exposed on the side of the electric circuit component is connected by alloying, and the connecting portion of the second electric circuit component and the end of the metal member exposed on the side of the second electric circuit component are connected by alloying. An electric circuit member characterized by being connected by alloying. 2. The electric circuit member according to claim 1, wherein the first electric circuit component and the second electric circuit component are each one of a semiconductor element, a circuit substrate such as a circuit board, or a lead frame.