JPS63231890A - Electric connection member and electric circuit member employing the same - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application J] The present invention relates to an electrical connection member and an electrical circuit member using the same.

[Prior Art] Conventionally, the following techniques are known as techniques related to electric circuit members configured by electrically connecting electric circuit components.

■Wire bonding method.

FIGS. 13 and 14 show typical examples of semiconductor devices connected and sealed by the wire bonding method, and the wire bonding method will be explained below based on FIGS. 13 and 14.

In this method, the semiconductor element 4 is fixedly supported on the element mounting part 2 using Ag paste 3 or the like, and then the connection part 5 of the semiconductor element 4 and the desired connection part 6 of the lead frame 1 are connected with ultrafine material such as gold. This is a method of electrically connecting using metal wires 7.

After connection, the semiconductor element 4 and the lead frame 1 are sealed using a resin 8 using a method such as a transfer molding method, and then unnecessary parts of the lead frame 1 extending outside from the resin sealing part are cut off. , bend the semiconductor device 9 into the desired shape.
make.

■T A B (Tape Automated Ba
FIG. 15 shows a typical example of a semiconductor device connected and sealed by the TAB method.

This method is an automatic bonding method using a tape carrier method. That is, to explain based on FIG. 15, after positioning the carrier film substrate 16 and the semiconductor element 4, the inner lead part 17 of the carrier film substrate 16 and the connecting part 5 of the semiconductor element 4 are connected by thermocompression bonding. This is the way to do it. After the connection, the semiconductor device 9 is sealed with resins 20 and 21.

■CCB (Controlled Co11apse
Bonding) law (for example, Special Publication Act 1977
(No. 6, Japanese Unexamined Patent Publication No. 60-57944) FIG. 16 shows a typical example of a semiconductor device connected and sealed by the CCD method. This method will be explained based on FIG. 16. Note that this method is also called the flip chip bonding method.

Solder bumps 31 are provided in advance on the connection portion 5 of the semiconductor element 4,
A semiconductor element 4 provided with solder bumps 31 is positioned and mounted on one circuit board 32.

Thereafter, the semiconductor element 4 is connected to the circuit board 32 by heating and melting the solder, and after washing with flux, thin ice is applied to form the semiconductor device 9.

■The method shown in FIGS. 17 and 18, that is, an insulating film 71 made of polyimide or the like is formed on a portion of the first semiconductor element 4 other than the connection portion 5, and a metal material 70 made of Au or the like is formed on the connection portion 5. Then, the exposed surfaces 73 and 72 of the metal material 70 and the insulating film 71 are flattened. On the other hand, an insulating film 71' made of polyimide or the like is formed on a portion of the second semiconductor element 4' other than the connection part 5', a metal material 70' made of Au or the like is provided on the connection part 5', and then a metal material 70' made of Au or the like is provided on the connection part 5'. Exposed surfaces 73° and 7 of the material 70' and the insulating film 71'
Flatten 2°.

Thereafter, as shown in FIG. 18, the first semiconductor element 4 and the second semiconductor element 4 degrees are positioned, and after positioning, the connection part 5 of the first semiconductor element 4 and the second The connecting portion 5'' of the semiconductor element 4' is connected to metal materials 70, 70.
Connect via '.

■The method shown in FIG. 19, that is, the first circuit substrate 75 and the second circuit substrate 75'
An anisotropic conductive film 78 in which conductive particles 79 are dispersed in an insulating material 77 is interposed between the first circuit base material 75 and the second circuit base material 75.
After positioning the circuit board 75', pressurize or
By applying pressure and heating, the connection portion 76 of the first circuit substrate 75 and the second
This is a method of connecting the connecting portion 76° of the circuit board 75'.

■The method shown in FIG. 20, that is, the first circuit substrate 75 and the second circuit substrate 75°
After positioning the first circuit base material 75 and the second circuit base material 75 by interposing an elastic connector 83 in which a metal wire 82 of Fe, Cu, etc. is arranged in a certain direction in an insulating material 81, , and pressurize the connecting portion 7 of the first circuit board 75.
6 and the connecting portion 76' of the second circuit board 75'.

[Problems to be Solved by the Invention] The conventional bonding method described above has the following problems.

■ Wire bonding method ■ If the connection part 5 of the semiconductor element 4 is designed to be inside the semiconductor element 4, the ultrafine metal wire 7 has an extremely small wire diameter, It becomes easier to contact the outer peripheral edge 11 of the element mounting portion 2 of the lead frame 1. The aim metal wire 7 connects these outer peripheral edges 10 to 1.
If it touches 1, it will short circuit. Furthermore, the length of the ultra-fine metal wire 7 has to be increased, and when the length is increased, the ultra-fine metal wire 7 becomes easily deformed during transfer molding.

Therefore, the connecting portion 5 of the semiconductor element 4 needs to be placed around the semiconductor element 4, and is inevitably subject to circuit design limitations.

■In the wire bonding method, in order to avoid contact between adjacent ultrafine metal wires 7, the pitch dimension of the connecting parts 5 on the semiconductor element 4 (distance between the centers of adjacent connecting parts)
Therefore, once the size of the semiconductor element 4 is determined, the maximum number of the connecting portions 5 is necessarily determined.

However, in the wire bonding method, the pitch dimension is usually as large as about 0.2 mm, so the number of connecting portions 5 must be reduced.

■The height h of the ultrafine metal wire 7 measured from the connection part 5 on the semiconductor element 4 is usually 0.2 to 0.4 mm, but it is 0.2 mm.
Since it is relatively difficult to make the device thinner than below, the device cannot be made thinner.

@Wire bonding takes time. In particular, when the number of connection points increases, the bonding time increases and production efficiency deteriorates.

- If the transfer molding condition range is exceeded for some reason, the ultrafine metal wire 7 may be deformed or, in the worst case, may be cut.

Further, in the connection portion 5 on the semiconductor element 4, AM that is not alloyed with the ultrafine metal wire 7 is exposed, so that An corrosion is likely to occur, resulting in a decrease in reliability.

■TAB method■ If the connecting part 5 of the semiconductor element 4 is designed to be inside the semiconductor element 4, the length of the inner lead part 17 of the carrier film substrate 16 becomes longer, so that the inner lead part 17 is easily deformed. Otherwise, the inner lead portion may not be able to be connected to the desired connection portion 5, or the inner lead portion 17 may come into contact with a portion of the semiconductor element 4 other than the connection portion 5.

In order to avoid this, it is necessary to bring the connecting portion 5 of the semiconductor element 4 to the periphery above the semiconductor element 4, which is subject to design limitations.

■Even in the TAB method, the pitch dimension of the connection parts on the semiconductor element 4 must be approximately 0.09 to 0.15 mm.
Therefore, similar to the problem (2) of the wire bonding method, it is difficult to increase the number of connections.

(2) In order to prevent the inner lead portions 17 of the carrier film substrate 16 from coming into contact with portions other than the connection portions 5 of the semiconductor element 4, a desired connection shape of the inner lead portions 17 is required, which increases costs.

(2) In order to connect the connecting portion 5 of the semiconductor element 4 and the inner lead portion 17, gold bumps must be attached to the connecting portion 5 of the semiconductor element 4 or the connecting portion of the inner lead portion 17, which increases the cost.

■ CCB method ■ Solder bumps 31 must be formed on the connection portions 5 of the semiconductor element 4, which increases costs.

■If the amount of solder on a bump is large, bridges (a phenomenon in which adjacent solder bumps come into contact with each other) will occur between adjacent solder bumps.
On the other hand, if the amount is too small, the connecting portion 5 of the semiconductor element 4 and the connecting portion 33 of the substrate 32 will not be connected and electrical continuity will not be established. In other words, the reliability of the connection becomes low. Furthermore, there is a problem in that the amount of solder and the solder shape of the connection affect the reliability of the connection (Technical Data of the Brazing Technology Research Group, No. 017-'84, Published by the Brazing Technology Research Group).

As described above, the amount of solder bumps 31 needs to be controlled because the amount of solder bumps affects the reliability of the connection.

(2) If the solder bumps 31 are present inside the semiconductor element 4, it becomes difficult to visually inspect whether or not the connection has been made well.

■Poor heat dissipation characteristics of semiconductor elements (reference material; Elect
ronic Packaging Technology
y 1987.1 (Vo I.

3, No. 1) P, 88-71 NIKKEI
MICRO DEVICES.

198B-May, P. 97-10B), therefore, great efforts are required to improve heat dissipation characteristics.

■Technique shown in FIGS. 17 and 18■Exposed surface 72 of insulating film 71 and exposed surface 73 of metal material 7o,
Furthermore, the exposed surface 72' of the insulating film 71' and the exposed surface 73' of the metal material 70'' must be made flat, which increases the number of steps and costs.

■If there are irregularities on the exposed surface 72 of the insulating film 71 and the exposed surface 73 of the metal material 7o, or on the exposed surface 72' of the insulating film 71' and the exposed surface 73' of the metal material 70', the metal material 70 and the metal material 70' may will no longer connect, reducing reliability.

■Technology shown in Fig. 19■ After positioning, when applying pressure to connect the connecting portion 76 and the connecting portion 76°, it is difficult to apply constant pressure, so the connection state varies, and as a result, the connecting portion The variation in contact resistance value becomes large. Therefore, the reliability of the connection becomes poor.

In addition, when a large amount of current is passed, phenomena such as heat generation occur, so it is not suitable when a large amount of current is to be passed.

■Even if a constant pressure is applied, the anisotropic conductive film 78
Due to the arrangement of the conductive particles 79, variations in the resistance value become large. Therefore, the reliability of the connection becomes poor. Furthermore, it is not suitable for connections requiring large current capacity.

(2) If the pitch between adjacent connecting parts (the distance between the centers of adjacent connecting parts) is narrowed, the resistance value between adjacent connecting parts will decrease, which is not suitable for high-density connections.

■The resistance value changes due to variations in the protrusion ihl of the connection part 76.76" of the circuit substrates 75, 75',
It is necessary to accurately control the amount of hl variation.

■Additionally, anisotropic conductive films can be used to connect semiconductor elements and circuit substrates,
Furthermore, when used to connect the first semiconductor element and the second semiconductor element, in addition to the disadvantages mentioned above, bumps must be provided at the connection part of the semiconductor element, which increases the cost. occurs.

■Technology shown in Figure 20 ■Pressure is required, and a pressure jig is required.

■The contact resistance between the metal wire 82 of the elastic connector 83 and the connection portion 76 of the first circuit substrate 75, which is the connection portion 76 of the second circuit substrate 75', changes depending on the pressing force and surface condition. Connection reliability is poor.

■Since the metal wire 82 of the elastic connector 83 is a rigid body, if the pressing force is large, the elastic connector 83.
If the surfaces of the first circuit substrate 75 and the second circuit substrate 75' are likely to be damaged, and if the pressing force is small, the reliability of the connection will be poor.

■Additionally 1 circuit base 75.75° connection part 76, 76
'Protrusion amount h2, and elastic connector 83
Since the protrusion amount h3 of the metal wire 82 and its dispersion affect the change in resistance value and damage, it is necessary to take measures to reduce the dispersion.

(2) Further, when an elastic connector is used to connect a semiconductor element and a circuit substrate, or to connect a first semiconductor element and a second semiconductor element, the same drawbacks as in (1) to (2) occur.

The present invention solves all of the above-mentioned problems and proposes a new high-density, high-reliability, and low-cost electrical connection member and an electric circuit member using the same.
Not only can it replace conventional connection methods, it can also provide high-density multi-point connections and improve various properties such as heat.

(The following is a blank space) [Means for solving the problem] The present invention provides an electric circuit for electrically connecting a first electric circuit component having a connecting portion and a second electric circuit component having a connecting portion. In the target connecting member.

The electrical connection member includes a plurality of metal members made of metal or an alloy, one end of which is exposed to the first electrical component side, and the other end of the metal member is connected to the second electrical circuit component. The metal members are exposed to the side and buried in an insulator so as to be electrically insulated from each other, and the insulator contains either powder or fiber made of an inorganic material, or The first gist lies in an electrical connection member characterized in that both are dispersed.

Further, the present invention provides an electrical connection member for electrically connecting a first electrical circuit component having a connecting portion and a second electrical circuit component having a connecting portion. In an electrical circuit member that is interposed between circuit components and connected at a connecting portion of both electrical circuit components, the electrical connection member connects a plurality of metal members made of metal or an alloy to one end of the metal member. is exposed to the first electric component side, and the other end of the metal member is exposed to the second electric circuit component side, so that the respective metal members are electrically insulated from each other. and one or both of powder and fiber made of an inorganic material is dispersed in the insulator, and the connection part of the first electric circuit component and the first electric circuit An electrical device characterized in that one end of the metal member exposed to the component side is connected, and a connecting portion of the second electric circuit component is connected to one end of the metal member exposed to the second electric circuit component side. The circuit member has a second gist.

Examples of electric circuit components in the present invention include semiconductor elements, circuit boards such as resin circuit boards, ceramic boards, and metal boards (hereinafter sometimes simply referred to as circuit boards), lead frames, and the like. That is, any one of these components may be used as the first electrical circuit component, and any one of these components may be used as the second electrical circuit component.

The object of the present invention is a component having a connection part as an electric circuit component. Although the number of connection parts does not matter, the greater the number of connection parts, the more remarkable the effects of the present invention will be.

Further, although the location of the connection portion does not matter, the effect of the present invention becomes more pronounced as the connection portion is located inside the electric circuit component.

The electrical connection member according to the present invention is constructed by embedding a plurality of metal members in an insulator. Each metal member is insulated from each other by an insulator.

Moreover, one end of the metal member is exposed to the first electric circuit component side, and the other end is exposed to the second electric circuit component side. Furthermore, one or both of powder and fibers made of an inorganic material are dispersed in the insulator.

Here, as the material of the metal member, gold is preferable, but any metal or alloy other than gold may also be used.For example, Cu, AJI, Sn.

Examples include metals or alloys such as Pb-3n.

Furthermore, the cross section of the metal member can be circular, square, or any other shape.

Further, the thickness of the metal member is not particularly limited, and may be set to 1, for example, 20 JLmφ or more or 20ILmφ or less, taking into consideration the pitch of the connecting portions of the electric circuit components.

Note that the exposed portion of the metal member may be on the same surface as the insulator, or it may be made to protrude from the surface of the insulator. It may be made into a shape.

Furthermore, the spacing between the metal members may be the same as the spacing between the connecting parts of the electrical circuit components, or may be narrower than that, and when the spacing is narrower, the spacing between the electrical circuit components and the electrical connecting members may be the same. It becomes possible to connect the electrical circuit component and the electrical connection member without requiring positioning.

Also, metal members do not need to be placed vertically in the insulator;
It may run obliquely from the first electric circuit component side toward the second electric circuit component side.

Furthermore, the electrical connection member may be composed of one layer or multiple layers of two or more layers.

In the present invention, one or both of powder and fibers made of an inorganic material are dispersed in the insulator.

Here, the inorganic material refers to materials other than metal materials and organic materials, such as SiC and Bed.

B4 C, TaC, TiB2, CrB2. TiN.

Examples include ceramics such as BP, BN, AmiN, Si3N4, and SiO2, diamond, C, B, and glass. Powder or mr made of these inorganic materials
One or more types of a may be used. Moreover, only one of powder or fiber may be used, or both may be used.

The size and shape of the powder and fibers to be dispersed, as well as the position and quantity of the dispersed particles in the insulator, should be determined in such a way that metal members embedded in the insulator may come into contact or short circuit due to the powder or fibers. , is arbitrary as long as it does not cut. However, the size of the powder and fibers is preferably smaller than the distance between adjacent metal members, that is, it is preferable that the metal members do not come into contact with each other even through the powder and fibers. The fibers may or may not be exposed to the outside of the insulation.

The powder and fibers may or may not be in contact with each other.

The insulator of the electrical connection member is not particularly limited as long as it is an insulating material; for example, an insulating resin may be used;
When using a resin, the type of resin is not limited; either thermosetting resin or thermoplastic resin may be used6.For example, polyimide resin, polyphenylene sulfide resin, polyethersulfone resin, polyetherimide resin, polysulfone resin, Silicone resin, fluororesin, polycarbonate resin, polydiphenyl ether resin, polybenzylimidazole resin, phenolic resin, urea resin,
Melamine resins, alkyd resins, epoxy resins, polyamideimide resins, polypropylene resins, polyvinyl chloride resins, polystyrene resins and other resins can be used.

When using the above resin as an insulator material.

To disperse the powder or fibers into the insulator, simply add the powder or fibers to the resin, stir the resin, and, of course,
Powder or fibers may be dispersed in the insulator by any other method other than this method.

Among the above resins, it is more preferable to use a resin with good thermal conductivity because even if the semiconductor element has heat, the heat can be dissipated through the resin. If you select a material that has the same or similar coefficient of thermal expansion as the substrate, it will be possible to
It becomes possible to further prevent a decrease in reliability of the device.

In the electric circuit member according to the present invention, the above-described electric connection member is used to connect the first electric circuit component and the second electric circuit component.

Any known connection method may be used as the connection method. The connection may be made mechanically, for example by pressing the electrical circuit component and the electrical connection member.

[Operation] In the present invention, since the above-described electrical connection member is used to connect the first electrical circuit component and the second electrical circuit component, the connecting portion of the electrical circuit component can be placed inside. This also makes it possible to increase the number of connection parts, which in turn makes it possible to increase the density.

Further, the electrical connection member can be made thinner, and from this point of view as well, it is possible to make the electrical circuit member thinner.

Furthermore, since the amount of metal members used for the electrical connection member is small, the cost is low even if expensive gold is used as the metal member.

In the present invention, since the powder or fibers are dispersed in the insulator of the electrical connection member, the thermal conductivity from the first electrical circuit component to the second electrical circuit component and the electrical Heat conductivity from the circuit component to the first electric circuit component is improved.

In other words, if the thermal conductivity of the electrical connection member is good, and if an electrical circuit component with a large amount of heat is used as the first electrical circuit component, and an electrical circuit component that is less affected by heat is used as the second electrical circuit component, If selected, the heat generated from the first electrical circuit component is quickly conducted to the second electrical circuit component via the electrical connection member, and this heat is radiated from the second electrical circuit component. Therefore, it is possible to obtain an electric circuit member with good heat dissipation characteristics.

Furthermore, when powder or fibers made of an inorganic material are dispersed in the insulator of the electrical connection member, the coefficient of thermal expansion of the insulator of the electrical connection member approaches the coefficient of thermal expansion of the electric circuit component, and heat is added to the insulator. It is possible to prevent phenomena that impair the reliability of a semiconductor device, such as cracks in insulators and metal members, or changes in characteristics of electric circuit components, which may occur when the semiconductor device is heated, and a highly reliable semiconductor device can be obtained.

Note that the present invention provides significant effects when the difference in coefficient of thermal expansion between the first electric circuit component and the second electric circuit component is large.

[Example] (First Example) A first example of the present invention will be described based on FIGS. 1 and 2.

In this embodiment, the electrical connection member 125 electrically insulates the plurality of metal members 107 made of metal or alloy from each other, and
One end of the is exposed to the first circuit board 101 side, and on the other hand,
The other end of the metal member 107 is exposed to the second circuit board 104 side and is embedded in an insulator 111, and the insulator 111 includes powder or fiber made of an inorganic material. ! I (not shown) are dispersed. Then, the electric circuit member connects the circuit board 101 which is the first electric circuit component having the connection part 102 and the circuit board 104 which is the second electric circuit part having the connection part 105 to both the circuit boards 10
1 and 104, with the electrical connection member 125 interposed between them.
.

104 and connected at connecting portions 102 and 105.

This example will be explained in more detail below.

First, the electrical connection member 125 will be explained while explaining one manufacturing example of the electrical connection member 125.

FIG. 2 shows one manufacturing example.

First, as shown in FIG. 2(a), metal wires 121 made of metal or alloy such as gold and having a diameter of 20 ILmφ are connected at a pitch of 4.
After wrapping, the metal wire 121 is embedded in a resin 123 such as polyimide. Before embedding, powder made of 5i02 is mixed in the resin and stirred to incorporate the powder into the resin. disperse. After embedding, the resin 123 is cured. The cured resin 123 becomes an insulator. Thereafter, it is sliced at the position of the one-dot line 124 to create an electrical connection member 125. The electrical connection member 125 created in this way is shown in FIGS. 2(b) and 2(C).
Shown below.

In this example, the powder was dispersed by stirring the resin, but the powder may be dispersed by other methods.

Further, in this example, powder made of 5i02 is dispersed in the resin 123, but powder or fiber made of an inorganic material other than 5iOz may be dispersed.

In the electrical connection member 125 created in this way,
The metal wire 121 constitutes the metal member 107, and the resin 123 constitutes the insulator 111.

In this electrical connection member 125, metal wires 121 serving as metal members are electrically insulated from each other by resin 123. Further, one end of the metal wire 121 is exposed to the circuit board 101 side, and the other end is exposed to the circuit board 104 side. These exposed portions become connection portions 108 and 109 with circuit boards 101 and 104, respectively.

Next, the first circuit board 101, the electrical connection member 125,
! Preparing the circuit board 104 of @$2 The circuit board lot 104 used in this example has a large number of connection parts 102 and 105 inside thereof, as shown in FIG.

Note that the connection portion 102 of the first circuit board 101 is connected to the connection portion 105 of the second circuit board 104 and the electrical connection member 12.
Metal is exposed at positions corresponding to the connection parts 108 and 109 of No. 5.

The connection part 102 of the first circuit board lol and the connection part 108 of the electrical connection member 125 or the second circuit board 1
Connection part 1 between the connection part 105 of 04 and the electrical connection member 125
Perform positioning so that 09 corresponds, and after positioning,
Make the connection.

When the connection state of the electric circuit member produced as described above was examined, it was found that the connection was highly reliable.

8. The heat dissipation properties were also good.

(Second example) FIG. 3 shows a second embodiment.

In this example, a circuit board 51 is used as a first electric circuit component having a connection part 52, and a semiconductor element 4 having a large number of connection parts 5 therein is used as a second electric circuit component.

Note that the electrical connection member 125 in which one or both of powder and fibers is dispersed in the insulator has a size corresponding to the semiconductor element 4.

Other points are similar to the first embodiment.

In this example as well, the connection section was connected with high reliability. The heat dissipation properties were also good.

(Third example) FIG. 4 shows a third embodiment.

In this example, the first electric circuit component is the semiconductor element 4, and the second electric circuit component is the circuit board 51.

Note that after connection, a lead frame l is placed on the top surface of the circuit board 51.
were connected and sealed with a sealing material 63.

Other points are similar to the first embodiment.

In this example as well, the connection section was connected with high reliability. The heat dissipation properties were also good.

(Fourth example) FIG. 5 shows a fourth embodiment.

In this example, the first electric circuit component is a semiconductor element of 4°,
This is an example in which the second electric circuit component is the semiconductor element 4. In this example, an electrical connection member with dimensions corresponding to the semiconductor element 4 is used, and the lead frame l is connected to the first electrical connection member 125. It is connected to the metal member exposed on the semiconductor element 4' side.

The rest is the same as the third embodiment.

In this example as well, the connection section was connected with high reliability. The heat dissipation properties were also good.

(Fifth example) FIG. 6 shows a fifth embodiment.

In the fifth embodiment, a circuit board 101 is used as a first electric circuit component and a second electric circuit component, and the portions other than the connecting portions are covered with insulating films 103 and 106.

This is an example in which 104 is used.

Further, as an electrical connection member, one shown in FIG. 7 was used. That is, the electrical connection member 125 shown in FIG. 7, in which powder or fibers are dispersed in the insulator,
The exposed portion of 07 protrudes from the surface of the resin insulator 111. Such electrical connection member 125 may be created, for example, by the following method.

First, by the method described in the first embodiment, as shown in FIG. 2(b),
After preparing the electrical connection member shown in (c), both surfaces of the electrical connection member may be etched until the metal wire 121 protrudes from the polyimide resin 123 by about 1101L.

Note that in this embodiment, the protrusion amount of the metal wire 121 is 1101L.
However, any amount may be used.

Furthermore, the method for making the metal wire 121 protrude is not limited to etching, and other chemical or mechanical methods may be used.

Other points are similar to the first embodiment.

Note that the protruding portion and the electrical connection member 125 are connected to the metal wire 121.
A bump 150 as shown in FIG. 8 may be formed by inserting the metal wire 121 into a mold having a recess at the position , and crushing the protrusion 126 of the metal wire 121 .

In this case, the metal wire 121 becomes difficult to fall off from the insulator 111.

Note that in this example as well, the metal wire 121 constitutes the metal member 107, and furthermore, the resin 123 constitutes the insulator 111.

Note that the bumps may be created by melting the protrusions with heat, or any other method may be used.

In this example as well, the connection section was connected with high reliability. The heat dissipation properties were also good. (Sixth Example) FIG. 9 shows the sixth example.

In this example, a semiconductor element 4 is used as the first electrical circuit component, and a lead frame I is used as the second electrical component.

Other points are similar to the fifth embodiment.

In this example as well, the connection section was connected with high reliability. The heat dissipation properties were also good. (Seventh Example) FIG. 10 shows the seventh example.

In this example, the electrical connection member 125 is different from the electrical connection member shown in the fifth embodiment. That is, in the electrical connection member 125 of this example, the pitch between the metal members is narrower than that shown in the fifth example.

That is, in this example, the pitch between the metal members 107 is set to be narrower than the interval between the first circuit board connecting portions.

That is, in the fifth embodiment, the first circuit board 101 and the second
An electrical connection member 125 is located at the connection position with the circuit board 104.
Because the connection position was arranged.

Although it was necessary to position the electrical connection member 125, in this example, the first circuit board 101 and the second circuit board 104
Although positioning with the electrical connection member 125 is necessary, positioning with the electrical connection member 125 is not necessary. Therefore, the first circuit board 1
01 and the second circuit board 104 (dll, pH
) and the connection dimensions (d12.PI3) of the electrical connection member to appropriate values, it is also possible to connect without positioning.

In this example as well, the connections were connected with high reliability and the heat dissipation characteristics were also good.

(Eighth Example) FIG. 11 shows an electrical connection member used in the eighth example.

FIG. 11(a) is a perspective view of the electrical connection member, FIG.
b) is a sectional view of the electrical connection member.

An example of making such an electrical connection member will be described below.

First, electrical connection members 128, 129, 1 in which powder or fibers are dispersed in an insulator are manufactured using the manufacturing method shown in the first embodiment.
Prepare three pieces of 30.

The position of the metal wire 121 in the first sheet 12B is m row and n column, m
It is displaced from the center by a and nb. The position of the metal wire 121 in the second sheet 129 is in the mth row and nth column, and is displaced from the center by mac and nbc. The position of the metal wire 121 of the third sheet 130 is in m rows and n columns, and is displaced from the center by mad and nbd. a.

The values of b, c, and d are such that the upper and lower metals 121 are electrically conductive, but the left and right sides are not electrically conductive with each other. The three electrical connection members are positioned and laminated using a method such as heat pressing to create the electrical connection member 125.

In addition, in this example, the positions of the metals of the electrical connection members were selected according to rules such as m rows and n columns, but the metals on the top and bottom were conductive, and the left and right sides were not electrically conductive with each other. It can be random if you do.

In addition, although this example describes the case where three layers are laminated, two
Any number of layers may be used as long as the electrical connection member of this example is laminated using a thermocompression bonding method. 7th
A protrusion may be provided as shown in the figure, or a bump tSO may be provided as shown in FIG.

In this example as well, the connections were connected with high reliability and the heat dissipation characteristics were also good.

(Ninth Example) FIG. 12 shows an electrical connection member used in the ninth example.

FIG. 12(a) is a cross-sectional view of the electrical connection member during manufacture;
FIG. 12(b) is a perspective view of the electrical connection member,
Figure (C) is the above sectional view.

First, metal wire guide plates 131 and 132 are prepared. Then, the gold Em 121 is passed through desired holes 133 and 134 made in the metal wire guide plates 131 and 132, and stretched to a desired tension. After that, resin 1 is placed between the metal wire guide plates 131 and 132.
Pour No. 23 and harden it. Note that before pouring the resin 123, powder or fibers are added to the resin 123 in advance,
After dispersing the powder or fibers in the resin and cutting, the guide plate is removed and the electrical connection member 125 is created. Further, the electrical connection member of this example may be processed to provide a protrusion as shown in FIG. 7, or a bump 150 as shown in FIG. 8.

The first circuit component and the second electric circuit component of this example are:
Each of them is one of circuit base materials such as a semiconductor element, a circuit board, and a lead frame.

In this example as well, the connection section was connected with high reliability. The heat dissipation properties were also good. [Effects of the Invention] Since the present invention is constructed as described above, the following numerous effects can be obtained.

1. Highly reliable connections between semiconductor elements and circuit substrates such as circuit boards and lead frames can be obtained. Therefore, the conventionally used wire bonding method, TAB
It becomes possible to replace the CCB method.

2. According to the present invention, the connection parts of electric circuit components can be placed in any position (especially inside), which enables more multi-point connections than the wire bonding method or TAB method, and is suitable for connection with a large number of bins. This is the method.

Further, since the presence of an insulating material between adjacent metals of the electrical connection member prevents electrical conduction between adjacent metals, more multi-point connections are possible than in the CCB method.

3. Since the amount of metal members used in the electrical connection member is small compared to the conventional one, even if expensive metal such as gold is used for the metal member, it will be cheaper than the conventional one.

4. High-density semiconductor devices and the like can be obtained.

5. By selecting a material with good thermal conductivity as the electrical insulating material of the electrical connection member, heat dissipation from the electric circuit components becomes good, and a semiconductor device with good heat dissipation can be obtained.

6. Powder or fibers made of inorganic material are dispersed in the insulator of the electrical connection member, so even if heat is generated in the first electrical circuit component or the second electrical circuit component, electrical connection will not occur. The heat is radiated to the outside through the member. Therefore, an electric circuit member with good heat dissipation properties can be obtained.

7. Even when heat is applied, less thermal stress is generated, and a highly reliable electric circuit member and, by extension, a semiconductor device can be obtained.

Of course, a highly reliable semiconductor device can be obtained by selecting a material having the same or similar coefficient of thermal expansion as the semiconductor element and the circuit substrate as the electrically insulating material of the electrical connection member.

By embedding or laminating other substances in the insulator of the electrical connection member, an electrical circuit member with good heat dissipation, low stress, and shielding efficiency can be obtained.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing a first embodiment. Figure 1(a)
2 shows the state before connection, and FIG. 2(b) shows the state after connection. FIG. 2 is a diagram for explaining an example of a manufacturing method of the electrical connection member used in the first embodiment. , Figure 2(a)
2(b) is a perspective view, and FIG. 2(c) is a sectional view. FIG. 3 shows a second embodiment, with FIG. 3(a) being a perspective view and FIG. 3(b) being a sectional view. FIG. 4 is a sectional view showing the third embodiment. FIG. 5 is a sectional view showing the fourth embodiment. 6 shows a fifth embodiment, FIG. 6(a) is a sectional view showing the state before connection, and FIG. 6(b) is a sectional view showing the state after connection. FIGS. 7 and 8 also show the fifth embodiment, with FIGS. 7(a) and 8(a) being perspective views, and FIGS. 7(b) and 8(b) being sectional views. It is. 9 shows a sixth embodiment, FIG. 9(a) is a perspective view showing the state before connection, and FIG. 9(b) is a sectional view showing the state after connection. FIG. 10 is a sectional view showing the seventh embodiment,
Figure 10(a) shows the state before connection, and Figure 10(b)
11 shows the electrical connection member according to the eighth embodiment, and FIG. 11 (&) is a perspective view,
FIG. 11(b) is a sectional view. FIG. 12 shows an example of manufacturing an electrical connection member according to the ninth embodiment, and FIG.
) and (c) are cross-sectional views, and FIG. 12(b) is a perspective view. 13 to 20 show conventional examples, and the first
4 are cross-sectional views, and FIG. 14 is a plan perspective view. 1.-v-de frame, 2. Element mounting part of lead frame, 3. Silver paste, 4.4'... Semiconductor element, 5
．． 5°・Connection portion of fist semiconductor element, 6.Connection portion of lead frame, 7.. Ultrafine metal wire, 8.. Resin, 9.. Semiconductor device, lO.. Outer periphery of semiconductor element, 11.. Outer periphery of element mounting portion of lead frame, 16--carrier film substrate, 17--inner lead portion of carrier film substrate, 20--resin, 21--resin, 31--solder bump, 32--one substrate, 33... Connection part of the board, 51
...Circuit board, 52... Connection part of circuit board, 54... Before connection of electrical connection member, 55 - Lead frame, 63
...Sealing material, 70°70'...Metal material, 71.71'
--Insulating film, 72, 72'--Exposed surface of insulating film,
73.73'...Exposed surface of metal material, 75,75°...
Circuit base material, 76.76°...Connection part of circuit base material, 77
・・Insulating material of anisotropic conductive film, 78・Fist anisotropic conductive film,
7911. Conductive particles, 81.. Insulating material of elastic connector, 82.. Metal wire of elastic connector, 8
3.Elastic connector, 101.-Circuit board, 1
02... Connection part, 103... Insulating film, 106... Insulating film, 104... Circuit board, 105... Connection part, 107 Metal member, 108-- Connection part, 109... Connection part, 111...
・Insulator, 121...Golden gil, 122 Fist/stick, 123
- Fist resin, 124... Dotted line, 125... Electrical connecting member, 1260 Fist protrusion, 128° 129.130... Electrical connecting member, 131° 132... Metal wire guide plate, 150.
·bump. Figure 1 (a) Figure 1 (b) Figure 3 (a) Figure 3 (b) Figure 4 Figure 5 54 1 Dozu Figure 6 (0) Figure 6 (b) Figure 7 ( a) Figure 7 (b) Figure 9 (a) Figure 10 (0) Figure 10 (b) Figure 11 (a) Figure 11 (b) Figure 13 Figure 14 Figure 15 Figure 16 3l-jlpO Figure 17 Figure 18

Claims (1)

[Claims] 1. An electrical connection member for electrically connecting a first electrical circuit component having a connection portion and a second electrical circuit component having a connection portion, the electrical connection member comprising: , a plurality of metal members made of metal or alloy, one end of the metal member being exposed to the first electric component side, and the other end of the metal member being exposed to the second electric circuit component side. , each metal member is embedded in an insulator so as to be electrically insulated from each other, and one or both of powder and fiber made of an inorganic material is dispersed in the insulator. An electrical connection member characterized by: 2. A first electrical circuit component having a connection part and a second electrical circuit component having a connection part, and an electrical connection member for electrically connecting both the electrical circuit components between the two electrical circuit components. In an electric circuit member configured by connecting both electric circuit components at a connecting portion with a The metal member is buried in an insulator such that the metal member is exposed to the electrical component side, and the other end of the metal member is exposed to the second electric circuit component side, and the respective metal members are electrically insulated from each other. and one or both of powder and fiber made of an inorganic material is dispersed in the insulator, and is exposed at the connection part of the first electric circuit component and the first electric circuit component side. An electric circuit member characterized in that one end of the metal member is connected to the second electric circuit component, and a connecting portion of the second electric circuit component is connected to one end of the metal member exposed on the side of the second electric circuit component. 3. The electrical connection according to claim 1, wherein the first electric circuit component and the second electric circuit component are each one of a circuit base material such as a semiconductor element, a circuit board, or a lead frame. Element. 4. The electric circuit member according to claim 2, wherein the first electric circuit component and the second electric circuit component are each one of circuit base materials such as a semiconductor element, a circuit board, and a lead frame. .