JPH09199656A - Manufacture of semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a foreign object from being adhered and carrying from being interfered in a resin sealing process and to improve dimension accuracy when manufacturing a semiconductor device where a lead terminal is guided externally from the two side surfaces of a package by sealing a semiconductor element on a lead frame with a resin package. SOLUTION: A semiconductor element 8 is mounted on a stage 2 of a lead frame 1 with a pair of cradles 4 and 4' formed in band shape at both sides, a stage 2 which is supported by a stage support being exposed from them, and a plurality of lead terminals 3 which is supported by the cradles 4 and 4' where an open edge is located at a stage periphery part. The electrode of the element 8 and the open edge of the lead terminal 3 are electrically connected, the element 8 and the open edge of the terminal 3 and one portion of the above pair of cradles are covered, and at the same time a resin package 10 is formed so that a connection part to the cradle of a stage support rod 5 can be exposed, the exposed rod 5 and the support rod of the lead terminal 3 are cut and eliminated so that the package can be supported by the cradle, and the cradle is pulled in horizontal direction, thus obtaining the element.

Description

Detailed Description of the Invention

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a semiconductor device, and more particularly, a semiconductor device in which a semiconductor element on a lead frame is sealed with a resin package and lead terminals are led out from two side surfaces of the resin package. The present invention relates to a method of manufacturing a device. In the above-mentioned semiconductor device, in order to suppress a transportation obstacle, etc.
It is necessary to prevent the occurrence of resin burr on the side surface.

2. Description of the Related Art FIG. 6 is a plan view of a lead frame for explaining a conventional method of manufacturing a semiconductor device.
6A shows the lead frame before the molding process, and FIG. 6B shows the lead frame after the molding process. The lead frame 51 is formed by pressing or etching a metal sheet. As shown in FIG. 6A, the lead frame 51 includes a pair of cradle 54, 54 ′ and a cradle 5.
4, 54 'includes a stage 52 supported by a support bar 55, and a plurality of lead terminals 53 extending around the stage 52. The manufacturing of semiconductor devices begins with
The semiconductor element 58 is mounted on the stage 52 of the lead frame 51 via an adhesive such as silver paste, and
The wire of the electrode of the semiconductor element 58 and the lead terminal 53
9 for electrical connection. Next, the semiconductor element 58 is sealed with resin. FIG. 7 shows a perspective view of a molding die used for resin sealing. As shown in FIG. 7, the molding die is composed of upper and lower dies 63 and 64 each having a cavity 65 facing each other, and a molten resin is injected with the lead frame 51 set therebetween. The resin is filled in the cavity 65 via the pot 66 of the upper mold 63, the runner 67 of the lower mold 64, and the guide path such as the gate 68. FIG. 6B shows the lead frame 51 taken out from the mold after resin sealing,
A portion including the semiconductor element 58 is covered with a resin package 60. The cavity 65 of the molding die includes all the semiconductor elements 58 mounted on the lead frame 51 to be set, and the end portion of the lead terminal 53 on the stage 52 side with respect to the longitudinal direction of the lead frame 51 is in the lateral direction. Is provided so as to include a space between the cradle 54, 54 'and the outer lead terminal 53. After the resin sealing, as can be seen from FIG. 6B, the cradle side of the resin package 60. The side of is the credor 54, 54 '
And the lead terminal 53. That is,
A gap is provided between the cradle 54, 54 'and the resin package 60, and the resin package 60 and the cradle 54, 54' are easily separated by cutting only the narrow stage support bar 55 located at the center. can do. At the same time that the stage support bar 55 is cut, other unnecessary parts such as the cradle support bar 56 that connects the lead terminals 53 are also cut. Finally, the lead terminals 53 are bent to form a semiconductor device. To complete.

Conventionally, since it has been premised that an electrical test is performed after a semiconductor device is completed, the cradle and the resin package are separated by cutting the stage support bar as described above. I'm trying to do it alone. Therefore, there is a gap between the resin package excluding the stage support bar and the cradle.
For this reason, when the resin is sealed, the resin oozes out of the molding die into the gap to generate a resin burr. In the subsequent process, the resin burr on the cradle side may cause foreign matter to adhere to the conveyance path, obstruction of conveyance in the mold, and lead deformation. In addition, it also causes a decrease in dimensional accuracy. It is conceivable to remove the resin burr after the completion of the semiconductor device, but it requires a great deal of labor such as relying on manual work. It is an object of the present invention to provide a semiconductor device that solves the above-mentioned problems by preventing foreign matter from adhering to the device, obstructing conveyance, and improving dimensional accuracy.

According to the present invention for solving the above problems, a semiconductor element is sealed in a resin package, and lead terminals electrically connected to the semiconductor element are opposed to the resin package. In the method for manufacturing a semiconductor device which is led out from the two side surfaces, a pair of cradle 4, 4 ′ is formed on both sides in a belt shape, and a stage support bar 5 is led out from the pair of cradle 4, 4 ′. The supported stage 2 and the cradle 4,
Mounting the semiconductor element 8 on the stage 2 of a lead frame 1 having a plurality of lead terminals 3 supported by 4'and having open ends located in the peripheral portion of the stage 2;
Electrically connecting the electrode of the semiconductor element 8 and the open end of the lead terminal 3, the semiconductor element 8, the open end of the lead terminal 3, and the pair of cradle 4, 4 '.
A step of forming a resin package (10) so as to cover a part of each of them and to expose the connection part of the stage support bar 5 with the cradle 4, 4 ', the stage support bar 5 exposed from the resin package 10, And a step of bringing the resin package 10 into a state of being supported by the pair of cradle 4, 4 ′ by cutting and removing the support bar supporting the lead terminal 3, the cradle 4, 4 ′ being removed from the resin package 10. It is characterized in that the steps of obtaining a single semiconductor device by sequentially pulling it out are sequentially carried out. According to the method for manufacturing a semiconductor device of the present invention described above, only a part of the stage support 5 of the lead frame 1 is exposed, and the pair of cradle 4, 4.
Since the resin package 10 is formed so as to overlap 4 ', there is no gap in which the resin exudes in the molding die used for resin sealing, and it is possible to prevent the occurrence of resin burrs during resin sealing. Become.

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will now be described in detail with reference to the drawings. 1 is a plan view of a lead frame for explaining a first embodiment of the present invention.
1A shows the lead frame before resin sealing, and FIG. 1B shows the lead frame after resin sealing. First, a lead frame 1 having a predetermined shape is obtained by subjecting a strip-shaped metal sheet to etching or pressing. As shown in FIG. 1 (a), the lead frame 1 of this embodiment has credors 4 on both sides.
4'is provided with notches 7 in a part of the cradle 4, 4'on both sides, and the stage 2 is supported via a stage support bar 5 led out from the notches 7. The cradle support bar 6 connects the cradle 4, 4 ′ on both sides, and a plurality of lead terminals 3 supported by the cradle 4, 4 ′ and having open ends extending to the peripheral portion of the stage 2. Next, the semiconductor element 8 is mounted on the stage 2 of the lead frame 1 via an adhesive such as silver paste, and the electrode of the semiconductor element 8 and the open end of the lead terminal 3 are electrically connected by a wire 9. Connecting. FIG. 1A shows this state. As described above, the lead frame 1 in which the semiconductor element 8 is mounted
Is set in a mold including upper and lower molds for resin sealing. (See FIG. 7) In the lead frame 1 of the present embodiment, the notch 7 is provided in the portion where the stage support bar 5 of the cradle 4, 4'is led out as described above, and the lead frame 1 is set in the molding die. In the state, the cavity of the molding die is configured such that the inner wall thereof is located at the portion that crosses the notch 7. That is, for parts other than the notch 7, the credor 4,
The inner wall of the cavity is located at a portion overlapping 4 '. Therefore, in a state where the lead frame 1 is taken out from the molding die after the cavity is filled with the resin, as shown in FIG.
As shown in FIG.
It is formed so as to cover a part of 4 '. According to the present embodiment, since the semiconductor package 8 is sealed with the resin package 10 covering a part of the cradle 4, 4 ', no gap is generated between the upper and lower molds in this part, and the mold is molded. No resin bleeding occurs in the process. At the notch 7 portion of the credor 4, 4 ', a gap is formed between the upper and lower molds, but as shown by a gate mark 11 in FIG. Since the gap is a narrow range at the distant positions, the exudation of the resin can be suppressed. The state after this resin sealing is further clarified by the sectional view shown in FIG. FIG.
1B is a cross-sectional view taken along the line AB of FIG. 1B, in which the lead terminals 3 are embedded inside the resin package 10 and a part of the cradle 4, 4 ′ on both sides is covered with the resin package 10. You can see that From this state, the stage support bar 5 exposed from the resin package 10 and the support bar supporting the lead terminals 3 are cut and removed. FIG. 3 is a plan view of the lead frame with the stage support bar 5 and the like cut off as described above.
A plurality of semiconductor devices are electrically connected to each other by the resin package 10 being supported by the cradle 4, 4'on both sides. In this state, a plurality of semiconductor devices are connected, but they are electrically independent of each other,
It is possible to carry out the electrical test as it is. In this embodiment, as shown in FIG. 3, the lead frame 1 to which a plurality of semiconductor devices are connected is conveyed to a measuring device, and the lead terminal 3 is directly contacted with a probe pin or the like for making an electrical test to carry out the test. carry out. As described above, since the test process can be performed in the coupled state of the semiconductor devices, the transfer to the measuring device and the handling in the test process can be facilitated, and the deformation of the lead terminals can be prevented. Further, for a defective product as a result of the test, subsequent lead terminal bending processing can be omitted. After the above test process is completed, the cradle 4, 4 ′ on both sides is pulled out horizontally from the resin package 10 using a jig or an automatic device to be a single body, and the lead terminal 3 is bent to form a semiconductor. Complete the device. In addition, Credor 4,
The portion of the 4'covered by the resin package 10 is preliminarily subjected to plating treatment or taper processing in order to weaken the adhesion with the resin. In this embodiment, the lead terminals are bent after the cradle 4, 4 ′ is pulled out from the resin package 10. However, it is also possible to perform it while the resin package 10 is supported by the cradle 4, 4 ′. . FIG. 4 is a cross-sectional view for explaining a modified example of the resin package shape according to the present invention. In the semiconductor device according to the first embodiment described above, the resin package is configured to overlap the front and back sides of the cradle (see FIG. 2), but a large force is required when pulling out the cradle from the resin package.
Further, when the semiconductor devices that are made into a single body are sequentially conveyed, there is a possibility that the concavities after the cradle of the adjacent semiconductor devices are pulled out may be inserted into each other on the conveyance path to cause a conveyance jam. Therefore, as shown in FIG. 4A, the resin package 20 is overlapped only on the front side of the cradle 14, 14 ′, and the back side is the open portion 15. With such a structure, the resin package 20 and the cradle 14,
It is easy to separate from 14 ', and since there is no recess,
There is no conveyance clogging due to adjacent semiconductor devices. still,
The same effect can be obtained even if the resin package is overlapped only on the back side of the credor. FIG. 4B shows another configuration for preventing transport clogging when transporting a single semiconductor device in a row. In this example, the resin package 30
Is a structure that overlaps on both sides of the credor,
Vertical part 26 under the recess 25 after the cradle is pulled out
Therefore, the concave portions 25 of the adjacent semiconductor devices do not enter each other when being transported on the transport path 27 as indicated by the arrow, and the transport clogging on the transport path 27 can be prevented. 5A and 5B are plan views of a lead frame for explaining a second embodiment of the present invention. FIG. 5A shows the lead frame before resin sealing and FIG. 5B shows the lead frame after resin sealing. There is. First, as in the first embodiment, a lead frame 31 having a predetermined shape is obtained by subjecting a strip-shaped metal sheet to etching or pressing. As shown in FIG. 5A, the lead frame 1 of this embodiment has cradle 34, 34 'on both sides.
The stage 32 is supported via the stage support bar 35 derived from the above. Also, credor 3 on both sides
The cradle support bar 36 connects the credes 34 and 34 ′, and the lead terminals 33 supported by the cradle 34 and 34 ′ and having open ends extending to the periphery of the stage 32. Next, the semiconductor element 38 is mounted on the stage 32 of the lead frame 31 via an adhesive such as silver paste, and the electrode of the semiconductor element 38 and the open end of the lead terminal 33 are electrically connected by a wire 39. Connecting. FIG. 5A shows this state. As described above, the lead frame 31 on which the semiconductor element 38 is mounted is
It is set in a mold composed of upper and lower molds for resin sealing. (Refer to FIG. 7 for the mold die) In this embodiment, the cavity of the mold die overlaps the cradle 34, 34 'and has a notch for escaping the portion where the stage support bar 35 is led out. Therefore, the state shown in FIG. 5B is obtained after the resin sealing. That is, in the first embodiment, the notch is provided on the lead frame side, whereas in the present embodiment, the notch 41 for exposing the lead-out portion of the stage support bar 35 is provided on the resin package 40 side. Also in this embodiment, the resin package 40
Seals the semiconductor element 38 in such a manner as to cover a part of the cradle 34, 34 ', so that no gap is generated between the upper and lower molds in this part, and resin seepage does not occur in the molding process. Absent. After that, resin package 4
The stage support bar 35 exposed from 0 and the support bar supporting the lead terminals 33 and the like are cut and removed, and the credors 34, 34 'remaining on both sides are finally removed by a resin package 40 using a jig or an automatic device. The semiconductor device is completed by further pulling it out into a single body and bending the lead terminal 33. Also in this embodiment, as in the first embodiment, it is possible to perform an electrical test in a state in which a plurality of semiconductor devices before the cradle 34, 34 ′ is separated from the resin package 40 are connected.

According to the method of manufacturing a semiconductor device according to the present invention described above, it is possible to prevent resin burrs from being generated in the package portion during resin sealing, and to prevent foreign matter from adhering during conveyance, conveyance trouble in the mold, and leads. It is possible to suppress the occurrence of deformation and the like, and further the deterioration of dimensional accuracy. Further, since the test process can be performed in a state where a plurality of semiconductor devices are connected to the lead frame, the handling can be simplified and the lead terminal deformation can be prevented.

[Brief description of drawings]

FIG. 1 is a plan view (1) of a lead frame for explaining a first embodiment of the present invention.

FIG. 2 is a sectional view of a lead frame for explaining the first embodiment of the present invention.

FIG. 3 is a plan view (2) of a lead frame for explaining the first embodiment of the present invention.

FIG. 4 is a diagram for explaining a modified example of the resin package shape according to the present invention.

FIG. 5 is a plan view of a lead frame for explaining a second embodiment of the present invention.

FIG. 6 is a plan view of a lead frame for explaining a conventional technique.

FIG. 7 is a perspective view for explaining a molding (resin sealing) step.

Claims (4)

[Claims] 1. A method of manufacturing a semiconductor device, wherein a semiconductor element is sealed in a resin package, and lead terminals electrically connected to the semiconductor element are led out from two opposite side surfaces of the resin package. A pair of credors (4
4 '), a stage (2) supported by a stage support bar (5) respectively derived from the pair of cradle (4, 4'), and an open end supported by the cradle (4, 4 '). Mounting a semiconductor element (8) on the stage (2) of a lead frame (1) having a plurality of lead terminals (3) located on the periphery of the stage (2); 8) Electrically connecting the electrode and the open end of the lead terminal (3), the semiconductor element (8), the open end of the lead terminal (3), and the pair of cradle (4, 4) Forming a resin package (10) so as to cover a part of each of the ') and expose a connecting portion of the stage support bar (5) with the cradle (4, 4'), the resin package (10) Stay exposed from Cutting and removing the support bar (5) and the support bar supporting the lead terminals (3) to bring the resin package (10) to the pair of cradle (4, 4 '). The credor (4, 4 ') is attached to the resin package (1
A method for manufacturing a semiconductor device, which comprises sequentially performing a step of obtaining a single semiconductor device by pulling it out from 0) in the horizontal direction. 2. A stage exposed from a resin package (10) by providing a notch (7) at a connecting portion of the cradle (4, 4 ′) of the lead frame (1) with a stage support bar (5). Support bar (5)
The method of manufacturing a semiconductor device according to claim 1, wherein: 3. The method of manufacturing a semiconductor device according to claim 1, wherein a notch is provided in the resin package to obtain a stage support bar exposed from the resin package. 4. The method according to claim 1, further comprising a step of performing an electrical measurement in a state where the resin package (10) is supported by the cradle (4, 4 ′) of the lead frame (1). A method for manufacturing a semiconductor device as described above.