WO2016080053A1 - Electronic substrate and heat-dissipating structure - Google Patents
Electronic substrate and heat-dissipating structure Download PDFInfo
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- WO2016080053A1 WO2016080053A1 PCT/JP2015/075195 JP2015075195W WO2016080053A1 WO 2016080053 A1 WO2016080053 A1 WO 2016080053A1 JP 2015075195 W JP2015075195 W JP 2015075195W WO 2016080053 A1 WO2016080053 A1 WO 2016080053A1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Definitions
- This case concerns the electronic board and its heat dissipation structure.
- an electronic device In vehicles such as automobiles, a large number of electronic devices are used in various parts of the vehicle body.
- Such an electronic device includes an electronic board on which an electronic component is mounted accommodated in a casing.
- the electronic substrate described above includes a single-sided type in which a wiring pattern is formed on one side (front surface) of a substrate body (see, for example, Patent Document 1).
- a heat sink for heat dissipation is also attached to the surface (back surface) of the substrate body where the wiring pattern is not formed.
- Patent Document 1 has the following problems. In other words, electronic devices used in automobiles and the like are increasingly used to pass a large current, and thus it is necessary for the electronic substrate to have high heat dissipation so as to cope with heat generation.
- the electronic board of patent document 1 is made from a ceramic, the electronic board made from a ceramic is not sufficient in heat dissipation.
- the main purpose of this case is to solve the above-mentioned problems.
- the substrate body is made of a copper base material, and the wiring pattern is a copper pattern.
- a solder flux as a solder auxiliary agent is applied to the surface of the copper pattern, The solder flux is applied to the back surface of the copper base material as a base material protective agent.
- the above configuration can improve heat dissipation and suppress the generation of rust.
- FIG. 1 It is a top view of the electronic substrate concerning this Embodiment. It is a sectional side view of FIG. It is a disassembled perspective view of the electronic device provided with the electronic substrate of FIG.
- the electronic substrate 1 As shown in the plan view of FIG. 1 has the wiring pattern 3 formed on one side of the substrate body 2 as shown in the side view of FIG. That is, the electronic substrate 1 is a single-sided type.
- this embodiment has the following configuration.
- the substrate body 2 is composed of a copper base material 12.
- the wiring pattern 3 is a copper pattern 13.
- a solder flux 14 or preflux as a solder auxiliary agent is applied to the surface of the copper pattern 13.
- a solder flux 15 or a preflux is applied to the back surface or back side exposed surface of the copper base material 12 as a base material protecting agent.
- the copper base material 12 for example, a copper plate formed by rolling is used.
- An electrolytic copper foil is used for the copper pattern 13.
- An insulating layer 17 is interposed between the copper substrate 12 and the copper pattern 13.
- the insulating layer 17 is made of an epoxy resin type or the like.
- An insulating protective film 18 such as a resist is formed on the surface of the insulating layer 17 between the copper patterns 13.
- the solder flux 14 is applied to the upper portion of the copper pattern 13 where the insulating protective film 18 is not formed.
- the solder flux 15 applied as a base material protecting agent to the back surface or back side exposed surface of the copper base material 12 is heat-resistant having water-soluble imidazole as a main component.
- the electronic substrate 1 has the electronic component 19 (see FIG. 3) placed on the wiring pattern 3 via a solder paste, that is, a paste-like flux mixed with solder particles.
- soldering for example, reflow soldering is performed to mount the electronic component 19.
- the electronic board 1 on which the electronic component 19 is mounted is stored in a stock yard, taken out according to an order, and incorporated into the electronic device 20 as follows.
- a heat sink 22 is attached to the back surface of the copper substrate 12 coated with the solder flux 15 in the electronic substrate 1 via a heat conductive adhesive 21 or a heat transfer material as shown in FIG. It has been.
- a silicone rubber-based material is used for the heat conductive adhesive 21 and the heat transfer material.
- the heat transfer material is a sheet-like material.
- the heat sink 22 is made of aluminum. On the back surface side of the heat sink 22, heat radiating fins and the like are projected.
- the electronic board 1 to which the heat sink 22 is attached is attached to the bottom surface portion of the casing 25 of the electronic device 20 together with the heat sink 22 by bonding or screwing.
- the electronic device 20 is a PWM module for performing PWM control, such as a radiator fan controller, for example.
- the substrate body 2 was a copper base 12. Thereby, the rigidity of the electronic substrate 1 can be raised. Moreover, since copper has high thermal conductivity, the heat dissipation of the electronic substrate 1 can be improved. And since the board
- solder flux 15 was applied as a base material protecting agent to, for example, the entire back surface of the copper base material 12.
- This solder flux 15 has heat resistance, and reacts with the solder to evaporate, and has the property that it remains without being evaporated simply by heating in a reflow furnace or the like. Therefore, even after the electronic component 19 is mounted on the copper pattern 13 by reflow solder, the solder flux 15 remains as an antioxidant organic film on the back surface of the copper substrate 12. Thereby, the back surface of the copper base material 12 can be protected by the solder flux 15 without using a rust inhibitor or a rust preventive oil.
- the electronic substrate 1 is manufactured in advance, or the electronic component 19 is mounted on the electronic substrate 1 and stored in the stock yard, and the electronic substrate 1 stored according to the order is taken out and the electronic device 20 is removed. It is possible to adopt a manufacturing method incorporated in Even if it does in this way, the situation where rust will generate
- solder flux 15 can be formed in the same application process as the solder flux 14 applied to the surface of the copper pattern 13 as a solder auxiliary agent.
- the solder flux 15 applied to the back surface of the copper substrate 12 has adhesiveness to a heat-dissipating adhesive or the like.
- the solder flux 15 does not cause curing inhibition or adhesion failure such as a heat-dissipating adhesive such as a rust preventive or rust preventive oil applied for rust prevention. It is not necessary to perform a cleaning process similar to the cleaning process performed to remove the liquid. Therefore, the heat sink 22 can be directly bonded and fixed with a heat dissipating adhesive or the like while the solder flux 15 is applied. Even when the heat sink 22 is attached to the electronic substrate 1 via a heat transfer material, the solder flux 15 may be left applied. Therefore, the heat sink 22 can be attached satisfactorily.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
This invention allows for an increase in heat dissipation and a suppression of rust occurrence. The invention relates to the electronic substrate (1) having a wiring pattern (3) formed on one side of a substrate main body (2). The substrate main body (2) is configured from a copper base material (12), while the wiring pattern (3) is a copper pattern (13). The front surface of this copper pattern (13) is coated with a soldering flux (14) serving as a soldering helping agent. In addition, the back surface of the copper base material (12) is coated with a soldering flux (15) serving as a base material protecting agent.
Description
本件は、電子基板およびその放熱構造に関するものである。
This case concerns the electronic board and its heat dissipation structure.
自動車などの車両には、車体の各所に多数の電子装置が使用されている。このような電子装置は、電子部品を実装した電子基板をケーシング内に収容したものなどとされる。また、上記した電子基板には、基板本体の片面（表面）に配線パターンを形成した片面タイプのものが存在している（例えば、特許文献１参照）。そして、電子基板からの発熱が大きい場合には、基板本体の配線パターンが形成されていない面（裏面）に対して放熱用のヒートシンクを取付けることも行なわれている。
In vehicles such as automobiles, a large number of electronic devices are used in various parts of the vehicle body. Such an electronic device includes an electronic board on which an electronic component is mounted accommodated in a casing. Moreover, the electronic substrate described above includes a single-sided type in which a wiring pattern is formed on one side (front surface) of a substrate body (see, for example, Patent Document 1). When the heat generated from the electronic substrate is large, a heat sink for heat dissipation is also attached to the surface (back surface) of the substrate body where the wiring pattern is not formed.
しかしながら、上記特許文献１に記載された電子基板には、以下のような問題があった。
即ち、自動車などで用いられる電子装置は、大電流を流すものが多くなっているため、電子基板を、発熱に対応できるように高い放熱性を持たせる必要がある。 However, the electronic substrate described inPatent Document 1 has the following problems.
In other words, electronic devices used in automobiles and the like are increasingly used to pass a large current, and thus it is necessary for the electronic substrate to have high heat dissipation so as to cope with heat generation.
即ち、自動車などで用いられる電子装置は、大電流を流すものが多くなっているため、電子基板を、発熱に対応できるように高い放熱性を持たせる必要がある。 However, the electronic substrate described in
In other words, electronic devices used in automobiles and the like are increasingly used to pass a large current, and thus it is necessary for the electronic substrate to have high heat dissipation so as to cope with heat generation.
そして、特許文献１の電子基板はセラミック製のものとされているが、セラミック製の電子基板は、放熱性が十分ではない。
And although the electronic board of patent document 1 is made from a ceramic, the electronic board made from a ceramic is not sufficient in heat dissipation.
そこで、本件は、上記した問題点を解決することを、主な目的としている。
Therefore, the main purpose of this case is to solve the above-mentioned problems.
上記課題を解決するために、本件は、
基板本体の片面に、配線パターンが形成されている電子基板において、
前記基板本体が銅製基材で構成されていると共に、前記配線パターンが銅製パターンとされており、
該銅製パターンの表面にハンダ補助剤としてのハンダフラックスが塗布されていると共に、
前記銅製基材の裏面に基材保護剤として前記ハンダフラックスが塗布されていることを特徴とする。 In order to solve the above problem,
In an electronic board in which a wiring pattern is formed on one side of the board body,
The substrate body is made of a copper base material, and the wiring pattern is a copper pattern.
A solder flux as a solder auxiliary agent is applied to the surface of the copper pattern,
The solder flux is applied to the back surface of the copper base material as a base material protective agent.
基板本体の片面に、配線パターンが形成されている電子基板において、
前記基板本体が銅製基材で構成されていると共に、前記配線パターンが銅製パターンとされており、
該銅製パターンの表面にハンダ補助剤としてのハンダフラックスが塗布されていると共に、
前記銅製基材の裏面に基材保護剤として前記ハンダフラックスが塗布されていることを特徴とする。 In order to solve the above problem,
In an electronic board in which a wiring pattern is formed on one side of the board body,
The substrate body is made of a copper base material, and the wiring pattern is a copper pattern.
A solder flux as a solder auxiliary agent is applied to the surface of the copper pattern,
The solder flux is applied to the back surface of the copper base material as a base material protective agent.
本件によれば、上記構成によって、放熱性を向上すると共に、錆の発生を抑えることができる。
According to the present case, the above configuration can improve heat dissipation and suppress the generation of rust.
以下、本実施の形態を、図面を用いて詳細に説明する。
図１～図３は、この実施の形態を説明するためのものである。 Hereinafter, the present embodiment will be described in detail with reference to the drawings.
1 to 3 are for explaining this embodiment.
図１～図３は、この実施の形態を説明するためのものである。 Hereinafter, the present embodiment will be described in detail with reference to the drawings.
1 to 3 are for explaining this embodiment.
＜構成＞以下、この実施例の構成について説明する。
<Configuration> The configuration of this embodiment will be described below.
自動車などの車両には、車体の各所に多数の電子装置が使用されている。このような電子装置は、電子部品を実装した電子基板をケーシング内に収容したものである。
そして、図１の平面図に示すような電子基板１を、図２の側面図に示すように、基板本体２の片面に、配線パターン３を形成したものとする。即ち、電子基板１は、片面タイプのものとされる。 In vehicles such as automobiles, a large number of electronic devices are used in various parts of the vehicle body. In such an electronic device, an electronic board on which electronic components are mounted is accommodated in a casing.
Then, it is assumed that theelectronic substrate 1 as shown in the plan view of FIG. 1 has the wiring pattern 3 formed on one side of the substrate body 2 as shown in the side view of FIG. That is, the electronic substrate 1 is a single-sided type.
そして、図１の平面図に示すような電子基板１を、図２の側面図に示すように、基板本体２の片面に、配線パターン３を形成したものとする。即ち、電子基板１は、片面タイプのものとされる。 In vehicles such as automobiles, a large number of electronic devices are used in various parts of the vehicle body. In such an electronic device, an electronic board on which electronic components are mounted is accommodated in a casing.
Then, it is assumed that the
以上のような基本的な構成に対し、この実施例では、以下のような構成を備えるようにしている。
In contrast to the basic configuration as described above, this embodiment has the following configuration.
（１）上記基板本体２が銅製基材１２で構成されている。また、上記配線パターン３が銅製パターン１３とされている。
この銅製パターン１３の表面に、ハンダ補助剤としてのハンダフラックス１４またはプリフラックスが塗布されている。
また、上記銅製基材１２の裏面または裏側露出面に、基材保護剤としてハンダフラックス１５またはプリフラックスが塗布されている。 (1) Thesubstrate body 2 is composed of a copper base material 12. The wiring pattern 3 is a copper pattern 13.
Asolder flux 14 or preflux as a solder auxiliary agent is applied to the surface of the copper pattern 13.
Further, asolder flux 15 or a preflux is applied to the back surface or back side exposed surface of the copper base material 12 as a base material protecting agent.
この銅製パターン１３の表面に、ハンダ補助剤としてのハンダフラックス１４またはプリフラックスが塗布されている。
また、上記銅製基材１２の裏面または裏側露出面に、基材保護剤としてハンダフラックス１５またはプリフラックスが塗布されている。 (1) The
A
Further, a
ここで、銅製基材１２には、例えば、圧延によって形成された銅板を使用する。銅製パターン１３には、電解銅箔を使用する。銅製基材１２と銅製パターン１３との間には、絶縁層１７が介在される。この絶縁層１７は、エポキシ樹脂系のものなどとされる。絶縁層１７の表面における銅製パターン１３の間の部分などには、レジストなどの絶縁性保護皮膜１８が形成される。ハンダフラックス１４は、銅製パターン１３の上部で、絶縁性保護皮膜１８を形成していない部分に塗布される。
Here, for the copper base material 12, for example, a copper plate formed by rolling is used. An electrolytic copper foil is used for the copper pattern 13. An insulating layer 17 is interposed between the copper substrate 12 and the copper pattern 13. The insulating layer 17 is made of an epoxy resin type or the like. An insulating protective film 18 such as a resist is formed on the surface of the insulating layer 17 between the copper patterns 13. The solder flux 14 is applied to the upper portion of the copper pattern 13 where the insulating protective film 18 is not formed.
銅製基材１２の裏面または裏側露出面に基材保護剤として塗布されるハンダフラックス１５は、水溶性のイミダゾールを主成分とする耐熱性のものとされる。なお、銅製パターン１３の表面にハンダ補助剤として塗布されるハンダフラックス１４は、裏面のハンダフラックス１５と同じものを使用するのが好ましい。
The solder flux 15 applied as a base material protecting agent to the back surface or back side exposed surface of the copper base material 12 is heat-resistant having water-soluble imidazole as a main component. In addition, it is preferable to use the same solder flux 14 as the solder flux 15 on the back surface as the solder flux 14 applied as a solder auxiliary agent on the surface of the copper pattern 13.
そして、電子基板１は、配線パターン３の上に、ハンダペースト、即ち、ペースト状のフラックスにハンダの粒子を混ぜたものを介して電子部品１９（図３参照）を載置し、電子部品１９ごと電子基板１をリフロー炉へ通すことによって、ハンダ付け、例えば、リフローハンダを行い電子部品１９を実装する。そして、電子部品１９を実装された電子基板１は、ストックヤードに保管され、注文に応じて取り出されて、以下のようにして電子装置２０に組み込まれることになる。
Then, the electronic substrate 1 has the electronic component 19 (see FIG. 3) placed on the wiring pattern 3 via a solder paste, that is, a paste-like flux mixed with solder particles. By passing the electronic substrate 1 through a reflow furnace, soldering, for example, reflow soldering is performed to mount the electronic component 19. The electronic board 1 on which the electronic component 19 is mounted is stored in a stock yard, taken out according to an order, and incorporated into the electronic device 20 as follows.
（２）上記電子基板１における、ハンダフラックス１５が塗布された銅製基材１２の裏面には、図３に示すように、熱伝導性の接着剤２１または伝熱材を介してヒートシンク２２が取付けられている。
(2) A heat sink 22 is attached to the back surface of the copper substrate 12 coated with the solder flux 15 in the electronic substrate 1 via a heat conductive adhesive 21 or a heat transfer material as shown in FIG. It has been.
ここで、熱伝導性の接着剤２１や伝熱材には、シリコーンゴム系のものが使用される。伝熱材は、シート状のものなどとされる。
Here, a silicone rubber-based material is used for the heat conductive adhesive 21 and the heat transfer material. The heat transfer material is a sheet-like material.
ヒートシンク２２は、アルミ製のものなどとされる。ヒートシンク２２の裏面側には、放熱フィンなどが突設される。
The heat sink 22 is made of aluminum. On the back surface side of the heat sink 22, heat radiating fins and the like are projected.
そして、ヒートシンク２２を取付けられた電子基板１は、ヒートシンク２２ごと電子装置２０のケーシング２５の底面部分に対して、接着やネジ止めなどによって取付けられる。この場合、電子装置２０は、例えば、ラジエータファンのコントローラなどのようなＰＷＭ制御を行うためのＰＷＭモジュールとされる。
The electronic board 1 to which the heat sink 22 is attached is attached to the bottom surface portion of the casing 25 of the electronic device 20 together with the heat sink 22 by bonding or screwing. In this case, the electronic device 20 is a PWM module for performing PWM control, such as a radiator fan controller, for example.
＜作用効果＞この実施例によれば、以下のような作用効果を得ることができる。
<Action and effect> According to this embodiment, the following action and effect can be obtained.
（１）基板本体２を銅製基材１２とした。これにより、電子基板１の剛性を上げることができる。また、銅は熱伝導性が高いので、電子基板１の放熱性を向上することができる。そして、基板本体２と配線パターン３とが同じ銅製であるので、銅製パターン１３に電子部品１９を接合しているハンダと、銅製基材１２と間の線膨張係数の差の影響が、基板本体２を銅以外の材質とした場合と比べて小さくなる。よって、ハンダ付け部分の寿命低下を防止して、電子基板１の長寿命化を図ることができる。
(1) The substrate body 2 was a copper base 12. Thereby, the rigidity of the electronic substrate 1 can be raised. Moreover, since copper has high thermal conductivity, the heat dissipation of the electronic substrate 1 can be improved. And since the board | substrate body 2 and the wiring pattern 3 are the same copper, the influence of the difference of the linear expansion coefficient between the solder which joined the electronic component 19 to the copper pattern 13 and the copper base material 12 is a board | substrate body. It becomes smaller than the case where 2 is made of a material other than copper. Therefore, it is possible to prevent the life of the soldered portion from being reduced and to extend the life of the electronic substrate 1.
また、銅製基材１２の裏面の例えば全面に対し、基材保護剤としてハンダフラックス１５を塗布した。このハンダフラックス１５は、耐熱性を有しており、ハンダと反応して蒸発すると共に、単にリフロー炉などで加熱しただけでは蒸発しないで残るという性質を有している。よって、ハンダフラックス１５は、電子部品１９をリフローハンダによって銅製パターン１３に実装した後も、銅製基材１２の裏面にそのまま酸化防止用の有機皮膜として残ることになる。これにより、銅製基材１２の裏面を、防錆剤や防錆剤油などを用いずに、ハンダフラックス１５で保護することができる。また、銅製基材１２の裏面に対する錆の発生を抑えて、錆による電子基板１の放熱性の低下や商品性の低下を防止することができる。その結果、電子基板１を予め製造して、または、電子基板１に電子部品１９を実装してストックヤードに保管しておき、注文に応じて保管している電子基板１を取り出して電子装置２０に組み込むような製造方法を採用することができる。このようにしても、長期保存した銅製基材１２の裏面に錆が発生して電子基板１を廃棄せざるを得なくなるような事態が生じることがない。
Also, solder flux 15 was applied as a base material protecting agent to, for example, the entire back surface of the copper base material 12. This solder flux 15 has heat resistance, and reacts with the solder to evaporate, and has the property that it remains without being evaporated simply by heating in a reflow furnace or the like. Therefore, even after the electronic component 19 is mounted on the copper pattern 13 by reflow solder, the solder flux 15 remains as an antioxidant organic film on the back surface of the copper substrate 12. Thereby, the back surface of the copper base material 12 can be protected by the solder flux 15 without using a rust inhibitor or a rust preventive oil. Moreover, generation | occurrence | production of the rust with respect to the back surface of the copper base material 12 can be suppressed, and the fall of the heat dissipation of the electronic substrate 1 by a rust and the fall of commercial property can be prevented. As a result, the electronic substrate 1 is manufactured in advance, or the electronic component 19 is mounted on the electronic substrate 1 and stored in the stock yard, and the electronic substrate 1 stored according to the order is taken out and the electronic device 20 is removed. It is possible to adopt a manufacturing method incorporated in Even if it does in this way, the situation where rust will generate | occur | produce on the back surface of the copper base material 12 preserve | saved for a long time and the electronic substrate 1 must be discarded will not arise.
しかも、このハンダフラックス１５は、銅製パターン１３の表面にハンダ補助剤としてハンダフラックス１４を塗布するのと同じ塗布工程で形成することができるので、特別な工程を行う必要がなく便宜が良い。
In addition, the solder flux 15 can be formed in the same application process as the solder flux 14 applied to the surface of the copper pattern 13 as a solder auxiliary agent.
（２）銅製基材１２の裏面に塗布されたハンダフラックス１５は、放熱性接着剤などに対する接着性を有している。また、ハンダフラックス１５は、例えば、防錆のために塗布される防錆剤または防錆油などのように放熱性接着剤などの硬化阻害や接着不良を起こすことがないので、防錆剤を落とすために行なわれる洗浄工程と同様の洗浄工程を行なう必要がない。よって、ハンダフラックス１５が塗布された状態のまま、放熱性接着剤などで直接ヒートシンク２２を接着固定することができる。なお、電子基板１に伝熱材を介してヒートシンク２２を取付けるような場合についても、ハンダフラックス１５は、塗布したままにしておいても良い。よって、ヒートシンク２２の取付けを良好に行うことができる。
(2) The solder flux 15 applied to the back surface of the copper substrate 12 has adhesiveness to a heat-dissipating adhesive or the like. In addition, the solder flux 15 does not cause curing inhibition or adhesion failure such as a heat-dissipating adhesive such as a rust preventive or rust preventive oil applied for rust prevention. It is not necessary to perform a cleaning process similar to the cleaning process performed to remove the liquid. Therefore, the heat sink 22 can be directly bonded and fixed with a heat dissipating adhesive or the like while the solder flux 15 is applied. Even when the heat sink 22 is attached to the electronic substrate 1 via a heat transfer material, the solder flux 15 may be left applied. Therefore, the heat sink 22 can be attached satisfactorily.
以上、実施例を図面により詳述してきたが、実施例は例示にしか過ぎないものである。よって、実施例の構成にのみ限定されるものではなく、要旨を逸脱しない範囲の設計の変更等があっても本件に含まれることは勿論である。また、例えば、各実施例に複数の構成が含まれている場合には、特に記載がなくとも、これらの構成の可能な組合せが含まれることは勿論である。また、複数の実施例や変形例が本件のものとして開示されている場合には、特に記載がなくとも、これらに跨がった構成の組合せのうちの可能なものが含まれることは勿論である。また、図面に描かれている構成については、特に記載がなくとも、含まれることは勿論である。更に、「等」の用語がある場合には、同等のものを含むという意味で用いられている。また、「ほぼ」「約」「程度」などの用語がある場合には、常識的に認められる範囲や精度のものを含むという意味で用いられている。
Although the embodiments have been described in detail with reference to the drawings, the embodiments are only examples. Therefore, the present invention is not limited to the configuration of the embodiment, and it is a matter of course that changes in design and the like within a range not departing from the gist are included in the present case. Further, for example, when each embodiment includes a plurality of configurations, it is a matter of course that possible combinations of these configurations are included even if not specifically described. Further, in the case where a plurality of embodiments and modifications are disclosed as the present case, it is a matter of course that possible combinations of the configurations straddling these are included even if not specifically described. is there. Further, the configuration depicted in the drawings is of course included even if not particularly described. Further, when there is a term of “etc.”, it is used in the sense that the equivalent is included. In addition, when there are terms such as “almost”, “about”, “degree”, etc., they are used in the sense that they include those in the range and accuracy recognized by common sense.
１ 電子基板
２ 基板本体
３ 配線パターン
１２ 銅製基材
１３ 銅製パターン
１４ ハンダフラックス
１５ ハンダフラックス
２１ 熱伝導性の接着剤
２２ ヒートシンク DESCRIPTION OFSYMBOLS 1 Electronic substrate 2 Substrate body 3 Wiring pattern 12 Copper base material 13 Copper pattern 14 Solder flux 15 Solder flux 21 Thermal conductive adhesive 22 Heat sink
２ 基板本体
３ 配線パターン
１２ 銅製基材
１３ 銅製パターン
１４ ハンダフラックス
１５ ハンダフラックス
２１ 熱伝導性の接着剤
２２ ヒートシンク DESCRIPTION OF
本出願は、２０１４年１１月１７日に、日本国特許庁に出願された特願２０１４－２３２４５８に基づいて優先権を主張し、その全ての開示は、完全に本明細書で参照により組み込まれる。
This application claims priority based on Japanese Patent Application No. 2014-232458 filed with the Japan Patent Office on November 17, 2014, the entire disclosure of which is fully incorporated herein by reference. .
Claims (2)
- 基板本体の片面に、配線パターンが形成されている電子基板において、
前記基板本体が銅製基材で構成されていると共に、前記配線パターンが銅製パターンとされており、
該銅製パターンの表面にハンダ補助剤としてのハンダフラックスが塗布されていると共に、
前記銅製基材の裏面に基材保護剤として前記ハンダフラックスが塗布されていることを特徴とする電子基板。 In an electronic board in which a wiring pattern is formed on one side of the board body,
The substrate body is made of a copper base material, and the wiring pattern is a copper pattern.
A solder flux as a solder auxiliary agent is applied to the surface of the copper pattern,
An electronic board, wherein the solder flux is applied as a base material protecting agent to the back surface of the copper base material. - 請求項１に記載の電子基板における、ハンダフラックスが塗布された銅製基材の裏面に、熱伝導性の接着剤または伝熱材を介してヒートシンクが取付けられていることを特徴とする電子基板の放熱構造。 2. An electronic board according to claim 1, wherein a heat sink is attached to the back surface of the copper base material coated with solder flux via a heat conductive adhesive or a heat transfer material. Heat dissipation structure.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-232458 | 2014-11-17 | ||
| JP2014232458A JP2016096287A (en) | 2014-11-17 | 2014-11-17 | Electronic substrate and heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2016080053A1 true WO2016080053A1 (en) | 2016-05-26 |
Family
ID=56013614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2015/075195 WO2016080053A1 (en) | 2014-11-17 | 2015-09-04 | Electronic substrate and heat-dissipating structure |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2016096287A (en) |
| WO (1) | WO2016080053A1 (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5639073B2 (en) * | 1978-02-06 | 1981-09-10 | ||
| JPS57208002A (en) * | 1981-06-18 | 1982-12-21 | Shinetsu Polymer Co | Thermal pressure conductive composition |
| JPS59105398A (en) * | 1982-12-09 | 1984-06-18 | 株式会社東芝 | Method of producing metal core circuit board |
| JP2007110010A (en) * | 2005-10-17 | 2007-04-26 | Shindo Denshi Kogyo Kk | Flexible printed wiring board, flexible printed circuit board, and their manufacturing method |
| JP2012195568A (en) * | 2011-02-28 | 2012-10-11 | Koa Corp | Metal base circuit board |
-
2014
- 2014-11-17 JP JP2014232458A patent/JP2016096287A/en active Pending
-
2015
- 2015-09-04 WO PCT/JP2015/075195 patent/WO2016080053A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5639073B2 (en) * | 1978-02-06 | 1981-09-10 | ||
| JPS57208002A (en) * | 1981-06-18 | 1982-12-21 | Shinetsu Polymer Co | Thermal pressure conductive composition |
| JPS59105398A (en) * | 1982-12-09 | 1984-06-18 | 株式会社東芝 | Method of producing metal core circuit board |
| JP2007110010A (en) * | 2005-10-17 | 2007-04-26 | Shindo Denshi Kogyo Kk | Flexible printed wiring board, flexible printed circuit board, and their manufacturing method |
| JP2012195568A (en) * | 2011-02-28 | 2012-10-11 | Koa Corp | Metal base circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016096287A (en) | 2016-05-26 |
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