JPS62184753U - - Google Patents
Info
- Publication number
- JPS62184753U JPS62184753U JP7339486U JP7339486U JPS62184753U JP S62184753 U JPS62184753 U JP S62184753U JP 7339486 U JP7339486 U JP 7339486U JP 7339486 U JP7339486 U JP 7339486U JP S62184753 U JPS62184753 U JP S62184753U
- Authority
- JP
- Japan
- Prior art keywords
- tab
- leads
- package
- recess
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図はこの考案による半導体装置の一実施例
を示す斜視図、第２図、第３図は従来の半導体装
置を説明する平面図、斜視図である。
１……リードフレーム、２……半導体素子、３
……タブ、４……タブリード、４ａ……タブリー
ド切断部、５……外部回路接続用リード、６……
電極、７……ワイヤ、８……樹脂封止領域、９…
…パツケージ、１０……凹部。
FIG. 1 is a perspective view showing one embodiment of a semiconductor device according to this invention, and FIGS. 2 and 3 are a plan view and a perspective view illustrating a conventional semiconductor device. 1...Lead frame, 2...Semiconductor element, 3
...Tab, 4...Tab lead, 4a...Tab lead cutting part, 5...External circuit connection lead, 6...
Electrode, 7... Wire, 8... Resin sealing area, 9...
...package, 10... recess.
Claims (1)
するダブリードと、このタブ周辺に配置され前記
半導体素子の電極にワイヤを介して接続される複
数のリードと、その周辺部を樹脂封止したパツケ
ージとを備え、前記リードが前記パツケージの主
面に並行に所定間隔で一方向から導出される半導
体装置において、前記パツケージの前記リードが
導出する面と向い合う面の一部に凹部を設け、こ
の凹部内に前記タブリードの切断面を露出させる
ことを特徴とした半導体装置。 A tab on which a semiconductor element is mounted, a double lead that supports this tab, a plurality of leads arranged around this tab and connected to electrodes of the semiconductor element via wires, and a package whose peripheral part is sealed with resin. In the semiconductor device, the leads are led out from one direction parallel to the main surface of the package at predetermined intervals, a recess is provided in a part of the surface of the package facing the surface from which the leads are led out, and the recess is A semiconductor device characterized in that a cut surface of the tab lead is exposed inside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7339486U JPS62184753U (en) | 1986-05-14 | 1986-05-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7339486U JPS62184753U (en) | 1986-05-14 | 1986-05-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62184753U true JPS62184753U (en) | 1987-11-24 |
Family
ID=30917688
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7339486U Pending JPS62184753U (en) | 1986-05-14 | 1986-05-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62184753U (en) |
-
1986
- 1986-05-14 JP JP7339486U patent/JPS62184753U/ja active Pending