JPS61245556A - Lead frame - Google Patents

Lead frame

Info

Publication number
JPS61245556A
JPS61245556A JP8636885A JP8636885A JPS61245556A JP S61245556 A JPS61245556 A JP S61245556A JP 8636885 A JP8636885 A JP 8636885A JP 8636885 A JP8636885 A JP 8636885A JP S61245556 A JPS61245556 A JP S61245556A
Authority
JP
Japan
Prior art keywords
tab
resin
lead
lead frame
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8636885A
Other languages
Japanese (ja)
Inventor
Shigeru Suzuki
茂 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8636885A priority Critical patent/JPS61245556A/en
Publication of JPS61245556A publication Critical patent/JPS61245556A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To smooth a flow path for a resin, and to obtain a semiconductor device having high reliability by forming a tab-hanging lead in parallel with an outer frame. CONSTITUTION:Tab-hanging leads 2 are connected at the central sections of the long sides of a rectangular tab 1 at the center of a lead frame. Two tab- hanging leads 2 are fitted to one side and two ones are also mounted to another side. Inner leads 3 are disposed toward the tab in the periphery of the tab 1. No leads are formed at the four corners of the tab 1. Accordingly, a resin flows in from the four corners of the tab on a molding, and the uniform flow of the resin is shaped, thus decreasing voids in the resin, then acquiring a device having high reliability.

Description

【発明の詳細な説明】 〔技術分野〕 本発明はリードフレームに関し、特に、そのタブ吊りリ
ードの改良技術に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a lead frame, and particularly to a technique for improving tab suspension leads thereof.

〔背景技術〕[Background technology]

リードフレームの周知の形態として、第６図に示すよう
なものがある。これはデュアル・イン・ライン（ＤＩＬ
）プラスチックパッケージ用のリードフレームである。A well-known form of lead frame is shown in FIG. 6. This is a dual-in-line (DIL)
) Lead frames for plastic packages.

このリードフレームは、第６図に示すように、その略中
夫に位置する、半導体素子（チ、ンプ、ペレット）を搭
載する部分である、いわゆるタブと称される半導体素子
搭載部９と、このタブ９を支持しているいわゆるタブ吊
りリード１０と、多連の当該リードフレームを連結して
いる部分である外枠１１と、タブ９０周辺にこのタブ９
に向って配列されたインナーリード１２と、これらイン
ナーリード１２を連結し、レジンをトランファーモール
ドする際にレジンの流れ止めの役目などをするダム１３
と、このダム１３の外側に位置し外部接続端子となるア
ウターリード１４と、内枠１５とを備えて成っている。As shown in FIG. 6, this lead frame has a semiconductor element mounting part 9, called a tab, which is a part on which a semiconductor element (chip, pellet) is mounted, located approximately in the middle of the lead frame. A so-called tab hanging lead 10 that supports this tab 9, an outer frame 11 that is a part that connects the multiple lead frames, and a tab 90 surrounding the tab 90.
A dam 13 connects these inner leads 12 and serves to stop the flow of resin when transfer molding the resin.
, an outer lead 14 located outside the dam 13 and serving as an external connection terminal, and an inner frame 15.

第６図に示すように、上記タブ吊りリードｌＯは、外枠
１１に対し略直角方向（長手方向）に延び、その一端部
をタブ９に、また、その他端部を外枠１１に、連結して
、タブ９を支持している。As shown in FIG. 6, the tab suspension lead 10 extends substantially perpendicularly (longitudinally) to the outer frame 11, and is connected to the tab 9 at one end and to the outer frame 11 at the other end. and supports the tab 9.

このように、ＤＩＬＰでは、一般に、長手方向には１】
−ドが密集していないので、午のように、長手方向にタ
ブ吊りリード２を設けることができる。In this way, in DILP, in general, the longitudinal direction is 1]
- Since the leads are not densely packed, the tab hanging leads 2 can be provided in the longitudinal direction like a horse.

しかし、いわゆるＰＬＣＣと称されるリードレスのプラ
スチックチップキャリアでは、長平方向にもリードが密
集しているために、長手方向にタブ吊りリードを設ける
ことは困難である。そこで、本出願人は、先に、タブの
四隅コーナ一部からタブを吊るいわゆる四辺量りによる
タブ吊りを提案した。However, in a leadless plastic chip carrier called PLCC, the leads are also densely packed in the longitudinal direction, so it is difficult to provide tab suspension leads in the longitudinal direction. Therefore, the applicant of the present invention previously proposed a method of hanging a tab from a portion of the four corners of the tab by so-called four-side weighing.

しかし、このようにタブの四隅に、かかるタブ吊りリー
ドを設けるとトランファーモールドの際レジン流路の妨
げとなり、またレジン内ボイドも生じ易いことが判った
。However, it has been found that providing such tab suspension leads at the four corners of the tab obstructs the resin flow path during transfer molding, and also tends to cause voids within the resin.

なお、リードフレームの構造例については、例えば工業
稠青会１９８０年１月１０日発行日本マイクロエレクト
ロニクス協会編「ＩＣ化実装技術」ｐ１４０に記述があ
る。An example of the structure of a lead frame is described, for example, in "IC Mounting Technology" edited by Japan Microelectronics Association, published January 10, 1980 by Kogyo Choseikai, p. 140.

〔発明の目的〕[Purpose of the invention]

本発明は、レジンモールド時のレジン流路を円滑にした
リードフレームを提供することを目的とする。An object of the present invention is to provide a lead frame with a smooth resin flow path during resin molding.

本発明は、また、Ｖジン内ボイドを低減できるリードフ
レームを提供することを目的とする。Another object of the present invention is to provide a lead frame that can reduce voids within the V gin.

本発明の前記ならびにそのほかの目的と新規な特徴は、
本明細書の記述および添付図面からあきらかになるであ
ろう。The above and other objects and novel features of the present invention include:
It will become clear from the description of this specification and the accompanying drawings.

〔発明の概要〕[Summary of the invention]

本願において開示される発明のうち代表的なものの概要
を簡単に説明すれば、下記のとおりである。A brief overview of typical inventions disclosed in this application is as follows.

すなわち１本発明では、リードフレームにおいて、その
タブ吊りリードを長手方向でなく短手方向に設けたので
、四隅にリードが設けられているとト（レジン流路の妨
げにならず、かつ、レジン内ボイドの低減に成功し、信
頼性の向上した半導体装置が得られた。In other words, in the present invention, in the lead frame, the tab suspension leads are provided in the transverse direction rather than in the longitudinal direction, so that if the leads are provided at the four corners (they do not obstruct the resin flow path and the resin A semiconductor device with improved reliability was obtained by successfully reducing internal voids.

〔実施例〕〔Example〕

次に、本発明を実施例を示す図面に基づいて説明する。 Next, the present invention will be explained based on drawings showing examples.

第１図は本発明の実施例を示すリードフレームの要部平
面図、第２図は本発明の実施例を示すリードフレーム全
体の一部省略平面図、第３図はＰＬＣＣの平面図、第４
図は第３図Ｉ−Ｉ＠断面図、第５図は本発明の他の実施
例を示す要部平面図である。第１図に示すように７リー
ドフレーム中央の長方形状のタブｌの長辺略中夫にタブ
吊りり−ド２を連結する。タブ吊りリード２はタブｌの
一辺に二本設け、他辺にも二本設ける。FIG. 1 is a plan view of main parts of a lead frame showing an embodiment of the present invention, FIG. 2 is a partially omitted plan view of the entire lead frame showing an embodiment of the present invention, and FIG. 3 is a plan view of a PLCC. 4
The drawings are a cross-sectional view taken along the line I--I in FIG. 3, and a plan view of main parts showing another embodiment of the present invention. As shown in FIG. 1, a tab hanging door 2 is connected to a long side of a rectangular tab l at the center of a seven-lead frame. Two tab suspension leads 2 are provided on one side of the tab l, and two are provided on the other side.

タブｌの周辺にｌ／ｉインナーリード３がこのタブ１に
向って複数配設されている。A plurality of l/i inner leads 3 are arranged around the tab l and facing the tab l.

第２図ではその図示□が省略されているが、上記タブ吊
りリード２は、前記第６図に図示のリードフレームと同
様にダムを介して内枠に連結している。Although the illustration □ is omitted in FIG. 2, the tab suspension lead 2 is connected to the inner frame via a dam, similar to the lead frame shown in FIG. 6.

第２図にて、４は外枠で、多連のリードフレームの各リ
ードフレーム部連結している部分で、上記タブ吊りリー
ド２はこの外枠４に平行に設けられる。タブｌは、従来
の長手力１に吊設されるのに対し、短手方向に吊設され
る。In FIG. 2, reference numeral 4 denotes an outer frame, which is a portion connecting each lead frame portion of a plurality of lead frames, and the tab suspension lead 2 is provided parallel to this outer frame 4. The tab 1 is suspended in the lateral direction, whereas the tab 1 is suspended in the longitudinal direction 1 in the conventional case.

また、第２図にて、５はダムを示し、他、第６図と同様
に構成される。このリードフレームを用いたＰＬＣＣは
、周知の技術により、例えば次のように製造される。タ
ブ吊りリード２により支持された、タブ１上に、半導体
素子（図示せず）を　　　゛搭載する。この素子とアウ
ターリードとをコネクタワイヤにより接続し、電気的導
通をとる。かかる組立品を、モールド金型に入れてエポ
キシ樹脂などの樹脂でトランスファーモールドし、個別
に切断分離する主要工程を経て製造される。上記タブ吊
りリード２は、かかる工程において、タブｌとは切断分
離される。Further, in FIG. 2, numeral 5 indicates a dam, and the rest of the structure is the same as in FIG. 6. A PLCC using this lead frame is manufactured using a well-known technique, for example, as follows. A semiconductor element (not shown) is mounted on the tab 1 supported by the tab suspension lead 2. This element and the outer lead are connected by a connector wire to establish electrical continuity. The assembly is manufactured through the main steps of placing it in a mold, transfer-molding it with a resin such as epoxy resin, and cutting it into individual pieces. The tab suspension lead 2 is cut and separated from the tab 1 in this step.

ＰＬＣＣでは第３図及び第４図に示すように。In PLCC, as shown in Figures 3 and 4.

レジン封止部６より引出されたアウターリード７を当該
封止部６の底面に折曲げし、実装基板に平面付は実装さ
れる。The outer lead 7 pulled out from the resin sealing part 6 is bent onto the bottom surface of the sealing part 6, and the flat surface is mounted on the mounting board.

次に、第５図に示す実施例は、前記短手方向のタブ吊り
リード２に加えて短手方向の空ピン８を設けたもので、
この空ピン８を２本のタブ吊りリード２間に設ける。Next, in the embodiment shown in FIG. 5, in addition to the tab suspension lead 2 in the transverse direction, an empty pin 8 in the transverse direction is provided.
This empty pin 8 is provided between the two tab suspension leads 2.

〔効果〕〔effect〕

（１）　　本発明によれば、四隅にリードがなく、モー
ルド時のレジンはタブの四隅から流れ込むようになって
いるので、均一なレジンの流れを確保できる。(1) According to the present invention, there are no leads at the four corners, and the resin during molding flows from the four corners of the tab, so that a uniform flow of resin can be ensured.

（２）本発明によればレジンの流れが均一になるので、
レジン内ボイドを低減させることができた。(2) According to the present invention, the flow of resin becomes uniform, so
It was possible to reduce voids within the resin.

以上本発明者によってなされた発明を実施例にもとづき
具体的に説明したが、本発明は上記実施例に限定される
ものでげなく、その要旨を逸脱しない範囲で種々変更可
能であることはいうまでもない。Although the invention made by the present inventor has been specifically explained above based on examples, it is to be understood that the present invention is not limited to the above-mentioned examples and can be modified in various ways without departing from the gist thereof. Not even.

〔利用分野〕[Application field]

本発明はプラスチックパッケージ全般に適用され、パッ
ケージが小型化するに伴ない、リードフレームが複雑し
、長手方向の寸法余裕がとれない場合に適用して有用で
ある。The present invention is applicable to plastic packages in general, and is useful in cases where as packages become smaller, lead frames become more complex and dimensional margins in the longitudinal direction cannot be secured.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明の実施例を示すリードフレームの要部平
面図、第２図は本発明の実施例を示すリードフレーム全
体の一部省略平面図、第３図はＰＬＣＣの平面図、第４
図は第３図Ｉ−ＩＩｗ断面図、第５図は本発明の他の実
施例を示す要部平面図、第６図はＤＩＬＰリードフレー
ムの従来例を示す平面図である。 １・・・タブ、２・・・タブ吊りリード、３・・・イン
ナーリード、４・・・外枠、訃・・ダム、６・・・レジ
ン封止部。 ７・・・アウターリード、８・・・空ピン、９・・・タ
ブ、１０・・・タブ吊りリード、１１・・・外枠、１２
・・・インナーリード、１３・・・ダム、１４・・・ア
ウターリード、１５・・・内枠。 一一一＼、 代理人　弁理士　　小　川　勝　男　（）−−一〆′ 第　　４　　図 を 第　　５　　図 第　　６　　図 ／１１　　　　．１６一FIG. 1 is a plan view of main parts of a lead frame showing an embodiment of the present invention, FIG. 2 is a partially omitted plan view of the entire lead frame showing an embodiment of the present invention, and FIG. 3 is a plan view of a PLCC. 4
The figures are a sectional view taken along line I-IIw in FIG. 3, FIG. 5 is a plan view of a main part showing another embodiment of the present invention, and FIG. 6 is a plan view showing a conventional example of a DILP lead frame. 1...Tab, 2...Tab hanging lead, 3...Inner lead, 4...Outer frame, butt...Dam, 6...Resin sealing part. 7... Outer lead, 8... Empty pin, 9... Tab, 10... Tab hanging lead, 11... Outer frame, 12
...Inner lead, 13...Dam, 14...Outer lead, 15...Inner frame. 111\, Agent Patent Attorney Katsuo Ogawa ()--1〆' Figure 4 Figure 5 Figure 6 Figure 11. 16 one

Claims (1)

【特許請求の範囲】 １、半導体素子搭載部を支持しているタブ吊りリードを
備えたリードフレームにおいて、前記タブ吊りリードを
外枠に平行に設けて成ることを特徴とするリードフレー
ム。 ２、リードフレームが、プラスチックリードレスチップ
キャリア用リードフレームである、特許請求の範囲第１
項記載のリードフレーム。[Scope of Claims] 1. A lead frame equipped with tab suspension leads supporting a semiconductor element mounting portion, characterized in that the tab suspension leads are provided parallel to an outer frame. 2. Claim 1, wherein the lead frame is a lead frame for a plastic leadless chip carrier.
Lead frame as described in section.
JP8636885A 1985-04-24 1985-04-24 Lead frame Pending JPS61245556A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8636885A JPS61245556A (en) 1985-04-24 1985-04-24 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8636885A JPS61245556A (en) 1985-04-24 1985-04-24 Lead frame

Publications (1)

Publication Number Publication Date
JPS61245556A true JPS61245556A (en) 1986-10-31

Family

ID=13884935

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8636885A Pending JPS61245556A (en) 1985-04-24 1985-04-24 Lead frame

Country Status (1)

Country Link
JP (1) JPS61245556A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0452903A2 (en) * 1990-04-18 1991-10-23 Kabushiki Kaisha Toshiba Lead frame for semiconductor device
US5283466A (en) * 1990-09-27 1994-02-01 Kabushiki Kaisha Toshiba Lead frame for semiconductor device of the resin encapsulation type

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50127565A (en) * 1974-03-27 1975-10-07
JPS5648163A (en) * 1979-09-28 1981-05-01 Hitachi Ltd Lead frame
JPS5788752A (en) * 1980-11-25 1982-06-02 Hitachi Ltd Lead frame and semiconductor device prepared by using the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50127565A (en) * 1974-03-27 1975-10-07
JPS5648163A (en) * 1979-09-28 1981-05-01 Hitachi Ltd Lead frame
JPS5788752A (en) * 1980-11-25 1982-06-02 Hitachi Ltd Lead frame and semiconductor device prepared by using the same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0452903A2 (en) * 1990-04-18 1991-10-23 Kabushiki Kaisha Toshiba Lead frame for semiconductor device
JPH04750A (en) * 1990-04-18 1992-01-06 Toshiba Corp Lead frame for semiconductor device
EP0676807A1 (en) * 1990-04-18 1995-10-11 Kabushiki Kaisha Toshiba Lead frame for semiconductor device
US5283466A (en) * 1990-09-27 1994-02-01 Kabushiki Kaisha Toshiba Lead frame for semiconductor device of the resin encapsulation type

Similar Documents

Publication Publication Date Title
US6281566B1 (en) Plastic package for electronic devices
EP0108502A2 (en) A plastics moulded semiconductor device and a method of producing it
JPH07273268A (en) Semiconductor package and lead frame for semiconductor package
US5708294A (en) Lead frame having oblique slits on a die pad
EP0114531B2 (en) Package for a semiconductor chip with lead terminals
JPH047848A (en) Manufacture of resin sealing type semiconductor equipment and resin sealing die and lead frame used therein
JPS61245556A (en) Lead frame
JP2771104B2 (en) Lead frame for semiconductor device
JP3226244B2 (en) Resin-sealed semiconductor device
JPS63296252A (en) Resin sealed semiconductor device
JP3688440B2 (en) Semiconductor device
KR100333386B1 (en) chip scale package
JPS60107848A (en) Semiconductor device and lead frame used for said device
JPS61237458A (en) Resin-sealed type semiconductor device
JPS61137352A (en) Semiconductor device
JP2924957B2 (en) Resin-sealed semiconductor device
KR940008340B1 (en) Leadframe for semiconductor device
JPS6352451A (en) Resin-sealed semiconductor device
JPH1027870A (en) Semiconductor device and manufacture thereof
JPS63169054A (en) Lead frame of resin sealing type semiconductor device
JP2504194B2 (en) Method for manufacturing resin-sealed semiconductor device
KR940007758Y1 (en) Semiconductor lead frame
JPS62249464A (en) Semiconductor package
JPH01206652A (en) Semiconductor device
JPH01135058A (en) Semiconductor device