JPS5648163A - Lead frame - Google Patents

Lead frame

Info

Publication number
JPS5648163A
JPS5648163A JP12410479A JP12410479A JPS5648163A JP S5648163 A JPS5648163 A JP S5648163A JP 12410479 A JP12410479 A JP 12410479A JP 12410479 A JP12410479 A JP 12410479A JP S5648163 A JPS5648163 A JP S5648163A
Authority
JP
Japan
Prior art keywords
pieces
tab
frame
lead frame
opposing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12410479A
Other languages
Japanese (ja)
Inventor
Kazuo Shimizu
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12410479A priority Critical patent/JPS5648163A/en
Publication of JPS5648163A publication Critical patent/JPS5648163A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49541Geometry of the lead-frame
    • H01L23/49544Deformation absorbing parts in the lead frame plane, e.g. meanderline shape
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93Batch processes
    • H01L24/95Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Abstract

PURPOSE:To release stress occurring in connecting parts and make the dimensions and shape of a frame stable, when supporting the opposing two sides of a semiconductor element mounting tab formed in a lead frame with connecting pieces, by providing bent parts for these connecting pieces. CONSTITUTION:In the center of a lead frame, a semiconductor element mounting tab 2113 is made, it is supported with connecting pieces 2112 which are formed integrally with both ends of the fame, and to the tab 2113, plural lead pieces 2111 projected from both ends of the frame at intervals are faced. In this construction, the connecting pieces 2112 connected with the opposing two sides of the tab 2113 are not formed in the same plane as the tab 2113, but bent parts 2112a are provided in their connecting portions. By so doing, generation of tensile stress can be prevented without preparing a special stress absorbing part and the deformation of the frame can be avoided easily.
JP12410479A 1979-09-28 1979-09-28 Lead frame Pending JPS5648163A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12410479A JPS5648163A (en) 1979-09-28 1979-09-28 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12410479A JPS5648163A (en) 1979-09-28 1979-09-28 Lead frame

Publications (1)

Publication Number Publication Date
JPS5648163A true JPS5648163A (en) 1981-05-01

Family

ID=14877015

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12410479A Pending JPS5648163A (en) 1979-09-28 1979-09-28 Lead frame

Country Status (1)

Country Link
JP (1) JPS5648163A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5990512A (en) * 1982-11-15 1984-05-25 Kondo Yoshiaki Production of modified sponge puff
JPS59159959U (en) * 1983-04-11 1984-10-26
JPS6053206U (en) * 1983-09-19 1985-04-15
JPS61245556A (en) * 1985-04-24 1986-10-31 Hitachi Ltd Lead frame
JPS62140729U (en) * 1986-02-27 1987-09-05
JPS63232359A (en) * 1986-11-24 1988-09-28 American Telephone & Telegraph Semiconductor integrated circuit package
USRE34269E (en) * 1986-11-24 1993-06-01 At&T Bell Laboratories Semiconductor integrated circuit packages
EP0902473A3 (en) * 1997-09-09 2001-11-21 Texas Instruments Incorporated Improvements in or relating to leadframes

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5990512A (en) * 1982-11-15 1984-05-25 Kondo Yoshiaki Production of modified sponge puff
JPS59159959U (en) * 1983-04-11 1984-10-26
JPS6053206U (en) * 1983-09-19 1985-04-15
JPS64827Y2 (en) * 1983-09-19 1989-01-10
JPS61245556A (en) * 1985-04-24 1986-10-31 Hitachi Ltd Lead frame
JPS62140729U (en) * 1986-02-27 1987-09-05
JPS63232359A (en) * 1986-11-24 1988-09-28 American Telephone & Telegraph Semiconductor integrated circuit package
USRE34269E (en) * 1986-11-24 1993-06-01 At&T Bell Laboratories Semiconductor integrated circuit packages
EP0902473A3 (en) * 1997-09-09 2001-11-21 Texas Instruments Incorporated Improvements in or relating to leadframes

Similar Documents

Publication Publication Date Title
ES2034983T3 (en) Contact item for electric plugs.
GB2038956B (en) Turbine shroud support structure
BR8504770A (en) Appliance for manufacturing photovoltaic module
KR850004693A (en) Split Grid for Raw Fuel Assemblies
IL56008D0 (en) Solar cells with low-cost silicon substrates and processes for the production thereof
JPH03173464A (en) Semiconductor device
JPS5365516A (en) Turbine shroud assembly
NL191332B (en) Pharmaceutical preparation with the ethyl ester of (all-Z) -5,8,11,14,17-eicosapentaenoic acid.
ES1019586U (en) Modular optical fibre distribution frame.
IL52795A (en) Electrical connector with means preventing decoupling when subjected to vibrations
ES1011480U (en) Fabric covered spline assembly
JPH04231895A (en) Method for manufacturing spacer and the spacer
JPS59228690A (en) Display panel
Brandt Stress-buffering effects of social support on maternal discipline.
ES266774U (en) Spectacle frame.
FR2594760B1 (en) Seat frame with assembled construction modules
BR7708678A (en) COMPOSITE MODULE AND PROCESS TO MANUFACTURE THE SAME
JPS5368411A (en) Turbo pump turbine provided with etched disc structure
IT7850088D0 (en) Polycarbonate blends that can be processed as thermoplasts and the process to produce them
ES458287A1 (en) Curable, storage-stable liquid organopolysiloxane compositions
AR225587A1 (en) Procedure for the manufacture of photovoltaic cells
JPS54568A (en) Semiconductor element
ATA593979A (en) Chair with a seat shell and a backrest fixed to the seat shell
AT173294T (en) Immortalization of dendritic cells with the v-myc oncogen
JPS57133655A (en) Lead frame