JPS61141274U - - Google Patents
Info
- Publication number
- JPS61141274U JPS61141274U JP2272885U JP2272885U JPS61141274U JP S61141274 U JPS61141274 U JP S61141274U JP 2272885 U JP2272885 U JP 2272885U JP 2272885 U JP2272885 U JP 2272885U JP S61141274 U JPS61141274 U JP S61141274U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- lid
- electrodes
- base body
- conductor parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 3
- 239000012212 insulator Substances 0.000 description 1
Landscapes
- Packaging Frangible Articles (AREA)
Description
第１図は本考案一実施例の半導体装置用ケース
の斜視図、第２図及び第３図は従来の半導体装置
用ケースを説明するための斜視図、第４図は本考
案に係る半導体装置の斜視図である。
図において、１は基体、２は蓋、３は収容部、
４及び５は導体部、６は半導体チツプ、７はキヤ
リア、８は絶縁体、９及び１０は電極、１１はワ
イヤをそれぞれ示している。
FIG. 1 is a perspective view of a semiconductor device case according to an embodiment of the present invention, FIGS. 2 and 3 are perspective views for explaining a conventional semiconductor device case, and FIG. 4 is a semiconductor device according to the present invention. FIG. In the figure, 1 is a base, 2 is a lid, 3 is a housing part,
4 and 5 are conductor parts, 6 is a semiconductor chip, 7 is a carrier, 8 is an insulator, 9 and 10 are electrodes, and 11 is a wire, respectively.
Claims (1)
半導体装置を収容する収容部３を有する基体１と
、 該基体１上で開閉する蓋２とを備え、 該蓋の閉鎖時に前記収容部３に収容される半導
体装置の２つの電極にそれぞれ当接してなる２つ
の導体部４，５が前記蓋２に設けられ、 該２つの導体部４，５が互いに電気的に接続さ
れてなることを特徴とする半導体装置用ケース。[Claims for Utility Model Registration] A base body 1 having a housing portion 3 for accommodating a semiconductor device such that two electrodes of the semiconductor device face upward, and a lid 2 that opens and closes on the base body 1, the lid comprising: Two conductor parts 4 and 5 are provided on the lid 2 and are in contact with two electrodes of a semiconductor device housed in the housing part 3 when the lid 2 is closed, and the two conductor parts 4 and 5 are electrically connected to each other. A semiconductor device case characterized by being connected to.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2272885U JPH038632Y2 (en) | 1985-02-20 | 1985-02-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2272885U JPH038632Y2 (en) | 1985-02-20 | 1985-02-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61141274U true JPS61141274U (en) | 1986-09-01 |
| JPH038632Y2 JPH038632Y2 (en) | 1991-03-04 |
Family
ID=30515296
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2272885U Expired JPH038632Y2 (en) | 1985-02-20 | 1985-02-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH038632Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08324285A (en) * | 1995-05-30 | 1996-12-10 | Aisin Aw Co Ltd | Automatic transmission |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8631151B2 (en) | 2006-05-18 | 2014-01-14 | Intel Corporation | Techniques for guaranteeing bandwidth with aggregate traffic |
-
1985
- 1985-02-20 JP JP2272885U patent/JPH038632Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08324285A (en) * | 1995-05-30 | 1996-12-10 | Aisin Aw Co Ltd | Automatic transmission |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH038632Y2 (en) | 1991-03-04 |
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