JPS6190244U - - Google Patents
Info
- Publication number
- JPS6190244U JPS6190244U JP1984176011U JP17601184U JPS6190244U JP S6190244 U JPS6190244 U JP S6190244U JP 1984176011 U JP1984176011 U JP 1984176011U JP 17601184 U JP17601184 U JP 17601184U JP S6190244 U JPS6190244 U JP S6190244U
- Authority
- JP
- Japan
- Prior art keywords
- attached
- semiconductor device
- semiconductor
- semiconductor pellet
- insulating frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000008188 pellet Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4899—Auxiliary members for wire connectors, e.g. flow-barriers, reinforcing structures, spacers, alignment aids
- H01L2224/48996—Auxiliary members for wire connectors, e.g. flow-barriers, reinforcing structures, spacers, alignment aids being formed on an item to be connected not being a semiconductor or solid-state body
- H01L2224/48998—Alignment aids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Description
第1図は、本考案の実施例を示す横断面図であ
る。第2図は、本考案の別の実施例を示す図であ
つてaは側面図、bはその部分の断面図である。
尚、図において、1…パツケージ基体、2…半
導体ペレツト、3…電気絶縁性フレーム、4…金
属細線。
FIG. 1 is a cross-sectional view showing an embodiment of the present invention. FIG. 2 is a diagram showing another embodiment of the present invention, in which a is a side view and b is a sectional view of that portion. In the figure, 1...package base, 2...semiconductor pellet, 3...electrically insulating frame, 4...metal thin wire.
Claims (1)
る構造の半導体装置において、半導体ペレツトを
取付ける部分は凹部となつており、該凹部には前
記半導体ペレツトを囲むように電記絶縁性のフレ
ームが取付けられていることを特徴とする半導体
装置。 (2) 前記電気絶縁性のフレームの上部には各々
の金属細線を収納し得る溝が形成されていること
を特徴とする実用新案登録請求の範囲第(1)項記
載の半導体装置。[Claims for Utility Model Registration] (1) In a semiconductor device having a structure in which a semiconductor pellet is attached to an electrically insulating substrate, the part where the semiconductor pellet is attached is a recessed part, and the recessed part has an electrically conductive part surrounding the semiconductor pellet. A semiconductor device characterized in that an insulating frame is attached. (2) The semiconductor device according to claim 1, wherein a groove is formed in the upper part of the electrically insulating frame to accommodate each thin metal wire.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984176011U JPS6190244U (en) | 1984-11-20 | 1984-11-20 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984176011U JPS6190244U (en) | 1984-11-20 | 1984-11-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6190244U true JPS6190244U (en) | 1986-06-12 |
Family
ID=30733609
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1984176011U Pending JPS6190244U (en) | 1984-11-20 | 1984-11-20 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6190244U (en) |
-
1984
- 1984-11-20 JP JP1984176011U patent/JPS6190244U/ja active Pending