JP2895568B2 - Electric circuit members - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to an electric circuit member, and more particularly to an electric circuit member in which electric circuit components are connected to a base via an electric connection member.

[Background Art] Conventionally, connection between a base such as a frame body and a circuit board and an electric circuit component is performed by a connector method, a crimp terminal method, a soldering method,
Wire bonding method, TAB (Tape Automated Bonding) method, C
CB (Controlled collapsed bonding: Con
Methods such as a controlled collapsed bonding method and a method using an anisotropic conductive film are known. However, these methods have a problem that the minimum pitch for preventing adjacent connecting portions from contacting each other is relatively large, so that it is impossible to cope with a case where a small pitch between connecting portions is required. Was. Further, such a method has a problem in terms of electrical characteristics because the length of the wiring is increased and the resistance value is increased, and the stray capacitance is increased. This was particularly noticeable in high-frequency electric circuits.

In order to solve such a problem, an electric connection member having a configuration in which a plurality of conductive members are mutually insulated and held in an insulating holder, or wiring is provided inside the insulating holder and / or on the surface of the holder. A method of electrically connecting electric circuit components to each other using an electric connection member having a configuration in which both ends of a connecting conductive member are exposed on both surfaces of the holding member so as to be the same as or protrude from the surface of the holding member. (Japanese Patent Laid-Open No. 63-63)
222437, JP-A-63-224235, etc.).

FIGS. 3 (a) and 3 (b) are schematic diagrams showing electrical connections between electrical circuit components using such one electrical connection member, where 1 is an electrical connection member, Reference numeral 3 denotes an electric circuit component to be connected. The electrical connection member 1 holds a plurality of rod-shaped conductive members 4 made of a metal or an alloy in a holding body 5 on a thin plate made of an electrically insulating material by electrically insulating the conductive members 4 from each other. The electrical circuit components 2 and 3 are formed by setting both ends of the conductive member 4 as bumps 8 and 9, respectively.
Side (see FIG. 3 (a)).

Then, the connection portion 6 of the one electric circuit component 2 and the bump 8 of the conductive member 4 and the connection portion 7 of the other electric circuit component 3 and the bump 9 of the conductive member 4 are each bonded by, for example, thermocompression bonding or ultrasonic wave. The electrical circuit components 2 and 3 are electrically connected to each other by metallization and / or alloying by a heating method or the like (see FIG. 3B).

By the way, as a method of manufacturing the electrical connection member 1, a method shown in FIGS. 4 (a) to 4 (e) has been proposed. In this method, first, a photosensitive resin 11 serving as the holder 5 is applied on a copper foil 10 made of a conductive material (see FIG. 4A). Next, by exposing and developing a predetermined position where the conductive member 4 is embedded in a later step, a hole 12 is formed in the photosensitive resin 11 to expose the copper foil 10. Next, the temperature is increased to cure the photosensitive resin 11 (see FIG. 4 (b)). Then, etching of the copper foil 10 in the vicinity of the hole 12 is performed, and a concave portion is formed below the hole 12.
13 are formed (see FIG. 4 (c)).

Thereafter, the conductive member 4 is filled in the recesses 13 and the holes 12 by plating the copper foil 10 with gold or the like, and the bumps 9 are formed in the recesses 13.
A bump 8 is formed on the upper surface of 11 (see FIG. 4D).

Thereafter, the electrical connection member 1 is completed by removing the copper foil 10 by metal etching (see FIG. 4 (e)).

[Problems to be Solved by the Invention] However, metallization and / or alloying by thermocompression bonding, ultrasonic heating, or the like as shown in FIG. The method of connecting the bumps has a problem that the electric circuit components are exposed to heat during the connection, so that connection cannot be made with a material having low heat resistance.

By the way, a method of making electrical connection by bonding at a relatively low temperature without heating at a high temperature has already been known (Japanese Patent Application Laid-Open No.
No. 63-151031). In this method, the electrodes of the circuit board coated with the ultraviolet curable resin and the electrodes of the semiconductor element with bumps are positioned and pressed, and the electrical connection is made by irradiating ultraviolet rays and utilizing the curing shrinkage of the resin. In the method, it is difficult to mix the resin, and there are many technical problems to obtain a desired resin.

In addition, the connection portion is likely to contain the resin, so that the connection resistance value is increased, and the difference in thermal expansion coefficient is increased, thereby causing a quality problem.

Further, since there is a resin between adjacent connection portions, a difference in thermal expansion coefficient is large, so that quality problems such as peeling and cracks are likely to occur.

The present invention has been made in view of such circumstances,
By using a base having a conductive adhesive layer formed by a relatively easy method at the connection part, the electric circuit component and the base can be easily connected at a low temperature, and the electric circuit has a good electrostatic shielding property. An object is to provide a member.

[Means for Solving the Problems] That is, the present invention includes a holder made of an electrically insulating material, and a plurality of conductive members mounted on the holder in a mutually insulated state. An electrical connection member in which both ends of the member are the same as or protrude from the surface of the holding body on both sides of the holding body, and on a metal electrode of a base material on which a pattern is drawn on an electrical insulating material, At least one or more connection portions having a conductive adhesive layer formed by electrophoresis from an adhesive resin solution containing one or both of ultrafine metal powder or metallized ceramic powder, At least one or more bases having at least one end of at least one of the conductive members exposed on one surface of the holding body of the electrical connection member at the connection portion, the at least one end being electrically connected by adhesion; Connection And at least one electric circuit component to which one end of at least one of the conductive members exposed on the other surface of the holder of the electrical connection member is electrically connected at the connection portion. And an adhesive containing one or both of an ultrafine metal powder or a metallized ceramic powder on at least a part of the metal surface of the substrate opposite to the surface having the conductive adhesive layer. An electric circuit member having a conductive adhesive layer formed by codeposition of a resin solution by electrophoresis.

 Hereinafter, the present invention will be described in detail.

The electric circuit member of the present invention is exposed on one surface of an electrical connection member having a holder made of an electrically insulating material and a plurality of conductive members mounted on the holder in a mutually insulated state. Of a substrate having a conductive adhesive layer formed on the electrode portion by an electrophoretic method from an adhesive resin solution containing one or both of an ultrafine metal powder or a metallized ceramic powder in an electrode portion. The connection portion is electrically connected by bonding, and the conductive member exposed on the other surface of the electrical connection member and the connection portion of the electric circuit component are electrically connected. is there.

This conductive adhesive layer is usually in a solid state, but the present invention is not limited to this. For example, a case in which a layer which is heated to a gel state or a sol state is used.

Since the electric circuit member of the present invention can be connected by bonding at a relatively low temperature even in the case of a substrate having low heat resistance, the connection is easy, and the range of choice of the substrate is widened and the application range is widened.

In addition, since only the connection portion is connected, a quality problem due to a difference in thermal expansion coefficient can be avoided, and an electric circuit member having good quality characteristics can be obtained.

Further, the electric circuit member of the present invention may be provided on one or both of ultrafine metal powder or metalized ceramic powder on a metal surface of at least a part of a surface of the substrate opposite to the surface having the conductive adhesive layer. By providing a conductive adhesive layer formed by codeposition from an adhesive resin solution containing both of them, it becomes possible to obtain an electric circuit member having excellent electrostatic shielding properties.

The average particle size of the ultrafine metal powder contained in the conductive adhesive layer formed on the electrode of the base of the electric circuit member is 0.01
The average particle size of the metalized ceramic powder is preferably in the range of 0.1 to 5 μm. The content of one or both of the ultrafine metal powder and the metalized ceramic powder contained in the conductive adhesive layer is preferably in the range of 30 to 80 wt%.

The electric circuit component used in the electric circuit member of the present invention is preferably, for example, an electric circuit component such as a resin circuit board, a metal circuit board, a ceramic circuit board, a lead frame, and a semiconductor element. The base is preferably a frame, a circuit board, or a lead frame.

[Examples] Hereinafter, the present invention will be described more specifically with reference to Examples and Reference Examples.

Reference Example 1 FIGS. 1A and 1B are schematic views showing one reference example of the electric circuit member of the present invention. FIG. 1A shows a state in which an electric connection is made between a circuit board having a conductive adhesive layer and an electric circuit component via an electric connection member. FIG. 1A shows a state before the connection. FIG. 1 (b) shows the state after connection. In the figure, 1 is an electrical connection member, 3a is a circuit board (base), 2 is an electric circuit component (semiconductor element).

The electrical connection member 1 can be manufactured by a known method.

In FIG. 1, an electrical connection member 1 is configured by mounting a plurality of conductive members 4 made of gold in a holding body 5 made of polyimide by electrically insulating the conductive members 4 from each other. The bump 8 at one end of the conductive member 4 is exposed to the electric circuit component 2 and the bump 9 at the other end of the conductive member 4 is exposed to the circuit board 3a (see FIG. 1A).

Then, the connection portion 15 of the electric circuit component 2 which is not covered with the passivation film 16 and the bump 8 of the conductive member 4 exposed on the electric circuit component 2 side are connected by metallization and / or alloying, and the circuit board 3a The connection portion 17 of the conductive adhesive layer 14 formed on the metal electrode 18 is connected to the bump 9 at the other end of the conductive member 4 exposed on the circuit board 3a side by bonding to achieve electrical connection (first). Fig. (B).

Al material of the connection part of the electric circuit component 2 and Au as the conductive member
The connection temperature with the material is desirably 200 to 400 ° C. Also, when the connection portion of the electric circuit component 2 was made of Au material, the connection could be performed at 200 to 400 ° C.

On the other hand, the connection between the connection portion 17 of the conductive adhesive layer 14 of the circuit board 3a and the bump 9 of the conductive member can be made at a low temperature of 180 ° C. or less, and good connection was obtained.

In the case of connection, the positioning of the electric circuit component 2 and the circuit board 3a is necessary, but the pitch of the conductive members 4 of the electric connection member 1 is different from the connection portion 15 of the electric circuit component 2 and the circuit board 3a.
Since the pitch of the connecting portion 17 of 3a is smaller than that of the connecting portion 17, the positioning of the electrical connecting member 1 may be rough.

Next, an example of a method for forming a conductive adhesive layer on a metal electrode of a base will be described below.

Alcohol cleaner (Pakna # 19 manufactured by Yuken Chemical Co., Ltd.) 30 g /
After degreasing for 1 minute at a bath temperature of 70 ° C., washing with water and acid pickling with a 10% sulfuric acid solution were performed for 30 seconds, followed by washing with water and washing with demineralized water to complete the surface activation treatment.

Next, polyester resin (FINETEX ES525, trade name)
60 parts by weight of Dainippon Ink and Chemicals, 40 parts by weight of polyester resin (FINETEX525, trade name of Dainippon Ink and Chemicals), and 5 parts by weight of a crosslinking agent (PERMASTAT R-5, trade name of Dainippon Ink and Chemicals) Parts, 2.5 parts by weight of a catalyst (trade name: Cat PA-20, manufactured by Dainippon Ink and Chemicals, Inc.), and further 30 parts by weight of copper powder having an average particle size of 0.02 μm and an average particle size of 1 μm
20 parts by weight of a powder obtained by applying a nickel plating to a thickness of 0.2 μm on the surface of the alumina was dispersed in a ball mill for 30 hours, then diluted with demineralized water to 15% by weight, and the temperature was adjusted to 25 ° C. and pH 8.5. Using the substrate as the anode under the conditions of above and using a stainless steel plate as the counter electrode,
Perform an electrodeposition treatment with an applied voltage of 100 V and a treatment time of 3 minutes, and
m was obtained. Then, it is bonded to the adherend metal, 50 ℃, 1
Heated for 0 minutes to complete.

The resin used for the conductive adhesive layer may be based on a resin such as an acrylic resin, an epoxy resin, a polyamide resin, an acrylic melamine resin, a polyacrylic acid resin, or the like, in addition to the polyester resin.

Ultrafine metal powders are not limited to copper, but include Au, Ag, Al, Be, Ca, Mg,
Mo, Fe, Ni, Co, Mn, W, Cr, Nb, Zr, Ti, Ta, Zn, Sn, Pb-Sn and the like.

In addition, the ceramic powder is SiO ₂ , B ₂ O ₃ , Al ₂ O ₃ , Na ₂ O, K
₂ O, CaO, ZnO, BaO, PbO, Sb ₂ O ₃ , As ₂ O ₃ , La ₂ O ₃ , ZrO ₂ , P ₂ O ₅ , TiO
_{2, MgO, SiC, BeO,} BP, BN, AlN, B 4 C, TaC, TiB 2, CrB 2, TiN, Si 3 N
₄ , ceramics such as Ta ₂ O ₅ , diamond, glass, carbon, boron and the like.

As the metalized ceramic powder, a ceramic powder obtained by attaching a metal material to the above ceramic powder is used. The method for attaching the metal material may be a wet method such as plating or a dry method such as vapor deposition or sputtering.

The average particle size of the ultrafine metal powder contained in the conductive adhesive layer formed on the conductive member of the electrical connection member is 0.01 to
2 μm, preferably 0.05 to 1.5 μm, and the average particle size of the metallized ceramic powder is in the range of 0.1 to 5 μm, preferably 1.5 to 4 μm. In the conductive adhesive layer,
One or both of ultra-fine metal powder or metallized ceramic powder is contained, but the content is usually 30 to 80 wt.
%, Preferably in the range of 35 to 45% by weight.

When both the ultrafine metal powder and the metallized ceramic powder are contained, the metallized ceramic powder is blended in a ratio of 20 to 80 parts by weight with respect to 100 parts by weight of the ultrafine metal powder. Mixed powders are preferred.

Example 1 FIGS. 2A and 2B are schematic views showing an example of an electric circuit member of the present invention. The figure shows the circuit board 3a of Reference Example 1.
A copper foil is provided on the surface opposite to the surface on which the connecting portion 17 on which the conductive adhesive layer 14 is formed is provided, and the conductive adhesive layer 14b is placed on the copper foil on the conductive adhesive layer of Reference Example 1. Are provided by the same method as the method provided with, and the other configuration is the same as that of the first embodiment. In this electric circuit member,
As in Reference Example 1, good connection was possible, and an electric circuit member having a good electrostatic shielding effect was obtained by providing a conductive adhesive layer on the opposite surface.

[Effects of the Invention] As described above, the electric circuit member of the present invention can provide a high-density electric circuit member because it can perform a narrower pitch and more pins than conventional ones. Also, since the wiring length of the conductive member can be shortened, the wiring becomes low-resistance wiring, heat generation is reduced, and stray capacitance is reduced. Therefore, electric characteristics such as signal delay are improved, and electric characteristics are good. Is obtained. This effect is particularly great for high-frequency electric circuits.

Further, the present invention provides a method for forming a conductive adhesive formed on a metal electrode of a base by an electrophoretic method from an adhesive resin solution containing one or both of an ultrafine metal powder and a metalized ceramic powder. Since the layer is provided, electrical connection by adhesion is performed in connection, so it is possible to use even a base material with relatively low heat resistance, and it can be easily connected, so parts with a wide application range And a device.

Further, in the present invention, since the conductive adhesive layer is provided on the metal surface opposite to the surface having the connection portion of the base, an electric circuit member having a good electrostatic shielding effect can be obtained, A very good electric circuit member can be obtained because it is relatively easy to block electromagnetic noise from the circuit member to the outside or from the outside to the electric circuit member.

[Brief description of the drawings]

FIGS. 1 (a) and 1 (b) and FIGS. 2 (a) and 2 (b) are schematic views showing a reference example and an example of an electric circuit member according to the present invention, respectively. (B) shows a state before the connection, and (b) shows a state after the connection. 3 (a) and 3 (b) are schematic views showing a conventional electric circuit member, where (a) shows a state before connection and (b) shows a state after connection. Fig. 4 (a)-
(E) is a process drawing showing an example of a conventional method for manufacturing an electrical connection member. DESCRIPTION OF SYMBOLS 1 ... Electrical connection member, 2,3 ... Electrical circuit component 3a ... Circuit board (base), 4 ... Conductive member 5 ... Holder 6,7,15,17 ... Connection part 8,9 ... ... Bump, 10 ... Copper foil 11 ... Photosensitive resin, 12 ... Hole 13 ... Recess 14,14a ... Conductive adhesive layer 16 ... Passivation film 18 ... Metal electrode

Continuation of the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H01R 11/01 H01R 4/04 H05K 3/36

Claims (4)

(57) [Claims] 1. A holding member comprising an electrically insulating material, and a plurality of conductive members mounted on the holding member in a mutually insulated state, and both ends of each of the conductive members are provided on both surfaces of the holding member. An electrical connection member that is the same as or protrudes from the surface of the holding body, and an ultrafine metal powder or metallized metal electrode on a base metal electrode on which a pattern is drawn on an electrical insulating material. At least one or more connection portions having a conductive adhesive layer formed by electrophoresis from an adhesive resin solution containing one or both of the ceramic powders, and the connection portion holds the electrical connection member. At least one end of at least one of the conductive members exposed on one surface of the body has at least one or more bases electrically connected by adhesion, and at least one or more connection parts, and The electrical connection At least one of the conductive members exposed at the other surface of the material holding member, at least one end of which is electrically connected to at least one of the electric circuit components; and the conductive bonding of the base body On a metal surface of at least a part of a surface opposite to a surface having a layer, eutectoid formation from an adhesive resin solution containing one or both of ultrafine metal powder and metalized ceramic powder by electrophoresis. An electric circuit member having a conductive adhesive layer formed thereon. 2. The method according to claim 1, wherein the average particle size of the ultrafine metal powder contained in the conductive adhesive layer is 0.01 to 2 μm and the average particle size of the metallized ceramic powder is 0.1 to 5 μm. The electric circuit member according to claim 1, wherein the content of one or both of the ultrafine metal powder and the metalized ceramic powder contained in the layer is 30 to 80 wt%. 3. The electric circuit member according to claim 1, wherein the electric circuit component is at least one selected from a resin circuit board, a metal circuit board, a ceramic circuit board, a lead frame, and a semiconductor element. 4. The electric circuit member according to claim 1, wherein the base is at least one selected from a frame, a circuit board, and a lead frame.