JPS61203553U - - Google Patents
Info
- Publication number
- JPS61203553U JPS61203553U JP8855685U JP8855685U JPS61203553U JP S61203553 U JPS61203553 U JP S61203553U JP 8855685 U JP8855685 U JP 8855685U JP 8855685 U JP8855685 U JP 8855685U JP S61203553 U JPS61203553 U JP S61203553U
- Authority
- JP
- Japan
- Prior art keywords
- sub
- housed
- base
- semiconductor
- case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000000919 ceramic Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Die Bonding (AREA)
Description
第１図は本考案の一実施例の断面図、第２図は
本考案の他の実施例の断面図、第３図は従来のキ
ヤンケースの半導体装置のキヤツプなしの平面図
、第４図は従来のセラミツクケース半導体装置の
蓋なしの平面図である。
１……半導体素子、２……サブベース、３……
ヘツダ、４，９……外部リード、５……接地ワイ
ヤ、６……金線、７……キヤツプ、８……セラミ
ツクケース、１０……導電ランド、１１……蓋、
１２……金系合金。
Fig. 1 is a sectional view of one embodiment of the present invention, Fig. 2 is a sectional view of another embodiment of the invention, Fig. 3 is a plan view of a conventional can case semiconductor device without a cap, and Fig. 4. 1 is a plan view of a conventional ceramic case semiconductor device without a lid. 1...Semiconductor element, 2...Sub base, 3...
Header, 4, 9... External lead, 5... Ground wire, 6... Gold wire, 7... Cap, 8... Ceramic case, 10... Conductive land, 11... Lid,
12...Gold-based alloy.
Claims (1)
置において、前記半導体素子は、接地用突起部を
有するサブベースに固着された上でこのサブベー
スと共に前記ケース内に収容されていることを特
徴とする半導体装置。 A semiconductor device in which a semiconductor element is housed in a case, characterized in that the semiconductor element is fixed to a sub-base having a grounding protrusion and then housed in the case together with the sub-base. Semiconductor equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8855685U JPS61203553U (en) | 1985-06-12 | 1985-06-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8855685U JPS61203553U (en) | 1985-06-12 | 1985-06-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61203553U true JPS61203553U (en) | 1986-12-22 |
Family
ID=30641811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8855685U Pending JPS61203553U (en) | 1985-06-12 | 1985-06-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61203553U (en) |
-
1985
- 1985-06-12 JP JP8855685U patent/JPS61203553U/ja active Pending