JPS5460563A - Lead frame for semiconductor device - Google Patents

Lead frame for semiconductor device

Info

Publication number
JPS5460563A
JPS5460563A JP12693577A JP12693577A JPS5460563A JP S5460563 A JPS5460563 A JP S5460563A JP 12693577 A JP12693577 A JP 12693577A JP 12693577 A JP12693577 A JP 12693577A JP S5460563 A JPS5460563 A JP S5460563A
Authority
JP
Japan
Prior art keywords
lead
lead frame
frame
dipad
notches
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12693577A
Other languages
Japanese (ja)
Inventor
Toru Tachikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP12693577A priority Critical patent/JPS5460563A/en
Publication of JPS5460563A publication Critical patent/JPS5460563A/en
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To aviod occurrence of the short circuit at the connection time by providing the notched or the small thickness part to the support lead of the lead frame to bend the frame at these parts and thus lowering the dipad surface more than the electode lead surface.
CONSTITUTION: Notches 1-6 are provided the middle part of 2 pieces of dipad support lead 1-4 of the lead frame. these notches are provided to both the upper and lower surfaces of lead 1-4. Otherwise, the middle part is made thin. In this way, the support lead can be bent and deformed easily, and thus the pad upper surface can be bent assuredly to be set lower than the electrode lead surface. As a result, the short circuit caused by the contact of the connection can be prevented
COPYRIGHT: (C)1979,JPO&Japio
JP12693577A 1977-10-21 1977-10-21 Lead frame for semiconductor device Pending JPS5460563A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12693577A JPS5460563A (en) 1977-10-21 1977-10-21 Lead frame for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12693577A JPS5460563A (en) 1977-10-21 1977-10-21 Lead frame for semiconductor device

Publications (1)

Publication Number Publication Date
JPS5460563A true JPS5460563A (en) 1979-05-16

Family

ID=14947535

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12693577A Pending JPS5460563A (en) 1977-10-21 1977-10-21 Lead frame for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5460563A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55113357A (en) * 1979-02-23 1980-09-01 Hitachi Ltd Lead frame
JPS57147260A (en) * 1981-03-05 1982-09-11 Matsushita Electronics Corp Manufacture of resin-sealed semiconductor device and lead frame used therefor
JPS58170846U (en) * 1982-05-07 1983-11-15 日本電気株式会社 Lead frame for semiconductor devices
JPS6080262A (en) * 1983-10-07 1985-05-08 Nec Corp Semiconductor device
JPS61216353A (en) * 1985-03-20 1986-09-26 Shinko Electric Ind Co Ltd Manufacture of lead frame
JPS62193162A (en) * 1986-02-19 1987-08-25 Sumitomo Metal Mining Co Ltd Method for depression of lead frame
JPH02139953A (en) * 1988-11-21 1990-05-29 Toshiba Corp Lead frame
JPH0474460U (en) * 1990-11-09 1992-06-30
JPH057122A (en) * 1991-09-25 1993-01-14 Murata Mfg Co Ltd Electronic component

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55113357A (en) * 1979-02-23 1980-09-01 Hitachi Ltd Lead frame
JPS57147260A (en) * 1981-03-05 1982-09-11 Matsushita Electronics Corp Manufacture of resin-sealed semiconductor device and lead frame used therefor
JPS6220705B2 (en) * 1981-03-05 1987-05-08 Matsushita Electronics Corp
JPS58170846U (en) * 1982-05-07 1983-11-15 日本電気株式会社 Lead frame for semiconductor devices
JPS638143Y2 (en) * 1982-05-07 1988-03-10
JPS6080262A (en) * 1983-10-07 1985-05-08 Nec Corp Semiconductor device
JPS61216353A (en) * 1985-03-20 1986-09-26 Shinko Electric Ind Co Ltd Manufacture of lead frame
JPS62193162A (en) * 1986-02-19 1987-08-25 Sumitomo Metal Mining Co Ltd Method for depression of lead frame
JPH02139953A (en) * 1988-11-21 1990-05-29 Toshiba Corp Lead frame
JPH0474460U (en) * 1990-11-09 1992-06-30
JPH057122A (en) * 1991-09-25 1993-01-14 Murata Mfg Co Ltd Electronic component

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