JPS6367246U - - Google Patents
Info
- Publication number
- JPS6367246U JPS6367246U JP16199386U JP16199386U JPS6367246U JP S6367246 U JPS6367246 U JP S6367246U JP 16199386 U JP16199386 U JP 16199386U JP 16199386 U JP16199386 U JP 16199386U JP S6367246 U JPS6367246 U JP S6367246U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- monitoring
- semiconductor
- sealed
- external terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 2
- 238000012544 monitoring process Methods 0.000 claims 3
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ａはこの考案の一実施例である半導体装
置ならびにシールドキヤツプの上面図、第１図ｂ
は第１図ａの側面断面図、第２図ａは従来例の半
導体装置ならびにシールドキヤツプの側面断面図
、第２図ｂは、第２図ａの側面断面図である。
１……シールギキヤツプ、２……半導体基板、
３……半導体素子、１０……モニタ用パツド、１
４……モニタ用内部リード端子、１６……ボンデ
イングワイヤ、１７……モニタ用外部端子。
Figure 1a is a top view of a semiconductor device and shield cap that are an embodiment of this invention, Figure 1b
1A is a side sectional view of FIG. 1A, FIG. 2A is a side sectional view of a conventional semiconductor device and a shield cap, and FIG. 2B is a side sectional view of FIG. 2A. 1... Seal cap, 2... Semiconductor substrate,
3... Semiconductor element, 10... Monitor pad, 1
4... Internal lead terminal for monitor, 16... Bonding wire, 17... External terminal for monitor.
Claims (1)
部の最底面に半導体素子を露出させて載置し、上
部より絶縁性シールドキヤツプで封止する半導体
装置において、前記半導体素子を封止するシール
ドキヤツプにモニタ用外部端子を設け、該モニタ
用外部端子と半導体素子内のモニタ用パツドとを
電気的に接続したことを特徴とする半導体装置。 In a semiconductor device in which a semiconductor substrate has a plurality of recesses in the center thereof, a semiconductor element is placed exposed at the bottom of the recess, and the semiconductor element is sealed from above with an insulating shield cap, the semiconductor element is sealed. A semiconductor device characterized in that a shield cap is provided with an external terminal for monitoring, and the external terminal for monitoring is electrically connected to a monitoring pad within a semiconductor element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16199386U JPS6367246U (en) | 1986-10-22 | 1986-10-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16199386U JPS6367246U (en) | 1986-10-22 | 1986-10-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6367246U true JPS6367246U (en) | 1988-05-06 |
Family
ID=31088832
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16199386U Pending JPS6367246U (en) | 1986-10-22 | 1986-10-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6367246U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009175155A (en) * | 2002-03-25 | 2009-08-06 | Seiko Epson Corp | Electronic component with control terminal |
-
1986
- 1986-10-22 JP JP16199386U patent/JPS6367246U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009175155A (en) * | 2002-03-25 | 2009-08-06 | Seiko Epson Corp | Electronic component with control terminal |