JPS5648163A - Lead frame - Google Patents

Lead frame

Info

Publication number
JPS5648163A
JPS5648163A JP12410479A JP12410479A JPS5648163A JP S5648163 A JPS5648163 A JP S5648163A JP 12410479 A JP12410479 A JP 12410479A JP 12410479 A JP12410479 A JP 12410479A JP S5648163 A JPS5648163 A JP S5648163A
Authority
JP
Japan
Prior art keywords
tab
frame
connecting pieces
lead frame
pieces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12410479A
Other languages
Japanese (ja)
Inventor
Kazuo Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12410479A priority Critical patent/JPS5648163A/en
Publication of JPS5648163A publication Critical patent/JPS5648163A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49544—Deformation absorbing parts in the lead frame plane, e.g. meanderline shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To release stress occurring in connecting parts and make the dimensions and shape of a frame stable, when supporting the opposing two sides of a semiconductor element mounting tab formed in a lead frame with connecting pieces, by providing bent parts for these connecting pieces. CONSTITUTION:In the center of a lead frame, a semiconductor element mounting tab 2113 is made, it is supported with connecting pieces 2112 which are formed integrally with both ends of the fame, and to the tab 2113, plural lead pieces 2111 projected from both ends of the frame at intervals are faced. In this construction, the connecting pieces 2112 connected with the opposing two sides of the tab 2113 are not formed in the same plane as the tab 2113, but bent parts 2112a are provided in their connecting portions. By so doing, generation of tensile stress can be prevented without preparing a special stress absorbing part and the deformation of the frame can be avoided easily.
JP12410479A 1979-09-28 1979-09-28 Lead frame Pending JPS5648163A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12410479A JPS5648163A (en) 1979-09-28 1979-09-28 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12410479A JPS5648163A (en) 1979-09-28 1979-09-28 Lead frame

Publications (1)

Publication Number Publication Date
JPS5648163A true JPS5648163A (en) 1981-05-01

Family

ID=14877015

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12410479A Pending JPS5648163A (en) 1979-09-28 1979-09-28 Lead frame

Country Status (1)

Country Link
JP (1) JPS5648163A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5990512A (en) * 1982-11-15 1984-05-25 近藤　吉秋 Production of modified sponge puff
JPS59159959U (en) * 1983-04-11 1984-10-26 新光電気工業株式会社 lead frame
JPS6053206U (en) * 1983-09-19 1985-04-15 株式会社パンジー Hydrous polyurethane cosmetic puff
JPS61245556A (en) * 1985-04-24 1986-10-31 Hitachi Ltd Lead frame
JPS62140729U (en) * 1986-02-27 1987-09-05
JPS63232359A (en) * 1986-11-24 1988-09-28 アメリカン　テレフォン　アンド　テレグラフ　カムパニー Semiconductor integrated circuit package
USRE34269E (en) * 1986-11-24 1993-06-01 At&T Bell Laboratories Semiconductor integrated circuit packages
EP0902473A3 (en) * 1997-09-09 2001-11-21 Texas Instruments Incorporated Improvements in or relating to leadframes

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5990512A (en) * 1982-11-15 1984-05-25 近藤　吉秋 Production of modified sponge puff
JPS59159959U (en) * 1983-04-11 1984-10-26 新光電気工業株式会社 lead frame
JPS6053206U (en) * 1983-09-19 1985-04-15 株式会社パンジー Hydrous polyurethane cosmetic puff
JPS64827Y2 (en) * 1983-09-19 1989-01-10
JPS61245556A (en) * 1985-04-24 1986-10-31 Hitachi Ltd Lead frame
JPS62140729U (en) * 1986-02-27 1987-09-05
JPS63232359A (en) * 1986-11-24 1988-09-28 アメリカン　テレフォン　アンド　テレグラフ　カムパニー Semiconductor integrated circuit package
USRE34269E (en) * 1986-11-24 1993-06-01 At&T Bell Laboratories Semiconductor integrated circuit packages
EP0902473A3 (en) * 1997-09-09 2001-11-21 Texas Instruments Incorporated Improvements in or relating to leadframes

Similar Documents

Publication Publication Date Title
JPS57133655A (en) Lead frame
JPS5648163A (en) Lead frame
IT1084770B (en) COMBINE HARVESTER WITH IMPELLER GROUPS TRANSVERSALLY MOUNTED TO THE SUPPORT FRAME
GB1268957A (en) An improved fuel assembly spacer grid for a nuclear reactor
IT1080897B (en) SILICONE ELASTOMERS WITH SELF-EXTINGUISHING CHARACTERISTICS
JPS5455169A (en) Semiconductor device
JPS553606A (en) Photo-semiconductor coupling device and its manufacturing method
JPS55120155A (en) Semiconductor lead frame
JPS5529839A (en) Electrifier
JPS56108276A (en) Semiconductor diaphragm type sensor
JPS55125682A (en) Solar battery module device
JPS5596663A (en) Method of fabricating semiconductor device
JPS55166945A (en) Lead frame
JPS5766656A (en) Lead frame for semiconductor device
JPS5362093A (en) Fuel assembly
JPS5575679A (en) Mounting construction for display cell
SU479812A1 (en) Titanium based alloy
SU957314A1 (en) Fuse holder
JPS5521117A (en) Lead frame
JPS53125591A (en) Nuclear fuel assembly spacer
JPS55128991A (en) Connector assembly
JPS55113357A (en) Lead frame
JPS5652921A (en) Support of crystal vibrator
CS186167B1 (en) Connection of the tensometric scanner of mechanical quantities with semiconductor piezoresistors made by the diffusion technologion
JPS5592842A (en) Solar heat collector