JPS6247156U - - Google Patents
Info
- Publication number
- JPS6247156U JPS6247156U JP1985139996U JP13999685U JPS6247156U JP S6247156 U JPS6247156 U JP S6247156U JP 1985139996 U JP1985139996 U JP 1985139996U JP 13999685 U JP13999685 U JP 13999685U JP S6247156 U JPS6247156 U JP S6247156U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- lead frame
- emitting element
- envelope
- resin layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims 2
- 239000004593 Epoxy Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Description
第１図は本考案の一実施例に係る半導体発光装
置の断面図、第２図は従来の半導体発光装置の断
面図、第３図〜第５図は本考案の他の実施例に係
る半導体発光装置の断面図、第６図は第１図の部
分拡大断面図である。
１……発光素子、３……導電性エポキシペース
ト、４……樹脂層、５……外囲器、５ａ……突出
部、６……ボンデイングワイヤ、１１〜１４……
リードフレーム、１１ａ……凹凸部。
FIG. 1 is a sectional view of a semiconductor light emitting device according to an embodiment of the present invention, FIG. 2 is a sectional view of a conventional semiconductor light emitting device, and FIGS. 3 to 5 are semiconductors according to other embodiments of the present invention. A sectional view of the light emitting device, FIG. 6 is a partially enlarged sectional view of FIG. 1. DESCRIPTION OF SYMBOLS 1...Light emitting element, 3...Conductive epoxy paste, 4...Resin layer, 5...Envelope, 5a...Protrusion part, 6...Bonding wire, 11-14...
Lead frame, 11a... uneven portion.
Claims (1)
にマウントされた発光素子と、この発光素子を封
止する透明な樹脂層と、この樹脂層を前記発光素
子の発光面側を除いて囲むとともに、前記リード
フレームと一体成型された外囲器とを具備し、前
記外囲器内のリードフレームをジクザク状又は階
段状にすることを特徴とする半導体発光装置。 (2) 外囲器内のジグザク状又は階段状のリード
フレームの表面が粗面化されていることを特徴と
する実用新案登録請求の範囲第１項記載の半導体
発光装置。[Claims for Utility Model Registration] (1) A lead frame, a light emitting element mounted on the lead frame, a transparent resin layer sealing the light emitting element, and a transparent resin layer sealing the light emitting element on the light emitting surface of the light emitting element. What is claimed is: 1. A semiconductor light emitting device comprising: an envelope surrounding the lead frame except for the sides thereof and integrally molded with the lead frame, the lead frame inside the envelope having a zigzag shape or a stepped shape. (2) The semiconductor light emitting device according to claim 1, wherein the surface of the zigzag or stepped lead frame in the envelope is roughened.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985139996U JPS6247156U (en) | 1985-09-12 | 1985-09-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985139996U JPS6247156U (en) | 1985-09-12 | 1985-09-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6247156U true JPS6247156U (en) | 1987-03-23 |
Family
ID=31046424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985139996U Pending JPS6247156U (en) | 1985-09-12 | 1985-09-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6247156U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7432589B2 (en) | 2006-04-19 | 2008-10-07 | Nichia Corporation | Semiconductor device |
| JP2009170625A (en) * | 2008-01-16 | 2009-07-30 | Toyoda Gosei Co Ltd | Light emitting device |
| EP1928033A3 (en) * | 2006-11-30 | 2010-09-01 | Nichia Corporation | Light-emitting apparatus and method of producing the same |
| JP2011205100A (en) * | 2010-03-25 | 2011-10-13 | Lg Innotek Co Ltd | Light-emitting element package and illumination system equipped with the same |
| JP2012515440A (en) * | 2009-01-14 | 2012-07-05 | クリー ホイチョウ オプト リミテッド | Multiple light emitting device package |
| JP2021027144A (en) * | 2019-08-05 | 2021-02-22 | ローム株式会社 | Semiconductor light-emitting device |
-
1985
- 1985-09-12 JP JP1985139996U patent/JPS6247156U/ja active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7432589B2 (en) | 2006-04-19 | 2008-10-07 | Nichia Corporation | Semiconductor device |
| EP1928033A3 (en) * | 2006-11-30 | 2010-09-01 | Nichia Corporation | Light-emitting apparatus and method of producing the same |
| JP2009170625A (en) * | 2008-01-16 | 2009-07-30 | Toyoda Gosei Co Ltd | Light emitting device |
| JP2012515440A (en) * | 2009-01-14 | 2012-07-05 | クリー ホイチョウ オプト リミテッド | Multiple light emitting device package |
| JP2011205100A (en) * | 2010-03-25 | 2011-10-13 | Lg Innotek Co Ltd | Light-emitting element package and illumination system equipped with the same |
| EP2369652A3 (en) * | 2010-03-25 | 2015-05-06 | LG Innotek Co., Ltd. | Light emitting device package and lighting system having the same |
| JP2021027144A (en) * | 2019-08-05 | 2021-02-22 | ローム株式会社 | Semiconductor light-emitting device |