JPS55113357A - Lead frame - Google Patents

Lead frame

Info

Publication number
JPS55113357A
JPS55113357A JP1982979A JP1982979A JPS55113357A JP S55113357 A JPS55113357 A JP S55113357A JP 1982979 A JP1982979 A JP 1982979A JP 1982979 A JP1982979 A JP 1982979A JP S55113357 A JPS55113357 A JP S55113357A
Authority
JP
Japan
Prior art keywords
tub
lead
groove
connecting piece
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1982979A
Other languages
Japanese (ja)
Inventor
Hajime Murakami
Yuji Sano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1982979A priority Critical patent/JPS55113357A/en
Publication of JPS55113357A publication Critical patent/JPS55113357A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:To reduce deformation in the frame by a method wherein a cut-in groove is provided on a connecting piece constituting a lead frame in order to facilitate cutting after resin-sealing of a semiconductor element, but at this time, the groove is provided on the side opposite the side where the tub is pressed down. CONSTITUTION:Many lead pieces 15 are projected from a pair of frame members 11 and 12, parallel in the longitudinal direction, constituting a lead frame. A set of connecting pieces 13 are formed in the center of the lead group. Tub 14 is provided in this center part for fixing the semiconductor element. Next, the element is fixed on tub 14. The electrodes provided on the element are bonded to the respective lead pieces 15 by using wire. However, at this time, to prevent the wire from slackening, tub 14 is pushed down. In this structure, cut-in groove 16 to be provided on connecting piece 13 which supports this downward pressing force is formed on the lower side of connecting piece 13, so that the stress due to the downward pressing force is produced as a compression stress and thereby scattering in the tub lowering dimensions is minimized.
JP1982979A 1979-02-23 1979-02-23 Lead frame Pending JPS55113357A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982979A JPS55113357A (en) 1979-02-23 1979-02-23 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982979A JPS55113357A (en) 1979-02-23 1979-02-23 Lead frame

Publications (1)

Publication Number Publication Date
JPS55113357A true JPS55113357A (en) 1980-09-01

Family

ID=12010174

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982979A Pending JPS55113357A (en) 1979-02-23 1979-02-23 Lead frame

Country Status (1)

Country Link
JP (1) JPS55113357A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62140729U (en) * 1986-02-27 1987-09-05

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5460563A (en) * 1977-10-21 1979-05-16 Mitsubishi Electric Corp Lead frame for semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5460563A (en) * 1977-10-21 1979-05-16 Mitsubishi Electric Corp Lead frame for semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62140729U (en) * 1986-02-27 1987-09-05

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