JPH0371665U

JPH0371665U -

Info

Publication number: JPH0371665U
Application number: JP1989132801U
Authority: JP
Priority date: 1989-11-15
Filing date: 1989-11-15
Publication date: 1991-07-19
Anticipated expiration: 2004-11-15
Also published as: JPH0726854Y2

Description

[Brief explanation of drawings]

第１図は本考案のＬＥＤ素子の一実施例の正面
図、第２図は同上の光導波路板の斜視図、第３図
は同上の相手部品の一部切欠斜視図、第４図は同
上の相手部品に光導波路板を取り付けた斜視図、
第５図は同上のＬＥＤ素子を取り付けた状態の斜
視図、第６図は第５図の縦断面図、第７図は第５
図の横断面図、第８図は同上の他の実施例の正面
図、第９図は第８図の側面図、第１０図は従来例
の斜視図、第１１図は従来例のＬＥＤ本体の成形
時の斜視図であつて、１……リードフレーム、１
ａ，１ｂ……電極、５……発光チツプ、６……相
手部品、７……位置決め基準部である。 Fig. 1 is a front view of an embodiment of the LED element of the present invention, Fig. 2 is a perspective view of the optical waveguide plate of the same as above, Fig. 3 is a partially cutaway perspective view of a mating part of the same as above, and Fig. 4 is the same as above. A perspective view of an optical waveguide plate attached to a mating part,
Fig. 5 is a perspective view of the same LED element as above attached, Fig. 6 is a vertical cross-sectional view of Fig. 5, and Fig. 7 is the
8 is a front view of another embodiment same as above, FIG. 9 is a side view of FIG. 8, FIG. 10 is a perspective view of the conventional example, and FIG. 11 is the LED main body of the conventional example. It is a perspective view during molding of 1...lead frame, 1
a, 1b... electrode, 5... light emitting chip, 6... mating component, 7... positioning reference part.

Claims

[Scope of utility model registration request]

In a package-type LED element in which a chip mount part in which a light emitting chip is mounted on a lead frame serving as an electrode is molded with resin, the positioning reference part, which serves as a positioning reference when attaching to a mating component or when mounting a light emitting chip, is mounted on the lead frame. LED element provided.