JPS59132640A - Lead frame for semiconductor element - Google Patents
Lead frame for semiconductor elementInfo
- Publication number
- JPS59132640A JPS59132640A JP58007868A JP786883A JPS59132640A JP S59132640 A JPS59132640 A JP S59132640A JP 58007868 A JP58007868 A JP 58007868A JP 786883 A JP786883 A JP 786883A JP S59132640 A JPS59132640 A JP S59132640A
- Authority
- JP
- Japan
- Prior art keywords
- positioning
- lead frame
- parts
- tie bar
- pellet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
Description
【発明の詳細な説明】
この発明は半導体素子用に関し、とくに半導体素子の組
立工程において必要とされる位置決め作業に好適なリー
ドフレームの形状に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to semiconductor devices, and particularly to a lead frame shape suitable for positioning work required in the assembly process of semiconductor devices.
従来、半導体素子用リードフレームを組立工程の各段階
において、リードフレーム上のペレットをこれから搭載
する部分の位番−決めあるいは既に搭載されたペレット
を樹脂封止するときの位置決めは、リードフレームの送
シ棧に設けられた送り穴を用いていた。この場合送シ穴
は位置決めせんとするペレット搭載部あるいはペレット
より離れた場所にあるため、組立機械の位置決め機構に
よっては位置決めピンとのすき間が拡大され易いことや
、機構部の組み合わせによる誤差や、リードフレーム自
身のたわみなどのために位置決めのばらつきが甚だしく
、例えば元素子の如く容器の発光窓もしくは受光窓とペ
レットとの偏心が重要なものにおいては使用に耐えない
場合があった。Conventionally, at each stage of the assembly process of lead frames for semiconductor devices, the positioning of the part of the lead frame on which pellets are to be mounted, or the positioning of the pellets already mounted when sealing them with resin, has been carried out during the transport of the lead frame. A sprocket hole provided in the sill was used. In this case, the feed hole is located away from the pellet mounting part or pellets to be positioned, so depending on the positioning mechanism of the assembly machine, the gap between the positioning pin and the positioning pin is likely to be enlarged, and errors due to the combination of mechanical parts, and lead Due to the deflection of the frame itself, the positioning varies considerably, and it may not be usable in cases where eccentricity between the light-emitting window or the light-receiving window of the container and the pellet is important, such as an element.
従って、この発明の目的は組立工程中に正確に位置決め
できる機栴ヲ有するリードフレームを提供することにあ
る。SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a lead frame having a mechanism that allows accurate positioning during the assembly process.
この発明によれば位置決めしようとするペレット部に近
いリードフレームのタイバ部に位ｔｌめ用凹凸部を設け
たことを特徴とし、組立機械が有する位置決め機構、例
えば位置決め駒がこの凹凸部に組み合わさることによっ
て正確に位置出しすることが容易となる。従って、従来
半導体組立工程中位置決めが離れた個所で行われたこと
による製品の欠陥、例えば発光ダイオードの発光素子部
と封止用プラスチックの外径部との偏心のばらつきは著
しく改善される。According to the present invention, a positioning unevenness is provided on the tie bar portion of the lead frame near the pellet portion to be positioned, and a positioning mechanism of the assembly machine, such as a positioning piece, is assembled with the unevenness. This facilitates accurate positioning. Therefore, product defects caused by conventional positioning performed at separate locations during the semiconductor assembly process, such as eccentricity variations between the light emitting element portion of the light emitting diode and the outer diameter portion of the sealing plastic, are significantly improved.
次にこの発明について図面を参照して説明しよう。第１
図は従来形式のコムタイプリードフレームに発光ダイオ
ードを取り付けた時の平面図で、１は送シ棧（リードフ
レームの連結部）、２は位置決め用の穴、３は素子が完
成した場合電気痛路となるリード、４はリード間を結合
しているタイバ、５は発光素子を搭載するため受は皿状
に変形させた部分、６は発光素子、７は６をもういっほ
うのリードに電気的に結合するための金属細線を夫々示
す。第２図は第１図の正面図である。これに対して第３
図は本発明の一実施例で８は送シ棧（リードフレームの
連結部）、９は位置決め用の穴、１０はリード、１１は
不発明による位置決め用凹凸部を有するタイバ、１２は
素子の受は皿、１３は発光素子、１５は細線を表わす。Next, this invention will be explained with reference to the drawings. 1st
The figure is a plan view of a light-emitting diode attached to a conventional com-type lead frame. 1 is the feeder (connecting part of the lead frame), 2 is the hole for positioning, and 3 is the electric pain point when the element is completed. 4 is a tie bar that connects the leads, 5 is a plate-shaped receiver for mounting a light emitting element, 6 is a light emitting element, and 7 is an electrical connection between 6 and the other lead. The thin metal wires used for bonding are shown in each case. FIG. 2 is a front view of FIG. 1. In contrast, the third
The figure shows one embodiment of the present invention, where 8 is a feeder rod (connecting portion of a lead frame), 9 is a hole for positioning, 10 is a lead, 11 is a tie bar having an uneven part for positioning according to the invention, and 12 is a tie bar for an element. The receiver is a plate, 13 is a light emitting element, and 15 is a thin wire.
又、第４図、第５図は不発明の夫々他の実施例について
位置決め用凹凸部を有するタイバ部のみを取シ出して示
した平面図で、１６と２０は送シ棧、１７と２１は位置
決め用の穴、１８と２２は素子のリード、１９と２３は
位置決め用凹凸部を有するタイバである。Further, FIGS. 4 and 5 are plan views showing only the tie bar portions having the uneven portions for positioning of other embodiments of the invention, in which 16 and 20 are feed rods, 17 and 21 18 and 22 are element leads, and 19 and 23 are tie bars having concave and convex portions for positioning.
第６図は従来形式の発光ダイオード用のリードフレーム
が生産工程の一つであるプラスチック材料による封止工
程で治具に装着されている状態の断面側面図を示し、２
４はリードフレーム２７を封止治具２６に密着して接触
せしめるためのスプリングクランプ、２５は位置決め用
のピン、２８は液状プラスチックを注入し、その後で固
化させる鋳型のキャビティ一部、２９は位置決め用の駒
、３０は発光素子をそれぞれ示す。第７図は第６図の段
取シを正面から見た図で、３１＃′ｉタイバを表わす。FIG. 6 shows a cross-sectional side view of a conventional lead frame for a light emitting diode attached to a jig in a plastic material sealing process, which is one of the production processes.
4 is a spring clamp for tightly contacting the lead frame 27 with the sealing jig 26; 25 is a positioning pin; 28 is a part of the mold cavity into which liquid plastic is injected and then solidified; 29 is a positioning pin The pieces 30 each represent a light emitting element. FIG. 7 is a front view of the setup shown in FIG. 6, and shows the tie bar 31#'i.
第８図および第９図は第３図に示す本発明の一実施例を
第６図、第７図と同様プラスチックによる封止工程の段
取シに適用したもので、第８図は断面側面図で３２はス
プリングクランプ、３３は位置決め用のピン、３４は封
止治具本体、３５はリードフレーム、３６は鋳型に設け
られたキャビティー、３７は第３図の凹凸部に適合する
位置決め用の駒、３８は発光素子である。第９図は第８
図の正面図、３９はＶ字形の位置決め形状をしたタイバ
を示す。8 and 9 show the embodiment of the present invention shown in FIG. 3 applied to the setup of the sealing process using plastic, similar to FIGS. 6 and 7. In the figure, 32 is a spring clamp, 33 is a positioning pin, 34 is a sealing jig body, 35 is a lead frame, 36 is a cavity provided in the mold, and 37 is a positioning pin that fits the uneven part in Figure 3. The piece 38 is a light emitting element. Figure 9 is the 8th
In the front view of the figure, 39 shows a tie bar having a V-shaped positioning shape.
今、第１図および第２図に示した従来の組立中の発光ダ
イオードの中間製品では、発光素子６の位置を正確に位
置決めしたい場合、通常送シ棧１に規則正しく穿孔され
た位置決め穴２を基準として組立機構との相対位置を求
めなければならない。Now, in the conventional intermediate product of light emitting diodes being assembled as shown in FIGS. The relative position to the assembly mechanism must be determined as a reference.
例えば５，６，７およびその周辺をプラスチック材料に
て被覆する第６図、第７図に示した工程の場合、封止治
具２６に対しては位置決めピン２５を送シ穴に挿入して
発光素子３０をキャビティ２８内に位置決めする構成に
なっているが、タイバ３１は第７図において明らかな如
く、左右に拘束がないため封止後の製品の外径と発光素
子の偏シが発生する。また、ピン２５は送シ穴よシ小さ
な径でなければならないから、その径の差によっても必
然的に偏心誤差が生じる。For example, in the case of the process shown in FIGS. 6 and 7 in which 5, 6, 7 and their surroundings are covered with a plastic material, the positioning pin 25 is inserted into the feed hole for the sealing jig 26. Although the structure is such that the light emitting element 30 is positioned within the cavity 28, as is clear from FIG. 7, the tie bars 31 are not restrained from side to side, so that the outer diameter of the product and the light emitting element after sealing are uneven. do. Further, since the pin 25 must have a diameter smaller than that of the feed hole, the difference in diameter inevitably causes an eccentricity error.
これに対して第３図に示す不発明の第１の実施例によれ
ば、上述した従来形式のリードフレームの欠陥をタイバ
部が図に見られる如くＶ字形状に５−
正しい位置で切シ込まれているので、組立機構側の位置
決めのだめの突起にこれを合わせることによって、従来
拘束されていなかった左右方向のズレがなくなシ、正し
く位置決めすることができる。On the other hand, according to the first embodiment of the invention shown in FIG. 3, the defect in the conventional lead frame described above can be removed by cutting the tie bar part into a V-shape at the correct position as shown in the figure. By aligning this with the positioning protrusion on the assembly mechanism side, there is no left-right displacement that was previously unrestricted, and correct positioning can be achieved.
この状態を同じプラスチック封止工程において図示した
ものが、第８図および第９図である。即ち、従来方式と
同様封止治具３４に装着されたリードフレーム３５のタ
イバ部は、そのＶ字形の形状部に治具の位置決め駒部が
正しく嵌合され、位置決めピン３２とともにペレット３
８の左右方向の偏シヲ充分拘束している。FIGS. 8 and 9 illustrate this state in the same plastic sealing process. That is, as in the conventional method, the tie bar portion of the lead frame 35 attached to the sealing jig 34 has a V-shaped portion with which the positioning piece of the jig is correctly fitted, and the pellet 3 is attached together with the positioning pin 32.
8 is sufficiently restrained in the horizontal direction.
第４図に示した第２の実施例および第５図に示した第３
の実施例も第３図の場合と同様それぞれの形状に合った
位置合わせの駒を使用して、ペレット部を正しく位置決
めすることが可能である０以上はコムタイプリードフレ
ームに搭載された発光ダイオードを封止工程において正
しく位置せしむるのに不発明が有用であることを述べた
ものだが、一般的にコムタイプリードフレームを使用す
る半導体素子の各組み立て工程においてもペレ６−
ット’を正しく位置決めしようとする場合には同様に有
効である。The second embodiment shown in FIG. 4 and the third embodiment shown in FIG.
In this embodiment, as in the case of Fig. 3, it is possible to correctly position the pellet part by using positioning pieces that match each shape. Although it was stated that the invention is useful for correctly positioning pellets in the sealing process, it is also generally useful to place pellets in each assembly process of semiconductor devices that use com-type lead frames. It is similarly effective when attempting to position correctly.
以上述べた如く不発明はコムタイプリードフレームのタ
イバ部に特に位置決めに適した凹凸形状を設け、ペレッ
ト搭載部あるいはペレット部の位置決め全正確に且つ容
易に行なうことが可能となる。なお、コムタイプリード
フレーム以外の他のリードフレームのタイバ部に不発明
を適用してもよい。As described above, the present invention provides the tie bar portion of the com-type lead frame with an uneven shape particularly suitable for positioning, thereby making it possible to accurately and easily position the pellet mounting portion or the pellet portion. Note that the invention may be applied to tie bar portions of lead frames other than the com-type lead frame.
第１図は従来形式のコムタイプリードフレームに発光ダ
イオード素子を組み込み細線で結合した組立中間製品の
平面図、第２図はその正面図、第３図は本発明の第１の
実施例、第４．第５図はそれぞれ第２．第３の実施例の
平面図を示す。又、第６図は第１図に例示したものをプ
ラスチック封止工程に適用せしめた段取シの断面側面図
、第７図はその正面図全それぞれ示す０第８図は不発明
の第１の実施例全プラスチックス封止工程に適用せしめ
た段取シの断面側面図、第９図はその正面図をそれぞれ
示す。
１．８，１６．２０・・・・・・送シ機、２，９．１７
．２１・・・・・・送部穴、３，１０，１８，２２．２
７．３５ トリード、４．１１，３１．３９・・・・・
・タイバ部、５．１２・・・・、受は皿、６，１３，３
０．３８・・・・・・ベレット、７．１５・旧・・金属
細線、１４，１９，２３．３９・・・・位置決め用凹凸
部、２６．３４・・・・・・治具、２９．３７・・ ・
位置決め用駒、２８．３６・・・・・キャビティ。Fig. 1 is a plan view of an assembled intermediate product in which a light emitting diode element is incorporated into a conventional com-type lead frame and connected with thin wires, Fig. 2 is a front view thereof, and Fig. 3 is a first embodiment of the present invention. 4. Figure 5 shows the second. A plan view of a third embodiment is shown. 6 is a cross-sectional side view of the setup shown in FIG. 1 applied to the plastic sealing process, and FIG. 7 is a full front view thereof. FIG. 8 is the uninvented first step. FIG. 9 shows a cross-sectional side view and a front view of a setup system applied to the all-plastics sealing process of this embodiment. 1.8, 16.20...Feeder, 2,9.17
．． 21...Feeding hole, 3, 10, 18, 22.2
7.35 Toledo, 4.11, 31.39...
・Tie bar part, 5.12..., catch is plate, 6, 13, 3
0.38...Bellet, 7.15.Old...Metal thin wire, 14,19,23.39...Positioning uneven part, 26.34...Jig, 29 .37... ・
Positioning piece, 28.36...Cavity.
Claims (1)
る半導体素子用リードフレーム。A lead frame for a semiconductor element, characterized in that a tie bar portion is provided with an uneven portion for positioning.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58007868A JPS59132640A (en) | 1983-01-20 | 1983-01-20 | Lead frame for semiconductor element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58007868A JPS59132640A (en) | 1983-01-20 | 1983-01-20 | Lead frame for semiconductor element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59132640A true JPS59132640A (en) | 1984-07-30 |
| JPH0151060B2 JPH0151060B2 (en) | 1989-11-01 |
Family
ID=11677612
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58007868A Granted JPS59132640A (en) | 1983-01-20 | 1983-01-20 | Lead frame for semiconductor element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59132640A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0371665U (en) * | 1989-11-15 | 1991-07-19 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5052974A (en) * | 1973-09-07 | 1975-05-10 | ||
| JPS5270767A (en) * | 1975-12-10 | 1977-06-13 | Toshiba Corp | Manufacture of semiconductor device |
| JPS55146951A (en) * | 1979-05-02 | 1980-11-15 | Hitachi Ltd | Lead frame |
-
1983
- 1983-01-20 JP JP58007868A patent/JPS59132640A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5052974A (en) * | 1973-09-07 | 1975-05-10 | ||
| JPS5270767A (en) * | 1975-12-10 | 1977-06-13 | Toshiba Corp | Manufacture of semiconductor device |
| JPS55146951A (en) * | 1979-05-02 | 1980-11-15 | Hitachi Ltd | Lead frame |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0371665U (en) * | 1989-11-15 | 1991-07-19 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0151060B2 (en) | 1989-11-01 |
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