JPH0419970A - Electric circuit member - Google Patents

Abstract

PURPOSE:To easily connect each of electric circuit parts to a substrate at low temperatures by using a substrate which has a conductive adhesive layer at its connecting portion. CONSTITUTION:An electrically connecting member 1 comprises a plurality of conductive members 4 electrically insulated from each other and each mounted in a support 5 made from polyimide and a bump 8 at one end of each member 4 is exposed to the side of electric circuit parts 2 and a bump 9 at the other end of each conductive member 4 is exposed to the side of a circuit substrate 3a. The connecting portion 15 of the parts 2 which is not covered with a passivation film 16 and the bump 8 of each member 4 exposed to the side of the parts 2 are connected to each other by means of metallization and/or alloying and the connecting portion 17 of a conductive adhesive layer 14 formed on the metal electrode 18 of the circuit substrate 3a and the bump 9 at the other end of each member 4 exposed to the side of the circuit substrate 3a are connected to each other by means of adhesion, for achieving electrical connection. The connecting portion 17 of the layer 14 of the circuit substrate 3a and the bump 9 of each conductive member can be securely connected to each other at low temperatures below 18O deg.C.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electric circuit member, and particularly to an electric circuit member in which an electric circuit component is connected to a base via an electrical connection member.

[Background technology] Conventionally, the connections between base bodies such as frames and circuit boards and electric circuit components have been made using connectors, crimp terminals, soldering, wire bonding, and TAB (Tape Automated).
bonding) method, CCB (chondral bonding) method,
Cola Abst Bonding: Controlled
A collapsed bonding method, a method using an anisotropic conductive film, and the like are known. However, in these methods, the minimum pitch required to prevent adjacent connection parts from coming into contact with each other is relatively large, so there is a problem that they cannot be used when a small pitch between connection parts is required. Ta. Furthermore, this method has problems in terms of electrical characteristics because the wiring becomes long, resulting in increased resistance and stray capacitance, which is particularly noticeable in high-frequency electrical circuits.

It is necessary to solve these problems (i.e., an electrical connection member that has a structure in which a plurality of conductive members are held insulated from each other in an insulating holder, or wiring inside the insulating holder and/or on the holder surface). A method of electrically connecting electrical circuit components using an electrical connecting member configured such that both ends of the connecting conductive member are exposed on both sides of the holder, flush with or protruding from the surface of the holder. has been proposed (Japanese Unexamined Patent Publication No. 632)
22437, JP-A-63-224235, etc.).

FIGS. 3(a) and 3(b) are schematic diagrams showing electrical connections between electrical circuit components using one such electrical connection member, in which 1 is the electrical connection member and 23 is the electrical connection member. Indicates electrical circuit components to be connected. The electrical connection member 1 includes a plurality of rod-shaped conductive members 4 made of metal or alloy, each of which is electrically insulated from each other, and held in a holder 5 on a thin plate made of an electrically insulating material. The conductive member 4
Both ends thereof are protruded toward the electric circuit components 2 and 3 as bumps 8 and 9, respectively (see FIG. 3(a)).

Then, the connecting portion 6 of one electric circuit component 2 and the conductive member 4
Also, the connecting portion 7 of the other electric circuit component 3 and the bump 9 of the conductive member 4 are connected by metallizing and/or alloying, for example, by thermocompression bonding, ultrasonic heating, etc. , the electric circuit components 2 and 3 are electrically connected to each other (see FIG. 3(b)).

By the way, the method shown in FIGS. 4(a) to 4(e) has been proposed as a method for manufacturing the electrical connection member 1. In this method, first, a photosensitive resin 11, which will become the holder 5, is applied onto a copper foil 10 made of a conductive material (see Fig. 4(a)!).
. Next, in a post-process, a predetermined position where the conductive member 4 is to be buried is exposed and developed to form a hole 12 in the photosensitive resin 11.
is formed to expose the copper foil 10. Next, the temperature is raised to harden the photosensitive resin 11 (see FIG. 4(b)).

Then, the copper WIO in the vicinity of the hole 12 is etched to form a recess 13 in the lower part of the hole 12 (see FIG. 4(c)).

Thereafter, by plating the copper foil 10 with gold or the like, the conductive member 4 is filled in the recess 13 and the hole 12, the bump 9 is formed in the recess 13, and the upper surface of the photosensitive resin 11 is A bump 8 is formed on the surface (see FIG. 4(d)).

Thereafter, the electrical connection member 1 is completed by removing the copper foil 10 by metal etching (Fig. 4(e)
)reference).

[Problems to be Solved by the Invention] However, by metallizing and/or alloying by thermocompression bonding, ultrasonic heating, etc. as shown in FIG. In the method of connecting the bumps, there is a problem that the electrical circuit components are exposed to heat during the connection, and therefore it is impossible to connect with materials with low heat resistance.

By the way, there is already a known method for making electrical connections by adhesion at relatively low temperatures without using high-temperature heating (Japanese Unexamined Patent Publication No. 6
3-151031). In this method, the electrodes of the circuit board coated with ultraviolet curable resin and the electrodes of the bumped semiconductor element are positioned, crimped, and irradiated with ultraviolet rays to make electrical connections by utilizing the curing and shrinkage of the resin. With this method, it is difficult to blend the resin, and there are many technical issues in obtaining the desired resin.

In addition, since resin is likely to be contained in the connection portion, the connection resistance value becomes large, and the difference in thermal expansion coefficients becomes large (because of this, quality problems occur).

Furthermore, since resin is present between adjacent connection parts, there is a large difference in coefficient of thermal expansion, resulting in quality problems such as peeling and cracking.

The present invention has been made in view of the above circumstances, and it is possible to easily connect an electric circuit component and a base at a low temperature by using a base having a conductive adhesive layer formed by a relatively easy method at the connection part. The purpose of the present invention is to provide an electric circuit member that can perform the following steps.

[Means for Solving the Problems] That is, the present invention includes a holder made of an electrically insulating material, and a plurality of conductive members installed on the holder in a mutually insulated state, and each of the conductive members An electrical connection member whose both ends are exposed on both sides of the holder at the same level as or protruding from the surface of the holder, and a metal electrode of the base material on which a pattern is drawn on the electrical insulating material, It has at least one connecting portion having a conductive adhesive layer formed by electrophoresis from an adhesive resin solution containing one or both of ultrafine metal powder and metallized ceramic powder, and At least one of the conductive members exposed on one surface of the holder of the electrical connection member at the connection portion (at least one base body to which one end is electrically connected by adhesive, and at least one At least one or more electrically conductive members having the above-mentioned connection portions, and one end of at least one of the conductive members exposed on the other surface of the holder of the electrical connection member at the connection portion is electrically connected. An electric circuit member characterized by having an electric circuit component.

The present invention will be explained in detail below.

The electric circuit member of the present invention includes a holder made of an electrically insulating material and a plurality of electrically conductive members installed on the holder in a mutually insulated state. A substrate having a conductive member and a conductive adhesive layer eutectoid formed by electrophoresis from an adhesive resin solution containing one or both of ultrafine metal powder and metalized ceramic powder in the electrode part. The connecting part is electrically connected by adhesive, and the conductive member exposed on the other surface of the electrical connecting member is electrically connected to the connecting part of the electric circuit component. be.

Although this conductive adhesive layer is usually in a solid state, the present invention is not limited thereto, and includes cases in which, for example, it is heated to become a gel or sol.

The electric circuit member of the present invention can be connected by adhesion at a relatively low temperature even in the case of a substrate with low heat resistance.
Not only is connection easy, but the range of substrate selection is widened, and the range of applications is widened.

Further, since only the connecting portions are connected, quality problems due to differences in thermal expansion coefficients can be avoided, so that an electric circuit member with good quality characteristics can be obtained.

Further, in the electric circuit member of the present invention, wiring is provided inside the holder and/or on the surface of the holder so that predetermined conductive members among the plurality of conductive members provided in the electrical connection member are electrically connected to each other. It is preferable that the

Further, in the electric circuit member of the present invention, one of ultrafine metal powder or metallized ceramic powder or By providing a conductive adhesive layer eutectoidally formed from an adhesive resin solution containing both by electrophoresis, it is possible to obtain an electrical circuit member with excellent shielding properties.

Further, the average particle size of the ultrafine metal powder contained in the conductive adhesive layer formed on the electrode of the base of the electric circuit member is 0. O
The average particle size of the metallized ceramic powder is preferably in the range of 1 to 2p, m, and 0.1 to 5H. Further, the content of one or both of the ultrafine metal powder and the metallized ceramic powder contained in the conductive adhesive layer is 30 to 80 wt.
A range of % is desirable.

Furthermore, the electric circuit components used in the electric circuit member of the present invention are preferably electric circuit components such as resin circuit boards, metal circuit boards, ceramic circuit boards, lead frames, and semiconductor elements. Moreover, it is preferable that the base body is a frame, a circuit board, or a lead frame.

[Example] Hereinafter, the present invention will be explained in more detail with reference to Examples.

Example 1 FIGS. 1(a) and 1(b) are schematic diagrams showing an example of the electric circuit member of the present invention. This figure shows a state in which an electrical connection is made between a circuit board having a conductive adhesive layer and an electric circuit component via an electrical connection member, and FIG.
shows the state before connection, and FIG. 1(b) shows the state after connection. In the figure, 1 is an electrical connection member, 3a is a circuit board (substrate), and 2 is an electric circuit component (semiconductor element).

The electrical connection member 1 can be manufactured by a known method.

In FIG. 1, the electrical connection member 1 is constructed by installing a plurality of conductive members 4 made of gold in a holder 5 made of polyimide with the conductive members 4 electrically insulated from each other. , the bump 8 at the end of the conductive member 4 is connected to the electric circuit component 2
The bump 9 at the other end of the conductive member 4 is exposed to the circuit board 3a side (see FIG. 1(a)).

Then, the connecting portion 15 of the electric circuit component 2 that is not covered with the passivation film 16 and the bump 8 of the conductive member 4 exposed on the side of the electric circuit component 2 are connected by metallization and/or alloying, and the circuit board 3a The connecting portion 17 of the conductive adhesive layer 14 formed on the metal electrode 18 is connected by adhesive to the bump 9 at the other end of the conductive member 4 exposed on the circuit board 3a side to establish an electrical connection (first (see figure (b)).

The AP material of the connection part of the electric circuit component 2 and the conductive member A
The connection temperature with the u material is preferably 200 to 400°C. Also, when the connection part of the electric circuit component 2 is made of Au material, 20
Connection was possible between 0 and 400°C.

On the other hand, the connection between the connecting portion 17 of the conductive adhesive layer 14 of the circuit board 3a and the bump 9 of the conductive member was possible at a low temperature of 180° C. or lower, and a good connection was obtained.

In addition, in the case of connection, it is necessary to position the electric circuit component 2 and the circuit board 3a, but the pitch of the conductive members 4 of the electrical connection member 1 is set so that the pitch between the connection portion 15 of the electric circuit component 2 and the connection portion of the circuit board 3a is Since the pitch is smaller than 17, the positioning of the electrical connection member 1 may be rough.

Next, an example of a method for forming a conductive adhesive layer on a metal electrode of a base will be described below.

After degreasing 18 pm thick copper foil with alcohol solvent, use alkaline cleaner (product name Pakuna #19, manufactured by Yuken Chemical Co., Ltd.)
After degreasing at 30 g/ρ for 1 minute at a bath temperature of 70°C,
Washing with water, pickling with a 10% sulfuric acid solution for 30 seconds, washing with water, and washing with demineralized water completed the surface activation treatment.

Next, polyester resin (product name FINETEXES)
525, manufactured by Dainippon Ink Chemical Co., Ltd.), 40 parts by weight of polyester resin (trade name: FINETEX 525, manufactured by Dainippon Ink Chemical Co., Ltd.), and a crosslinking agent (trade name: PE
RMASTAT R-5, manufactured by Inumimoto Ink Chemical Co., Ltd.), 5 parts by weight, and a catalyst (trade name: Cat PA-20, manufactured by Dainippon Ink Chemical Co., Ltd.), 2.5 parts by weight, were mixed, and further, an average particle size of 0. 02pm copper powder 30 parts by weight and average particle size 1μm
20 parts by weight of nickel-plated powder with a thickness of 0.2 μm was mixed on the surface of alumina, and 30 parts by weight was mixed in a ball mill.
After being dispersed for a period of time, diluted to 15 wt% with demineralized water,
C., pHg, 5, using the substrate as an anode and a stainless steel plate as a counter electrode, an electrodeposition process was carried out at an applied voltage of 100 V and a processing time of 3 minutes to obtain a film thickness of 1101 L. after that,
It was completed by laminating it to the adherend metal and heating it at 50°C for 10 minutes.

The resin used for the conductive adhesive layer may be based on acrylic, epoxy, polyamide, acrylic/melamine, polyacrylic acid, or other resins in addition to polyester.

Ultrafine metal powders include not only copper but also Au, Ag+ AR
+Be, Ca, Mg, Mo, Fe, Ni,
Co, Mn, W, Cr, Nb.

Zr, Ti, Ta, Zn, Sn, Pb-3n
etc.

In addition, ceramic powders include SiO2, B20a, Aj
'20a.

Na2O, K2O, Cab, ZnO, Bad, Pb
O,5b2()3. AS203La203. ZrO
□, P2O5, Ti0z, MgO, SiC, Bed
, BPBN, AfN, B4C, TaC, TiBz
, CrBz, TiN, ceramics such as Si3N4°Ta205, diamond, glass.

Examples include carbon and boron.

The metallized ceramic powder used is the above-mentioned ceramic powder with a metal material attached thereto. The method for attaching the metal material may be a wet method such as plating, or a dry method such as vapor deposition or sputtering.

Further, the average particle size of the ultrafine metal powder contained in the conductive adhesive layer formed on the conductive member of the electrical connection member is 0.01
~2μm, preferably 0.05-1.5μm, and the average particle size of the metallized ceramic powder is 0.1-5pm
, preferably in the range of 1.5 to 4 μm. The conductive adhesive layer contains one or both of ultrafine metal powder and metalized ceramic powder, and the content is usually 30 to 80 wt%, preferably 35 to 45 wt%. .

When both ultrafine metal powder and metallized ceramic powder are contained, the metalized ceramic powder is mixed at a ratio of 20 to 80 parts by weight to 100 parts by weight of the ultrafine metal powder. It is preferable to use a mixed powder.

Embodiment 2 FIGS. 2(a) and 2(b) are schematic diagrams showing another embodiment of the electric circuit member of the present invention. The figure shows that a copper foil is provided on the surface of the circuit board 3a of Example 1 opposite to the surface on which the connection portion 17 on which the conductive adhesive layer 14 is formed, and a conductive adhesive is applied on the copper foil. The layer 14b was provided in the same manner as the conductive adhesive layer in Example 1, and the other components were the same as in Example 1. In this electric circuit member, a good connection was possible and an electric circuit member with a good shielding effect was obtained.

[Effects of the Invention] As explained above, the electric circuit member of the present invention allows for narrower pitch and multi-bin joining than conventional ones, so that a high-density electric circuit member can be obtained. In addition, since the wiring length of the conductive member can be shortened, it becomes a low-resistance wiring, generates less heat, and reduces stray capacitance, which improves electrical characteristics such as less signal delay, making it an electrical circuit material with good electrical characteristics. is obtained.

This effect is particularly strong in high-frequency electrical circuits.

Further, the present invention provides a conductive adhesive formed eutectoid by electrophoresis from an adhesive resin solution containing one or both of ultrafine metal powder and metallized ceramic powder on a metal electrode of a substrate. Since there are layers, when it comes to connections,
Since electrical connections are made by adhesion, it is possible to use base materials with relatively low heat resistance, and since connections can be made easily, parts and devices with a wide range of applications can be obtained.

Further, in the present invention, since the conductive adhesive layer is provided on the metal surface of the base opposite to the surface having the connecting portion, an electric circuit member with a good shielding effect can be obtained. Since it is relatively easy to block electromagnetic noise entering the electric circuit member from the outside world or from the outside world, a very good electric circuit member can be obtained.

[Brief explanation of the drawing]

Figure 1 (a), (b) and Figure 2 (a), (b)
1A and 1B are schematic diagrams showing one embodiment of the electric circuit member of the present invention, in which (a) in each figure shows a state before connection, and (b) shows a state after connection. FIGS. 3(a) and 3(b) are schematic diagrams showing conventional electric circuit members, in which (a) is the state before connection, (b)
) indicates the status after connection. FIGS. 4(a) to 4(e) are process diagrams showing an example of a conventional method of manufacturing an electrical connection member. 1... Electrical connection member 2, 3... Electric circuit component 3a... Circuit board (base) 4... Conductive member 5...
Holder 6, 7.15.17... Connection portion 8.9... Bump 10... Copper foil 11...
Photosensitive resin 12... Hole 13... Concave portions 14, 14a... Conductive adhesive layer 16... Passivation film 18... Metal electrode

Claims (6)

[Claims] (1) It has a holder made of an electrically insulating material, and a plurality of conductive members installed in the holder in a mutually insulated state, and both ends of each of the conductive members are attached to the holder on both sides of the holder. an electrical connection member that is exposed on the same side as the surface of The holder of the electrical connection member has at least one connection portion having a conductive adhesive layer formed by electrophoresis from an adhesive resin solution containing one or both of the electrical connection members. At least one end of at least one of the conductive members exposed on one surface has at least one or more base body to which one end is electrically connected by adhesive, and at least one or more connection part, and at the connection part, the An electric circuit member characterized in that it has at least one electric circuit component to which one end of at least one of the conductive members exposed on the other surface of the holder of the electric connection member is electrically connected. . (2) In the electric circuit member according to claim 1, the inside of the holder and/or
Or an electric circuit member characterized in that wiring is provided on the surface of the holder. (3) An adhesive resin containing one or both of ultrafine metal powder and metallized ceramic powder on at least a portion of the metal surface of the substrate opposite to the surface having the conductive adhesive layer. The electric circuit member according to claim 1 or 2, comprising a conductive adhesive layer formed eutectoid from a solution by electrophoresis. (4) The average particle size of the ultrafine metal powder contained in the conductive adhesive layer is 0.01 to 2 μm, and the average particle size of the metallized ceramic powder is 0.1 to 5 μm, and The content of one or both of the ultrafine metal powder and the metalized ceramic powder contained in the adhesive layer is 30 to 80 W.
The electric circuit member according to claim 1, 2 or 3, which is t%. (5) The electric circuit member according to any one of claims 1 to 4, wherein the electric circuit component is a resin circuit board, a metal circuit board, a ceramic circuit board, a lead frame, or a semiconductor element. (6) The electric circuit member according to any one of claims 1 to 4, wherein the base body is a frame, a circuit board, or a lead frame.