JP2010009713A - Connection structure of electrode terminal - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connection structure of electrode terminals, which reliably and electrically connects two electrode terminals. <P>SOLUTION: Three electrode terminals 3 are formed at equal intervals in an X direction on the surface 1a of a substrate 1. Three electrode terminals 4 are formed at equal intervals in the X direction on the surface 2a of a substrate 2. Thin wires 5 extending in the X direction parallel to both of the surfaces 1a. 2a are disposed near an L-shaped portion formed by the surface 1a of the substrate 1 and the surface 2a of the substrate 2. Three electrode terminals 6 of the annular shape are formed when viewed from an axial direction at equal intervals in the X direction on the outer peripheral surfaces of the thin wires 5. The three electrode terminals 3, 4, 6 are formed in the positions overlapping the X direction respectively. The electrode terminals 3 and the electrode terminals 6, and the electrode terminals 4 and the electrode terminals 6 are in contact with one another, and are electrically connected. Namely, the electrode terminals 3 and the electrode terminals 4 are electrically connected via the electrode terminals 6. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electrode terminal connection structure in which two electrode terminals are electrically connected to each other.

  In recent years, various elements provided in electronic devices have become highly functional and multifunctional. In addition, downsizing of electronic devices is also progressing in order to achieve higher functionality and more functions without increasing the size of electronic devices. Along with this, miniaturization of electrode terminals for electrically connecting each member constituting various elements has been advanced.

  As an example, among a plurality of members constituting various elements, a plurality of electrode terminals are formed on a surface with two members, and the electrode terminals formed on the same member do not short-circuit with each other, and different members It is necessary to electrically connect the electrode terminals respectively formed on each other. At this time, when the surfaces of the two members on which the two electrode terminals to be electrically connected form a certain angle, a difficult technique is required for the electrical connection between the two electrode terminals. .

  As an electrical connection between two electrode terminals when the surfaces of two members form a certain angle, specifically, for example, an electrode terminal on a recording / reproducing head and an electrode on a suspension in a hard disk device An electrical connection with a terminal is mentioned. The surface on which the electrode terminals of the recording / reproducing head are formed and the surface on which the electrode terminals of the suspension are formed are substantially perpendicular to each other. Conventionally, these electrode terminals are ball bonded from the direction orthogonal to each electrode terminal. The wire is supplied and electrically connected.

  In such a hard disk device, since it is desired to realize high-density recording by recording minute recording bits, the recording / reproducing head is being miniaturized. Along with this, miniaturization of electrode terminals on the recording / reproducing head has progressed, and it has been difficult to electrically connect the two electrode terminals in ball bonding because a tool for supplying a wire becomes an obstacle.

  Therefore, in Patent Document 1, the electrode terminal on the recording / reproducing head and the electrode terminal on the suspension are electrically connected via a tape-shaped lead electrode terminal. Specifically, the tip of the tool of the device is brought into contact with the tape-shaped lead electrode terminal that is in contact with each electrode terminal by ultrasonic bonding, and ultrasonic waves are applied from the tool to join the two electrode terminals together. And it is electrically connected.

Japanese Patent Laid-Open No. 9-213036 (FIG. 1)

  However, as described in Patent Document 1, when the tape-shaped lead electrode terminal and the electrode terminal on the recording / reproducing head or suspension are electrically connected by a tool, The tip of the electrode becomes larger than the electrode terminal. Then, it becomes difficult to make the tool contact only the desired electrode terminal and apply the ultrasonic wave.

  Also, in ultrasonic bonding, a deviation occurs when the tip of the tool is brought into contact with the electrode terminal, and a deviation due to ultrasonic vibration occurs when the electrode terminals are joined by the tool. The influence of these deviations is relatively greater as the electrode terminals are smaller, and it becomes difficult to accurately join the electrode terminals on the recording / reproducing head or suspension and the tape-like lead electrode terminals.

  A main object of the present invention is to provide an electrode terminal connection structure that can reliably connect two electrode terminals.

Means for Solving the Problems and Effects of the Invention

  In the electrode terminal connection structure of the present invention, the first and second electrode terminals respectively formed on the surfaces of the two members are electrically connected via the third electrode terminal formed on the outer peripheral surface of the insulating member. The surfaces of the two members form a predetermined angle, the insulating member is a thin wire member, and its axial direction is parallel to both surfaces of the two members. The third electrode terminal is in contact with both the first and second electrode terminals.

  According to the electrode terminal connection structure of the present invention, the first and second electrode terminals to be connected can be reliably electrically connected via the third electrode terminal. Note that the third electrode terminal can be easily formed on the outer peripheral surface of the insulating member, and the effect of the present invention becomes more remarkable when the first and second electrode terminals are miniaturized and difficult to connect.

  The predetermined angle is preferably an acute angle or 90 degrees. According to this, the third electrode terminal can be stably positioned by sandwiching the insulating member between the two members. Therefore, it is possible to provide an electrode terminal connection structure with high reliability and high yield.

  Further, the insulating member has two planes that form the same angle as the predetermined angle, and between the one surface of the two planes and one surface of the two members, The first electrode terminal and the third electrode terminal are sandwiched, and the second electrode terminal and the third electrode terminal are interposed between the other surface of the two planes and the other surface of the two members. Is preferably sandwiched. According to this, the contact area between the third electrode terminal and the first and second electrode terminals is increased, and current loss when current flows through these electrode terminals can be reduced.

  Moreover, the cross-sectional shape orthogonal to the axial direction of the insulating member may be circular. According to this, the third electrode terminal can be reliably brought into contact with the first and second electrode terminals without depending on the angle formed between the surfaces of the two members.

  The third electrode terminal is preferably made of the same conductive material as the first and second electrode terminals. According to this, since the same conductive material as the first and second electrode terminals is used for the third electrode terminal, the contact resistance between the third electrode terminal and the first and second electrode terminals can be reduced.

  Furthermore, the conductive material is preferably formed from a material mainly composed of gold. According to this, since gold has low contact resistance and excellent conductivity and corrosion resistance, the reliability of electrical connection of electrode terminals can be improved. Further, since gold has good high frequency characteristics, even when the present invention is used for an electronic device to which a high frequency voltage is applied, the electronic device can obtain good electrical characteristics.

  In addition, when viewed from the axial direction, the third electrode terminal is preferably formed in an annular shape on the outer peripheral surface of the insulating member. According to this, when a voltage is applied between the first and second electrode terminals, the current path flowing through the third electrode terminal becomes two, so that the internal resistance of the third electrode terminal is equivalently arranged in parallel. As a result, the internal resistance of the third electrode terminal is reduced, and the power consumption can be reduced.

  Further, it is preferable that a conductive member is provided on a core of the insulating member, and the conductive member is grounded. According to this, when a high frequency voltage of GHz band is applied between the first and second electrode terminals, the conductive member absorbs the high frequency noise generated from the third electrode terminal, and the high frequency noise can be reduced. .

Furthermore, it is preferable that the first and second electrode terminals are an electrode terminal on a recording / reproducing head and an electrode terminal on a suspension in a hard disk device. According to this, the electrode terminal on the recording / reproducing head and the electrode terminal on the suspension can be electrically connected. The third electrode terminal can be easily formed on the outer peripheral surface of the insulating member. When the first and second electrode terminals are miniaturized, the effect of the present invention becomes more remarkable, and the recording / reproducing head is miniaturized. Is possible. Therefore, by flying the recording / reproducing head on the magnetic recording medium with a low flying height, it is possible to record minute recording bits on the magnetic recording medium, and high-density recording can be performed. In addition, when a conductive member is inserted in the insulating member, high-frequency noise generated when a high-frequency voltage in the GHz band is applied can be reduced, and a magnetic field used during recording and reproduction of information. The information can be recorded and reproduced reliably without being disturbed by high frequency noise. Therefore, high-density recording exceeding 1 Tbit / inch ² is possible.

<First Embodiment>
A first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a schematic perspective view illustrating the electrode terminal connection structure according to the first embodiment. FIG. 2 is a schematic plan view when FIG. 1 is viewed from the A direction.

  In the present embodiment, an electrical connection structure of two electrode terminals formed on two substrates will be described. As shown in FIGS. 1 and 2, the substrate 1 is made of glass, plastic, or the like, and has a surface 1a parallel to the XZ plane on which silicon nitride (SiN) is formed. On the surface 1a, three electrode terminals 3 (first electrode terminals) extending along the Z direction are formed at equal intervals in the X direction.

  The substrate 2 is made of glass or plastic and has a surface 2a parallel to the XY plane on which SiN is formed. On the surface 2a, three electrode terminals 4 (second electrode terminals) extending along the Y direction are formed at equal intervals in the X direction.

  The substrate 1 is vertically arranged on the surface 2a at one end of the substrate 2, and the angle α formed by the surface 1a of the substrate 1 and the surface 2a of the substrate 2 is 90 degrees.

Near the L-shaped portion formed by the surface 1a of the substrate 1 and the surface 2a of the substrate 2, a thin wire 5 extending in the X direction parallel to both the surfaces 1a and 2a is disposed. The thin wire 5 has a cylindrical shape (for example, a diameter of 0.1 mm), and is formed of an insulating material made of an inorganic compound such as silicon dioxide (SiO ₂ ). Three annular electrode terminals 6 (third electrode terminals) are formed at equal intervals in the X direction when viewed from the axial direction (A direction) on the outer peripheral surface of the thin wire 5. The three electrode terminals 3, 4, and 6 are respectively formed at overlapping positions in the X direction. The thin wire 5 is not limited to SiO ₂ and may be formed of any material as long as it is heat-resistant and is an insulating material that does not easily dissolve in organic solvents, acids, and alkalis.

  The electrode terminal 3 and the electrode terminal 6 are in contact with each other at the contact point Q and are electrically connected. Further, the electrode terminal 4 and the electrode terminal 6 are in contact with each other at the contact point R, and are electrically connected. That is, the electrode terminal 3 and the electrode terminal 4 are not in direct contact with each other, but are electrically connected by contacting the electrode terminal 6 at the contacts Q and R, respectively. The term “electrically connected” means that when a voltage is applied between the electrode terminals 3 and 4, a current flows through the electrode terminals 3 and 4.

  Thereby, the electrode terminals 3 and 4 to be connected can be reliably electrically connected via the electrode terminal 6. Further, since the cross-sectional shape orthogonal to the axial direction of the thin wire 5 is circular, the electrode terminal 6 is connected to the electrode terminal 3 without depending on the angle α formed between the surfaces 1a and 2a of the substrates 1 and 2. 4 can be reliably brought into contact with. Furthermore, since the electrode terminal 6 is formed in an annular shape on the outer peripheral surface of the thin wire 5, when a voltage is applied between the electrode terminals 3 and 4, the path of the current flowing through the electrode terminal 6 is indicated by arrows S and T By providing two paths, the internal resistance of the electrode terminal 6 is equivalently arranged in parallel, the internal resistance of the electrode terminal 6 is reduced, and the number of consumed electrodes can be reduced.

  The electrode terminals 3, 4, and 6 are made of a material in which gold (Au) as a main component is laminated on titanium (Ti). Since these electrode terminals 3, 4, and 6 are formed of the same material, the contact resistance between the electrode terminals can be reduced. Moreover, since Au has low contact resistance and excellent conductivity and corrosion resistance, the reliability of electrical connection between two electrode terminals can be improved. Furthermore, since gold has good high frequency characteristics, even when the present invention is used for an electronic device to which a high frequency voltage is applied, the electronic device can obtain good electrical characteristics.

  The thin wire 5 is fixed to the substrates 1 and 2 with a resin 7. The resin 7 is an ultraviolet curable resin having insulating properties, and is cured by being irradiated with ultraviolet rays. The resin 7 is not limited to the ultraviolet curable resin, but may be any resin that can fix the thin wire 5 to the substrates 1 and 2 such as a thermosetting resin and an adhesive. Thereby, the electrode terminal 6 is firmly in contact with the electrode terminals 3 and 4, and the electrode terminal 6 can be reliably electrically connected to the electrode terminals 3 and 4.

  Here, the width in the X direction of the electrode terminals 3 and 4 is j, the formation interval in the X direction of the electrode terminal 3 or the electrode terminal 4 (the width between electrode terminals adjacent to each other in the X direction) is k, Is the width of the electrode terminal 6 and the formation interval of the electrode terminals 6 in the X direction is n. At this time, by setting j + k = m + n, the electrode terminals 3 and 4 can be brought into contact with only the desired electrode terminal 6 without being brought into contact with any electrode terminal 6 other than the desired electrode terminal 6 to be brought into contact with. In the present embodiment, j = k = m = n = 20 μm. J, k, m, and n may be any values as long as the electrode terminal 6 can be brought into contact with the electrode terminals 3 and 4. For example, m may be j <m <j + k. Thus, by making the width of the electrode terminal 6 larger than the width of the electrode terminals 3 and 4, the electrode terminal 6 is brought into contact with the electrode terminals 3 and 4 even if the electrode terminal 6 is slightly shifted in the X direction. Can do.

  Next, the electrical connection process of the electrode terminals 3 and 4 is demonstrated. FIG. 3 is a diagram illustrating a process of forming electrode terminals on the outer peripheral surface of the thin wire. FIG. 4 is a diagram for explaining the positioning of the thin line. FIG. 5 is a diagram for explaining a process of fixing the fine wire to the substrate.

  First, the electrode terminal 6 is formed on the outer peripheral surface of the thin wire 5 using a fine processing technique such as photolithography. As an initial step, as shown in FIG. 3A, a resist 8 is applied to the entire outer peripheral surface of the thin wire 5. Then, as shown in FIG. 3B, the resist 8 is exposed along a mask pattern arranged between the light source and the fine wire 5 using an exposure apparatus. Specifically, the resist 8 is exposed by shielding the light applied to the region excluding the region 9 where the electrode terminal 6 of the thin wire 5 is to be formed with a mask. Next, as shown in FIG. 3C, development processing is performed to remove unnecessary resist (photosensitive portion) in the region 9 where the electrode terminal 6 of the thin wire 5 is to be formed, and a desired outer peripheral surface of the thin wire 5 is formed. The resist pattern is formed.

  Thereafter, as shown in FIG. 3D, a conductive material 10 mainly composed of Au is formed on the outer peripheral surface of the thin wire 5 and the resist 8 by using an EB (electron beam) vapor deposition method or the like. Subsequently, by removing the resist 8 and the conductive material 10 formed on the resist 8 by a list-off method, the electrode terminal 6 is formed on the outer peripheral surface of the thin wire 5 as shown in FIG. Form part. By repeating these steps while appropriately rotating the thin wire 5, the annular electrode terminal 6 is formed on the outer peripheral surface of the thin wire 5. Note that the resist 8 may be a negative resist from which the unexposed portions are removed, instead of the positive resist from which the exposed portions are removed as in the present embodiment.

  By using such a fine processing technique such as photolithography, the width of the electrode terminals and the interval between the terminals can be set to several tens of nm. That is, even if the width and the terminal interval of the electrode terminals 3 and 4 of the substrates 1 and 2 are miniaturized, the electrode terminal 6 having a minute width and terminal interval corresponding to them can be easily formed. In addition, it is preferable that the width | variety and the terminal space | interval of the electrode terminal 6 shall be 0.5-100 micrometers from a viewpoint of the reliability improvement of electrical connection.

  Next, the positioning process of the thin wire 5 will be described. As shown in FIG. 4, resists 11 that protrude in the extending direction of the substrate 1 are formed on both sides of the electrode 4 on the substrate 2 in the X direction (left and right direction in FIG. 4) by a fine processing technique such as lithography. Then, when the thin wire 5 on which the electrode terminal 6 is formed is disposed between the resists 11, the width of the thin wire 5 is adjusted so that the electrode terminal 6 overlaps the electrode terminals 3 and 4 in the X direction. Thereby, when the thin wire 5 is disposed between the resists 11, the electrode terminals 3 and 4 and the electrode terminal 6 are in contact with each other.

  Next, the process of fixing the positioned thin wire 5 to the substrates 1 and 2 will be described. First, as shown in FIG. 5 (a), the fine wire 5 is pressed toward the L-shaped corner formed by the surfaces 1a and 2a of the substrates 1 and 2 by the pressing plate 12 for fixing the position. The pressing plate 12 is a thin plate formed of a metal such as iron (Fe), copper (Cu), or aluminum (Al), or a resin such as acrylic or polypropylene. In the present embodiment, the pressing plate 12 is formed of Fe (for example, thickness 0.1 m) having the same length as that of the thin wire 5 in the axial direction, and the surface in contact with the thin wire 5 is covered with an insulating tape. is doing. At this time, the angle β to be pressed is an angle half of the angle α (in this embodiment, the angle α = 90 degrees, so the angle β = 45 degrees), and the angle β is inclined 45 degrees from the direction orthogonal to the substrate 2. Press in the direction of arrow P. Thereby, the thin wire | line 5 can be pressed uniformly with respect to the board | substrates 1 and 2. FIG.

  Thereafter, the resistance value between the electrode terminals 3 and 4 is measured while the fine wire 5 is pressed by the pressing plate 12. When this measured value is 5Ω or less, it is determined that the electrode terminals 3 and 4 are electrically connected, and the resin 7 is placed between the thin wire 5 and the substrate 1 as shown in FIG. The resin 7 is cured by pouring between the fine wire 5 and the substrate 2 and irradiating with ultraviolet rays. As described above, when the thin wire 5 is fixed to the substrates 1 and 2, no displacement or vibration occurs. Therefore, even when the electrode terminals 3 and 4 are miniaturized, the electrode terminals 3 and 4 and the electrode terminal 6 can be accurately connected. Can be contacted. In addition, if the resistance value measurement between the electrodes 3 and 4 is performed after the end of pressing (after the step of FIG. 5C), the surface in contact with the thin wire 5 may not be covered with the insulating tape. The length of the pressing plate 12 in the axial direction may be any length as long as the fine wire 5 can be pressed evenly against the substrates 1 and 2.

  And as shown in FIG.5 (c), by separating the press board 12 from the thin wire 5, the thin wire 5 is fixed to the board | substrates 1 and 2, and the connection structure of an electrode terminal as shown in FIG. 1 can be obtained. . At this time, since the angle α is 90 degrees, the direction of the force that the thin wire 5 receives from the substrates 1 and 2 and the direction of the force that is received from the pressing plate 12 are 90 degrees or more regardless of the direction of any two forces. The thin wire 5 is in a stable position. Therefore, even if vibrations or impacts are applied to the substrates 1 and 2 and the thin wires 5 from the outside, the electrode terminals 6 are surely in contact with the electrode terminals 3 and 4, and the reliability is high and the yield is high. An electrode terminal connection structure can be provided.

  Next, a hard disk device using the above-described electrode terminal connection structure will be described. FIG. 6 is a schematic perspective view of the hard disk device. FIG. 7 is an enlarged perspective view of the vicinity of the recording / reproducing head.

  As shown in FIG. 6, the hard disk device 30 includes a disk-shaped magnetic recording medium 31, a medium support 32, a spindle motor 33, a suspension 34, a recording / reproducing head 35, a bearing unit 36, and signal processing. Device 37.

  The magnetic recording medium 31 rotates in one direction around the medium support 32 at a constant speed with the spindle motor 33 as a drive source. In addition, a recording layer made of a magnetic material is formed on the magnetic recording medium 31 to record information. A magnetic field generated from the recording / reproducing head 35 is applied to the recording layer, and the magnetization direction of the recording layer Information is recorded by changing. The information recorded as the magnetization direction on the recording layer is reproduced by detecting the leakage magnetic field from the recording layer with the recording / reproducing head 35.

  The suspension 34 extends in the horizontal direction, has one end supported by the bearing unit 36, and holds the recording / reproducing head 35 below the other end. The suspension 34 swings in a horizontal plane around the bearing unit 36 by the rotation of a motor (not shown). As a result, the recording / reproducing head 35 can be positioned on the magnetic recording medium 31 during recording or reproducing, and the recording / reproducing head 35 can be positioned on the magnetic recording medium 31 when not recording or reproducing.

  As shown in FIG. 7, the recording / reproducing head 35 records information on the magnetic recording medium 31 and a slider 41 that floats the recording / reproducing head 35 to a height of several tens of nanometers from the surface of the magnetic recording medium 31. The recording / reproducing element 42 reproduces information recorded on the recording medium 31. The slider 41 has, for example, 1 × 1.25 mm and a thickness of 0.3 mm, and is made of AlTiC. The surface of the slider 41 facing the magnetic recording medium 31 (the upper surface in FIG. 7) is an uneven ABS (Air Bearing Surface) surface, and the uneven shape causes the slider 41 to fly over the magnetic recording medium 31 with a certain amount of floating. And surface stably.

  The signal processing device 37 exchanges recorded information and reproduced information with the recording / reproducing element 42 by electric signals. As shown in FIG. 7, this electrical signal is transmitted from the signal processing device 37 to the wiring pattern 45 (first electrode terminal) formed on the upper surface of the suspension 34 in FIG. 7 and the wiring 46 formed on the side surface of the slider 41. It is transmitted to the recording / reproducing element 42 via the (second electrode terminal). Therefore, it is necessary to electrically connect the wiring pattern 45 on the suspension 34 and the wiring 46 on the slider 41.

  However, the surface of the slider 41 on which the wiring 46 is formed is substantially perpendicular to the surface of the suspension 34 on which the wiring pattern 45 is formed, and the wiring 45 and 46 are electrically connected to each other. It has become difficult.

  Therefore, in the hard disk device 30 according to the present embodiment, the wiring 46 on the slider 41 and the wiring pattern 45 on the suspension 34 are brought into contact with the electrode terminals 6 (third electrode terminals) formed on the thin wires 5, thereby wiring. 45 and 46 are electrically connected to each other through the electrode terminal 6. In FIG. 7, the resin for fixing the thin wire 5 to the recording / reproducing head 35 and the suspension 34 is not shown.

  Thereby, even if the recording / reproducing head 35 is miniaturized by the miniaturization of the slider 41 and the wiring formed on the recording / reproducing head 35 and the suspension 34 is miniaturized, it is easy to form the electrode terminal 6 on the thin wire 5. Therefore, electrical connection between the wirings can be easily performed. Therefore, by causing the minute recording / reproducing head 35 to float on the magnetic recording medium 31 with a low flying height, minute recording bits can be recorded, and high-density recording can be performed.

Second Embodiment
Next, a second embodiment will be described. FIG. 8 is a schematic perspective view illustrating the electrode terminal connection structure according to the second embodiment. FIG. 9 is a schematic plan view when FIG. 8 is viewed from the A direction. In the second embodiment, the thin line 5 in the first embodiment is merely a thin line 205, and the other configuration is the same as that of the first embodiment. In addition, about the same thing as 1st Embodiment, the description shown with a same sign is abbreviate | omitted.

As shown in FIGS. 8 and 9, the thin wire 205 has a rectangular parallelepiped shape, and is formed of an insulating material made of an inorganic compound such as silicon dioxide (SiO ₂ ), like the thin wire 5 in the first embodiment. Three annular electrode terminals 206 (third electrode terminals) are formed at equal intervals in the X direction when viewed from the axial direction (A direction) on the outer peripheral surface of the thin wire 5. The electrode terminal 3 formed on the substrate 1, the electrode terminal 4 formed on the substrate 2, and the electrode terminal 206 formed on the thin wire 205 are formed at positions overlapping with each other in the X direction.

  The thin wire 205 has two flat surfaces 205 a and 205 b having the same angle as the angle α formed between the surface 1 a of the substrate 1 and the surface 2 a of the substrate 2. The electrode terminal 3 and the electrode terminal 206 are sandwiched between the surface of the flat surface 205a and the surface 1a of the substrate 1, and the electrode terminal 4 and the electrode are interposed between the surface of the flat surface 205b and the surface 2a of the substrate 2. The terminal 206 is sandwiched. That is, the electrode terminal 3 and the electrode terminal 206 and the electrode terminal 4 and the electrode terminal 206 are electrically connected by surface contact. Thereby, the contact area of the electrode terminals 3 and 4 and the electrode terminal 206 becomes large, and the current loss when a current flows into these electrode terminals can be reduced.

<Third Embodiment>
Next, a third embodiment will be described. FIG. 10 is a schematic perspective view illustrating the electrode terminal connection structure according to the third embodiment. FIG. 11 is a schematic plan view of FIG. 10 viewed from the A direction. In the third embodiment, only the thin line 5 in the first embodiment is a thin line 305, and the other configuration is the same as that of the first embodiment. In addition, about the same thing as 1st Embodiment, the description shown with a same sign is abbreviate | omitted.

  As shown in FIGS. 8 and 9, the thin wire 305 has a cylindrical shape (in this embodiment, a diameter of 0.1 mm), and is formed of an insulating material made of SiN or the like. Three annular electrode terminals 306 (third electrode terminals) are formed at equal intervals in the X direction when viewed from the axial direction (A direction) on the outer peripheral surface of the thin wire 5. The electrode terminal 306 is electrically connected to the electrode terminals 3 and 4 in the same manner as the electrode terminal 6 in the first embodiment.

  The thin wire 305 has a core 320 (in the present embodiment, a diameter of 0.08 mm) formed of copper (Cu), which is a conductive material, and extending in the axial direction at the axial center. The core 320 is grounded. The thin wire 305 having the core 320 is formed by forming a SiN film on a copper wire by a p-CVD (plasma chemical vapor deposition) method or the like.

As a result, when a high frequency voltage in the GHz band is applied between the electrode terminals 3 and 4, the core 320 absorbs the high frequency noise generated radially from the curved portion of the electrode terminal 306, thereby reducing the high frequency noise. it can. Further, as shown in FIG. 7, a core made of a conductive material is provided at the center of the axis of a thin wire used when the wiring pattern 45 on the suspension 34 of the hard disk device 30 and the wiring 46 on the slider 41 are electrically connected. In this case, the information can be recorded and reproduced reliably without being disturbed by the high frequency noise in the magnetic field used at the time of recording and reproducing the information. Therefore, high-density recording exceeding 1 Tbit / inch ² is possible. The material of the core 320 is not limited to Cu, and any material that can absorb high-frequency noise such as Al or Ni may be used.

  The preferred embodiments of the present invention have been described above. However, the present invention is not limited to the above-described embodiments, and various modifications can be made as long as they are described in the claims. For example, the angle formed by the surface 1a of the substrate 1 and the surface 2a of the substrate 2 is not limited to 90 degrees, and may be an acute angle as shown in FIG. At this time, the fine wire 5 is sandwiched between the two substrates 1 and 2, and the electrode terminal 6 can be positioned stably. Therefore, it is possible to provide an electrode terminal connection structure with high reliability and high yield.

  In addition, the cross-sectional shape from the axial direction of the thin wire is not limited to a circular shape or a rectangular shape, and any shape can be used as long as the electrode terminals formed on the thin wires can contact the electrode terminals formed on the two substrates, respectively. It may be.

  Further, the substrates 1 and 2 on which the two electrode terminals 3 and 4 to be electrically connected are respectively formed may be elements formed of a semiconductor or metal. For example, in an integrated circuit, the substrate 1 is an IC chip and the substrate 2 is a printed board. That is, any electronic component that can form electrode terminals on the surface may be used.

  In addition, the material of the electrode terminal is not limited to Au, but a metal having excellent corrosion resistance such as platinum (Pt) or silver (Ag), or a conductive material having a low resistance value such as aluminum (Al) or copper (Cu). May be included. Moreover, you may laminate | stack Au on the material containing not only Ti but chromium (Cr).

Further, as shown in FIG. 4, the positioning process of the thin wire 5 is protruded in the extending direction of the substrate 1 by a fine processing technique such as lithography on both sides of the electrode 4 on the substrate 2 in the X direction (left and right direction in FIG. 4). Without forming the resist 11, convex portions 2 c that are convex in the extending direction of the substrate 1 are formed on both sides of the substrate 2 in the X direction (left and right direction in FIG. 4). The thin wire 5 may be positioned. At this time, the shape of the substrate 2 in which the left and right sides in FIG. 4 are convex is formed by using a fine processing technique such as lithography and dry etching with SF ₆ gas. In addition, if positioning of the thin wire | line 5 is possible, it will not be restricted to the resist 11 and the convex part 2c. Further, the resist and the convex portion may be formed on the substrate 1 instead of the substrate 2.

  Furthermore, as long as the thin wire 5 is pressed evenly against the substrates 1 and 2, the pressing plate 12 may be plural instead of one.

  In addition, the thin wire 305 having the conductive core 320 is not formed by forming a SiN film on a copper wire by a p-CVD (plasma chemical vapor deposition) method or the like, but a thin wire formed by SiN. A cavity may be formed in the center of the shaft, and a copper wire may be inserted into the cavity.

  The present invention is not limited to a hard disk device, and can be applied to various structures that electrically connect electrode terminals formed on the surface of a member having a predetermined angle.

It is a schematic perspective view explaining the connection structure of the electrode terminal which concerns on 1st Embodiment. It is a schematic plan view when FIG. 1 is seen from the A direction. It is a figure explaining the process of forming an electrode terminal in the outer peripheral surface of a thin wire | line. It is a figure explaining positioning of a thin line. It is a figure explaining the process of fixing a thin wire | line to a board | substrate. 1 is a schematic perspective view of a hard disk device. FIG. 3 is an enlarged perspective view in the vicinity of a recording / reproducing head. It is a schematic perspective view explaining the connection structure of the electrode terminal which concerns on 2nd Embodiment. It is a schematic plan view when FIG. 8 is seen from the A direction. It is a schematic perspective view explaining the connection structure of the electrode terminal which concerns on 3rd Embodiment. It is a schematic plan view when FIG. 10 is seen from the A direction. It is a schematic plan view explaining the connection structure of the electrode terminal in a modification.

Explanation of symbols

1, 2 Substrate (first and second electrode terminals)
1a, 2a Surface 3, 4, 6 Electrode terminal (third electrode terminal)
5 Fine wire 7 Resin

Claims (9)

The first and second electrode terminals respectively formed on the surfaces of the two members are electrically connected via a third electrode terminal formed on the outer peripheral surface of the insulating member,
The surfaces of the two members form a predetermined angle,
The insulating member is a thin wire member, and its axial direction is parallel to both surfaces of the two members;
The electrode terminal connection structure, wherein the third electrode terminal is in contact with both the first and second electrode terminals.   The electrode terminal connection structure according to claim 1, wherein the predetermined angle is an acute angle or 90 degrees. The insulating member has two planes that form the same angle as the predetermined angle;
The first electrode terminal and the third electrode terminal are sandwiched between one surface of the two planes and one surface of the two members,
3. The second electrode terminal and the third electrode terminal are sandwiched between the other surface of the two planes and the other surface of the two members. The electrode terminal connection structure described.   3. The electrode terminal connection structure according to claim 1, wherein a cross-sectional shape of the insulating member perpendicular to the axial direction is circular.   5. The electrode terminal connection structure according to claim 1, wherein the third electrode terminal is formed of the same conductive material as the first and second electrode terminals. 6.   6. The electrode terminal connection structure according to claim 5, wherein the conductive material is made of a material mainly composed of gold.   The electrode terminal according to any one of claims 1 to 6, wherein when viewed from the axial direction, the third electrode terminal is formed in an annular shape on the outer peripheral surface of the insulating member. Connection structure. It has a conductive member at the core of the insulating member,
The electrode terminal connection structure according to claim 1, wherein the conductive member is grounded.   The electrode according to claim 1, wherein the first and second electrode terminals are an electrode terminal on a recording / reproducing head and an electrode terminal on a suspension in a hard disk device. Terminal connection structure.

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