JPH0381655U - - Google Patents

Info

Publication number
JPH0381655U
JPH0381655U JP1989143974U JP14397489U JPH0381655U JP H0381655 U JPH0381655 U JP H0381655U JP 1989143974 U JP1989143974 U JP 1989143974U JP 14397489 U JP14397489 U JP 14397489U JP H0381655 U JPH0381655 U JP H0381655U
Authority
JP
Japan
Prior art keywords
led
lead frame
parallel
lead
resistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989143974U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989143974U priority Critical patent/JPH0381655U/ja
Publication of JPH0381655U publication Critical patent/JPH0381655U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案にかかる抵抗内蔵型ＬＥＤラン
プの一例を示す断面図、第２図は他の例を示す断
面図、第３図はその底面図、第４図および第５図
は従来の抵抗内蔵型ＬＥＤランプの断面図である
。 １０…リードフレーム、２０…ＬＥＤ，３０…
ワイヤリード、４０…導電性プラスチツク、５０
…モールド樹脂。 FIG. 1 is a cross-sectional view showing an example of the resistor built-in LED lamp according to the present invention, FIG. 2 is a cross-sectional view showing another example, FIG. 3 is a bottom view, and FIGS. 4 and 5 are conventional LED lamps. FIG. 2 is a cross-sectional view of a resistor built-in LED lamp. 10... Lead frame, 20... LED, 30...
Wire lead, 40... Conductive plastic, 50
...Mold resin.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ＬＥＤを搭載するリードフレームと、該リード
フレームに並設されて先端がＬＥＤに結線された
リードフレームと、これらのリードフレームに並
設された第三のリードフレームとを有し、ＬＥＤ
を搭載するリードフレームと第三のリードフレー
ムとが、ＬＥＤを包容するモールド樹脂中に埋め
込まれた導電性プラスチツクにて電気的に接続さ
れていることを特徴とする抵抗内蔵型ＬＥＤラン
プ。 It has a lead frame on which an LED is mounted, a lead frame arranged in parallel with the lead frame and whose tip is connected to the LED, and a third lead frame arranged in parallel with these lead frames, and the LED
An LED lamp with a built-in resistor, characterized in that a lead frame on which the LED is mounted and a third lead frame are electrically connected through conductive plastic embedded in a molded resin enclosing the LED.
JP1989143974U 1989-12-12 1989-12-12 Pending JPH0381655U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989143974U JPH0381655U (en) 1989-12-12 1989-12-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989143974U JPH0381655U (en) 1989-12-12 1989-12-12

Publications (1)

Publication Number Publication Date
JPH0381655U true JPH0381655U (en) 1991-08-21

Family

ID=31690720

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989143974U Pending JPH0381655U (en) 1989-12-12 1989-12-12

Country Status (1)

Country Link
JP (1) JPH0381655U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007209586A (en) * 2006-02-10 2007-08-23 Tokuyama Kogyosha:Kk Structure for fixing western style toilet bowl
JP2007287962A (en) * 2006-04-18 2007-11-01 Nichia Chem Ind Ltd Semiconductor light-emitting device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007209586A (en) * 2006-02-10 2007-08-23 Tokuyama Kogyosha:Kk Structure for fixing western style toilet bowl
JP4621603B2 (en) * 2006-02-10 2011-01-26 株式会社徳山工業社 Western-style toilet fixing structure
JP2007287962A (en) * 2006-04-18 2007-11-01 Nichia Chem Ind Ltd Semiconductor light-emitting device

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