JPS6343465U - - Google Patents
Info
- Publication number
- JPS6343465U JPS6343465U JP13513786U JP13513786U JPS6343465U JP S6343465 U JPS6343465 U JP S6343465U JP 13513786 U JP13513786 U JP 13513786U JP 13513786 U JP13513786 U JP 13513786U JP S6343465 U JPS6343465 U JP S6343465U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- tip
- led
- led element
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Description
第１図および第２図は本考案に係るＬＥＤラン
プ用リードフレームの構造を示し、第１図はＬＥ
Ｄ素子やワイヤを省略した平面図、第２図は正面
図、第３図は従来のＬＥＤランプ用リードフレー
ムの構造を示す平面図、第４図および第５図はミ
ニモールドＬＥＤランプの製造の一工程を示す縦
断面図である。
１……カソード側リードフレーム、１ａ……先
端部、２……アノード側リードフレーム、２ａ…
…先端部、３……ＬＥＤ素子、４……ワイヤ、５
……樹脂モールド部。
1 and 2 show the structure of a lead frame for an LED lamp according to the present invention, and FIG.
FIG. 2 is a front view, FIG. 3 is a plan view showing the structure of a conventional lead frame for LED lamps, and FIGS. 4 and 5 are diagrams showing the manufacturing process of mini-mold LED lamps. It is a longitudinal cross-sectional view showing one process. DESCRIPTION OF SYMBOLS 1... Cathode side lead frame, 1a... Tip part, 2... Anode side lead frame, 2a...
... Tip part, 3 ... LED element, 4 ... Wire, 5
...Resin mold part.
Claims (1)
フレームと、このＬＥＤ素子と先端部がワイヤで
ボンデイングされた他方のリードフレームとをそ
の先端部同士を対向させて配置し、前記ＬＥＤ素
子および前記ワイヤを含む両リードフレームの先
端部を樹脂で一体的にモールドした構造のＬＥＤ
ランプにおいて、 前記樹脂モールド部の中心を境として一方の側
と他方の側とに二分したとき、二分された樹脂モ
ールド部のそれぞれの側に配置された前記各リー
ドフレームの先端部の面積比が略等しくなされた
ことを特徴とするＬＥＤランプ用リードフレーム
の構造。[Claims for Utility Model Registration] One lead frame with an LED element mounted on its tip and the other lead frame with the LED element and the tip bonded with wire are arranged with their tips facing each other. and an LED having a structure in which the tips of both lead frames including the LED element and the wire are integrally molded with resin.
In the lamp, when the resin molded part is divided into two sides with the center as a border, one side and the other side, the area ratio of the tip of each lead frame arranged on each side of the divided resin molded part is A structure of a lead frame for an LED lamp, characterized in that the lead frame is made substantially equal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13513786U JP2524774Y2 (en) | 1986-09-03 | 1986-09-03 | LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13513786U JP2524774Y2 (en) | 1986-09-03 | 1986-09-03 | LED lamp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6343465U true JPS6343465U (en) | 1988-03-23 |
| JP2524774Y2 JP2524774Y2 (en) | 1997-02-05 |
Family
ID=31037031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13513786U Expired - Lifetime JP2524774Y2 (en) | 1986-09-03 | 1986-09-03 | LED lamp |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2524774Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0298665U (en) * | 1989-01-25 | 1990-08-06 | ||
| WO2001003184A1 (en) * | 1999-07-02 | 2001-01-11 | Rohm Co., Ltd. | Electronic part |
-
1986
- 1986-09-03 JP JP13513786U patent/JP2524774Y2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0298665U (en) * | 1989-01-25 | 1990-08-06 | ||
| WO2001003184A1 (en) * | 1999-07-02 | 2001-01-11 | Rohm Co., Ltd. | Electronic part |
| KR100633113B1 (en) * | 1999-07-02 | 2006-10-11 | 롬 가부시키가이샤 | Electronic part |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2524774Y2 (en) | 1997-02-05 |