JPS62140729U - - Google Patents

Info

Publication number
JPS62140729U
JPS62140729U JP2840286U JP2840286U JPS62140729U JP S62140729 U JPS62140729 U JP S62140729U JP 2840286 U JP2840286 U JP 2840286U JP 2840286 U JP2840286 U JP 2840286U JP S62140729 U JPS62140729 U JP S62140729U
Authority
JP
Japan
Prior art keywords
pellet
hanging pin
semiconductor
semiconductor pellet
metal wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2840286U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2840286U priority Critical patent/JPS62140729U/ja
Publication of JPS62140729U publication Critical patent/JPS62140729U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図及び第２図は本考案の実施例を示すもの
で、第１図は部分平面図、第２図は第１図Ｙ―Ｙ
断面図を示す。第３図乃至第５図は従来の半導体
装置の一例を示し、第３図は部分平面図、第４図
は第３図Ｘ―Ｘ断面図、第５図は他の従来例を示
す断面図である。 １…リードフレーム、１ｃ…ペレツトマウント
部、１ｅ…リード、２…半導体ペレツト、３ａ…
金属細線、５…吊りピン、５ａ…段部。 Figures 1 and 2 show an embodiment of the present invention, with Figure 1 being a partial plan view and Figure 2 being the same as Figure 1 Y-Y.
A cross-sectional view is shown. 3 to 5 show an example of a conventional semiconductor device, FIG. 3 is a partial plan view, FIG. 4 is a sectional view taken along line XX in FIG. 3, and FIG. 5 is a sectional view showing another conventional example. It is. DESCRIPTION OF SYMBOLS 1... Lead frame, 1c... Pellet mount part, 1e... Lead, 2... Semiconductor pellet, 3a...
Thin metal wire, 5...hanging pin, 5a...stepped portion.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体ペレツトをマウントしたペレツトマウン
ト部より、中間部に段部を有する吊りピンを導出
し、半導体ペレツト上の電極と一端を半導体ペレ
ツト近傍に配置した複数のリード及び吊りピンと
を金属細線にて電気的に接続し、半導体ペレツト
を含む主要部分を樹脂外装したものにおいて、上
記吊りピンの段部を特定のリードの一端部よりペ
レツトマウント部側に位置させたことを特徴とす
る半導体装置。 A hanging pin with a step in the middle is led out from the pellet mount part on which the semiconductor pellet is mounted, and the electrodes on the semiconductor pellet and the plurality of leads and the hanging pin, one end of which is placed near the semiconductor pellet, are connected with electricity using a thin metal wire. What is claimed is: 1. A semiconductor device in which the main portion including the semiconductor pellet is sheathed with resin, wherein the stepped portion of the hanging pin is located closer to the pellet mount portion than one end of the specific lead.
JP2840286U 1986-02-27 1986-02-27 Pending JPS62140729U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2840286U JPS62140729U (en) 1986-02-27 1986-02-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2840286U JPS62140729U (en) 1986-02-27 1986-02-27

Publications (1)

Publication Number Publication Date
JPS62140729U true JPS62140729U (en) 1987-09-05

Family

ID=30831327

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2840286U Pending JPS62140729U (en) 1986-02-27 1986-02-27

Country Status (1)

Country Link
JP (1) JPS62140729U (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5498571A (en) * 1978-01-20 1979-08-03 Kyushu Nippon Electric Lead frame for semiconductor device
JPS55113357A (en) * 1979-02-23 1980-09-01 Hitachi Ltd Lead frame
JPS5648163A (en) * 1979-09-28 1981-05-01 Hitachi Ltd Lead frame

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5498571A (en) * 1978-01-20 1979-08-03 Kyushu Nippon Electric Lead frame for semiconductor device
JPS55113357A (en) * 1979-02-23 1980-09-01 Hitachi Ltd Lead frame
JPS5648163A (en) * 1979-09-28 1981-05-01 Hitachi Ltd Lead frame

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