JPS5341174A - Electric plating method onto surface of semi-insulator semiconductor material - Google Patents

Electric plating method onto surface of semi-insulator semiconductor material

Info

Publication number
JPS5341174A
JPS5341174A JP11635176A JP11635176A JPS5341174A JP S5341174 A JPS5341174 A JP S5341174A JP 11635176 A JP11635176 A JP 11635176A JP 11635176 A JP11635176 A JP 11635176A JP S5341174 A JPS5341174 A JP S5341174A
Authority
JP
Japan
Prior art keywords
semiconductor material
semi
plating method
electric plating
insulator semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11635176A
Other languages
Japanese (ja)
Other versions
JPS5950092B2 (en
Inventor
Asamitsu Tosaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP11635176A priority Critical patent/JPS5950092B2/en
Publication of JPS5341174A publication Critical patent/JPS5341174A/en
Publication of JPS5950092B2 publication Critical patent/JPS5950092B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

PURPOSE: To apply an electric plating onto the surface of a semiinsulator semiconductor material by providing an electrode on part of the semiconductor material surface and conducting electricity to the electrode in the plating solution.
COPYRIGHT: (C)1978,JPO&Japio
JP11635176A 1976-09-28 1976-09-28 Method of electroplating semi-insulating semiconductor material surfaces Expired JPS5950092B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11635176A JPS5950092B2 (en) 1976-09-28 1976-09-28 Method of electroplating semi-insulating semiconductor material surfaces

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11635176A JPS5950092B2 (en) 1976-09-28 1976-09-28 Method of electroplating semi-insulating semiconductor material surfaces

Publications (2)

Publication Number Publication Date
JPS5341174A true JPS5341174A (en) 1978-04-14
JPS5950092B2 JPS5950092B2 (en) 1984-12-06

Family

ID=14684794

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11635176A Expired JPS5950092B2 (en) 1976-09-28 1976-09-28 Method of electroplating semi-insulating semiconductor material surfaces

Country Status (1)

Country Link
JP (1) JPS5950092B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5270229A (en) * 1989-03-07 1993-12-14 Matsushita Electric Industrial Co., Ltd. Thin film semiconductor device and process for producing thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5270229A (en) * 1989-03-07 1993-12-14 Matsushita Electric Industrial Co., Ltd. Thin film semiconductor device and process for producing thereof

Also Published As

Publication number Publication date
JPS5950092B2 (en) 1984-12-06

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