JPH06283642A - Method for bending outer lead and semiconductor device using the lead - Google Patents
Method for bending outer lead and semiconductor device using the leadInfo
- Publication number
- JPH06283642A JPH06283642A JP6664493A JP6664493A JPH06283642A JP H06283642 A JPH06283642 A JP H06283642A JP 6664493 A JP6664493 A JP 6664493A JP 6664493 A JP6664493 A JP 6664493A JP H06283642 A JPH06283642 A JP H06283642A
- Authority
- JP
- Japan
- Prior art keywords
- bending
- lead
- dam bar
- bent
- outer lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は半導体装置の製造に利用
されるアウターリードの曲げ成形方法及びこれを用いた
半導体装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of bending an outer lead used for manufacturing a semiconductor device and a semiconductor device using the same.
【０００２】[0002]
【従来の技術】樹脂モールドタイプの半導体装置は、樹
脂モールド後にダムバーの内側部分に残ったレジンを除
去し、ダムバーカットを行った後、アウターリードを所
定形状に曲げ成形して製品とする。図６は樹脂モールド
後にレジン落としおよびダムバーカットを行った状態を
示す。レジン落とし、ダムバーカットは櫛刃状のパンチ
を使用して行うが、加工精度上からアウターリード１０
はダムバー部分でわずかに広幅になり、レジン落とし後
もリードの側面にレジンかすが付着して残留する。2. Description of the Related Art A resin mold type semiconductor device is manufactured by removing the resin remaining inside the dam bar after resin molding, cutting the dam bar, and then bending the outer leads into a predetermined shape. FIG. 6 shows a state in which resin removal and dam bar cutting are performed after resin molding. Resin combing and dam bar cutting are performed using a comb-shaped punch, but the outer lead 10
Becomes slightly wider at the dam bar portion, and resin dust remains on the side surfaces of the leads even after the resin is removed.
【０００３】アウターリード１０はその基部位置で曲げ
成形するが、図６のようにダムバーカットした部分が若
干広幅になることから、このダムバー位置にリード曲げ
位置がかかるとダムバーの両端に応力が集中し、両端部
分に段がついてきれいなアール形状に曲げることができ
ない。そこで、リード曲げ位置にダムバー位置がかから
ないようダムバーをリードの基部から離した位置に設定
することが行われている。この方法によれば、図５に示
すようにリード曲げ後のダムバー１２の位置はパッケー
ジの側面と平行になる直線部分にくるから精度のよいア
ール曲げが可能である。The outer lead 10 is bent and formed at its base position. However, as shown in FIG. 6, the dam bar cut portion is slightly wider. Therefore, when the lead bending position is applied to this dam bar position, stress is applied to both ends of the dam bar. It cannot be bent into a rounded shape because it is concentrated and has steps on both ends. Therefore, the dam bar is set at a position apart from the base of the lead so that the dam bending position does not reach the lead bending position. According to this method, as shown in FIG. 5, the position of the dam bar 12 after lead bending comes to a straight line portion which is parallel to the side surface of the package, and therefore accurate radius bending is possible.
【０００４】[0004]
【発明が解決しようとする課題】ところが、ダムバー１
２の位置をリードの基部位置よりも離すようにするとリ
ードに付着して残留するレジンの量が増えるとともにリ
ード側面からレジンが剥離しやすくなる。これはレジン
落としした後、残留レジンを除去する処理をせずに引き
続いてリード曲げ加工を施すためで、リード曲げの際に
レジン１４部分も曲げられるため剥離しやすくなり、剥
離したレジンは曲げダイ上に落下して打こんを生じさせ
る。DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention
If the position 2 is separated from the base position of the lead, the amount of the resin that remains attached to the lead increases, and the resin easily peels off from the side surface of the lead. This is because after the resin is removed, the lead bending process is performed without removing the residual resin. The resin 14 portion is also bent during the lead bending, so that the resin is easily peeled off. It drops on top and causes hammering.
【０００５】このため、レジン１４の剥離や落下を防止
する方法として、上記例とは逆に図４に示すようにダム
バー１２の位置をアウターリード１０の基部にできるだ
け近づけ、ダムバー位置の外側でリード曲げするように
することが行われるようになってきた。しかしながら、
実装スペースの関係上アウターリード１０を側方に張り
出すことは適当ではなく、はんだ接合部として所要の接
合面積を確保するためにはリードの基部にできるだけ近
い位置で曲げ成形することが求められる。このため、こ
の方法の場合はリードを曲げる際にできるだけ直角に近
い形状で曲げることになる。この結果、めっき割れやリ
ードの母材割れが生じて製品不良がおきやすく、製品形
状にばらつきが生じやすいといった問題点があった。Therefore, as a method of preventing the resin 14 from peeling off or dropping, the position of the dam bar 12 is brought as close as possible to the base of the outer lead 10 as shown in FIG. Bending has come to be done. However,
Due to the mounting space, it is not appropriate to project the outer lead 10 laterally, and in order to secure a required joint area as a solder joint, it is required to bend the outer lead 10 as close as possible to the base of the lead. Therefore, in the case of this method, when the lead is bent, the lead is bent in a shape as close to a right angle as possible. As a result, there is a problem that product defects easily occur due to plating cracks and lead base material cracks, and product shapes easily vary.
【０００６】本発明は、このようなリードを曲げ成形し
て製品とする半導体装置でのリード曲げにおける問題点
を解消すべくなされたものであり、その目的とするとこ
ろは、リード曲げの際にめっき割れやリードの母材割れ
を生じさせずに成形することができ、リードの曲げ精度
の高い製品として得ることができる半導体装置における
アウターリードの曲げ成形方法及びこれを用いた半導体
装置を提供しようとするものである。The present invention has been made in order to solve the problem in lead bending in a semiconductor device in which such a lead is bent and formed into a product, and the purpose thereof is to bend the lead. (EN) Provided are a method for bending an outer lead in a semiconductor device, which can be formed without causing plating cracks or lead base material cracks, and which can be obtained as a product with high lead bending accuracy, and a semiconductor device using the same. It is what
【０００７】[0007]
【課題を解決するための手段】本発明は上記目的を達成
するため次の構成を備える。すなわち、樹脂モールド後
にレジン落とし、ダムバーカットを行った後、アウター
リードを所定形状に曲げ成形するアウターリードの曲げ
成形方法において、前記アウターリードの肩部にダムバ
ー位置を設定するとともに、該ダムバー位置を挟む両側
に各々リードの曲げ位置を設定してリードを曲げ成形す
ることを特徴とする。また、樹脂モールド後にアウター
リードを所定形状に曲げ成形して成る半導体装置におい
て、前記曲げ成形されたアウターリードの肩部にダムバ
ー位置が設定され、該ダムバー位置を挟む両側に各々リ
ードの曲げ位置を設定してリードが曲げ成形されたこと
を特徴とする。The present invention has the following constitution in order to achieve the above object. That is, in the outer lead bending method of resin-molding and dam bar cutting after resin molding, and then bending the outer leads into a predetermined shape, a dam bar position is set on the shoulder portion of the outer lead and the dam bar position is set. It is characterized in that the bending position of each lead is set on both sides sandwiching and the lead is bent and formed. Further, in a semiconductor device formed by bending outer leads into a predetermined shape after resin molding, a dam bar position is set on a shoulder portion of the bent outer leads, and bending positions of the leads are provided on both sides of the dam bar position. It is characterized in that the lead is bent and set.
【０００８】[0008]
【作用】本発明に係るアウターリードの曲げ成形方法で
は、レジン落とし、ダムバーカットを行った後、アウタ
ーリードを曲げ成形する際に、ダムバー位置を挟む両側
位置に各々リードの曲げ位置を設定して曲げ成形する。
ダムバーを挟む両側で曲げ加工することで各々の曲げ位
置での曲げ角度を小さく設定することができ、母材割れ
やめっき割れが生じないようにして曲げ加工することが
できる。また、アウターリードの肩部をダムバー位置を
挟んで曲げ成形することによって曲げ精度の高い半導体
装置として提供される。In the bending method of the outer lead according to the present invention, after the resin is dropped and the dam bar is cut, when the outer lead is bent, the bending positions of the leads are set on both sides of the dam bar position. And bend it.
By performing bending on both sides of the dam bar, the bending angle at each bending position can be set small, and bending can be performed without causing base material cracking or plating cracking. Further, the shoulder portion of the outer lead is bent and formed so as to sandwich the dam bar position, so that a semiconductor device with high bending accuracy is provided.
【０００９】[0009]
【実施例】以下、本発明の好適な実施例を添付図面に基
づいて詳細に説明する。図１は本発明に係る半導体装置
の一実施例の構成を示す説明図である。本実施例の半導
体装置はアウターリード１０をＺ形に曲げ成形する製品
で、リードの肩部分にダムバー１２位置がかかるようダ
ムバー１２の位置を設定し、ダムバー１２を挟む両側に
それぞれ曲げ位置を設定して曲げ加工することを特徴と
する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described in detail below with reference to the accompanying drawings. FIG. 1 is an explanatory diagram showing a configuration of an embodiment of a semiconductor device according to the present invention. The semiconductor device of this embodiment is a product in which the outer lead 10 is bent and formed into a Z shape. The position of the dam bar 12 is set so that the position of the dam bar 12 is placed on the shoulder portion of the lead, and the bending positions are set on both sides sandwiching the dam bar 12. And is bent.
【００１０】図１でＡ部およびＢ部がアウターリード１
０の肩部での曲げ位置を示す。図のようにＡ部とＢ部の
２か所で曲げ成形することで、Ａ部とＢ部での曲げ角度
をかなりゆるやかに設定できるからリード曲げの際にリ
ードの母材やリードのめっき被膜に及ぼす悪影響を小さ
くして曲げ成形できるという利点がある。図のようにＡ
部での曲げ角度をθ1 、Ｂ部での曲げ角度をθ2 とする
と、肩部で９０°に曲げるとするとθ1 ＋θ2 ＝９０°
に設定すればよく、Ａ部およびＢ部での曲げ角度は従来
のような１か所で曲げ成形する場合にくらべて半分程度
の曲げ量ですますことができる。In FIG. 1, parts A and B are outer leads 1.
Bending position at 0 shoulder is shown. As shown in the figure, the bending angle at A and B can be set quite gently by bending at A and B at two points. Therefore, when the lead is bent, the lead base material and the lead plating film are used. It has an advantage that it can be bent and formed with a small adverse effect on. A as shown
If the bending angle at the portion is θ 1 and the bending angle at the portion B is θ 2 , then bending at 90 ° at the shoulder portion θ 1 + θ 2 = 90 °
The bending angle at the A and B parts can be about half the bending amount compared to the conventional bending at one place.
【００１１】このようにリードの曲げ角度が小さい場合
にはリードに無理な力が作用しないから、リードの母材
に割れを生じさせたり、リードのめっき被膜に割れを生
じさせるといった問題を解消することができる。この方
法によれば、材質的に割れが生じやすい材料を用いたリ
ードフレームの場合でも、リード母材の割れ等を生じさ
せずに良好な曲げ成形ができ、不良品の発生を抑えるこ
とが可能になる。When the bending angle of the lead is small as described above, an unreasonable force does not act on the lead, so that problems such as cracking of the lead base material and cracking of the lead plating film are solved. be able to. According to this method, even in the case of a lead frame using a material that easily cracks, good bending can be performed without causing cracks in the lead base material and the occurrence of defective products can be suppressed. become.
【００１２】また、上記のようにリードの曲げ位置をダ
ムバー１２にかからない位置に設定することで、各々の
曲げ個所での曲げ精度を効果的に高めることができる。
これによって、最終的な製品でのアウターリード１０の
曲げ精度を向上させることができ、曲げ精度のばらつき
のない良品を確実に製造することができる。なお、本実
施例の方法によれば、ダムバー１２は曲げ位置ＡとＢの
中間の平坦部分にある。Further, by setting the bending position of the lead to a position where it does not reach the dam bar 12 as described above, it is possible to effectively improve the bending accuracy at each bending point.
As a result, the bending accuracy of the outer lead 10 in the final product can be improved, and a non-defective product with no variation in bending accuracy can be reliably manufactured. According to the method of this embodiment, the dam bar 12 is located in the flat portion between the bending positions A and B.
【００１３】なお、本実施例の場合もダムバー１２の内
側部分についてはリードの側面に付着するレジンに対し
て曲げ力が作用するが、本方法の場合はリードの曲げ角
度が小さいからレジンに対する剥離力が強く作用せず、
曲げ加工時にレジンが剥離されることを防止することが
できる。また、曲げ角度が小さいことからダムバー１２
の内側の曲げ位置（Ａ部）をパッケージ１６の外面に近
い位置に設定することができ、レジンの付着長さを短く
できるからレジンを付着しやすくして剥離除去しにくく
させる作用もある。Also in the present embodiment, the bending force acts on the resin attached to the side surface of the lead in the inner portion of the dam bar 12, but in the case of this method, the lead is peeled off from the resin because the bending angle of the lead is small. The force does not act strongly,
It is possible to prevent the resin from peeling off during bending. Moreover, since the bending angle is small, the dam bar 12
The inside bending position (A portion) can be set to a position close to the outer surface of the package 16, and the resin attachment length can be shortened, so that the resin can be easily attached and peeled and removed.
【００１４】また、上記のように本実施例の場合にはダ
ムバー１２の内側の曲げ位置を従来の製品にくらべてパ
ッケージ１６の外面に近い位置に設定できることと、Ｂ
部でさらに内側に曲げるようにすることから、肩部分で
の張り出し量も従来製品にくらべてさほど大きくならな
いようにでき、アウターリード１０の先端位置の延出量
を抑えることができて、はんだ接合部として所要の接合
面積を確保してかつコンパクトな製品として提供するこ
とが可能になる。Further, as described above, in the case of this embodiment, the bending position inside the dam bar 12 can be set to a position closer to the outer surface of the package 16 as compared with the conventional product, and B
Since it is bent further inward at the part, the amount of protrusion at the shoulder part can be made not so large as compared with the conventional product, and the amount of extension at the tip position of the outer lead 10 can be suppressed, and soldering can be performed. It becomes possible to secure a required bonding area as a part and to provide a compact product.
【００１５】なお、上記実施例ではリードをＺ形に曲げ
成形する例について説明したが、本発明方法はリード曲
げ加工の際にダムバーの位置がリードの曲げ位置にかか
るような曲げ加工を行う必要がある製品の場合には、Ｚ
曲げに限らず種々製品に適用することができる。図２は
ＤＩＰタイプの半導体装置に適用した例でアウターリー
ド１０をＬ形に曲げ成形する製品に適用した例である。
また、図３はアウターリード１０をＪ形に曲げ成形する
製品に適用した例である。いずれの場合も、アウターリ
ード１０を肩部分で曲げ成形する際にダムバー１２を挟
む両側位置で各々曲げ成形したものである。これらの製
品の場合も母材の割れやめっき被膜の割れを防止して好
適な曲げ成形を行うことができる。In the above embodiment, an example in which the lead is bent into a Z shape has been described. However, in the method of the present invention, it is necessary to perform bending such that the position of the dam bar corresponds to the bending position of the lead during the lead bending process. Z for products with
Not limited to bending, it can be applied to various products. FIG. 2 is an example applied to a DIP type semiconductor device, and is an example applied to a product in which the outer lead 10 is bent and formed into an L shape.
Further, FIG. 3 is an example applied to a product in which the outer lead 10 is bent and formed into a J shape. In either case, when the outer lead 10 is bent at the shoulder portion, the outer lead 10 is bent at both side positions sandwiching the dam bar 12. Even in the case of these products, it is possible to prevent the base material from cracking and the plating film to crack and perform suitable bending.
【００１６】[0016]
【発明の効果】本発明に係るアウターリードの曲げ成形
方法によれば、上述したように、リードの母材割れやリ
ードのめっき割れを発生させることなく、不良品の発生
を抑えて良好なリードの曲げ加工を行うことができる。
また、リードの曲げ成形精度を向上させることができ良
品を製造することができる。また、本発明に係る半導体
装置はリードの曲げ精度の高い良品として提供できる等
の著効を奏する。As described above, according to the method for bending an outer lead of the present invention, it is possible to suppress the generation of defective products without causing cracks in the base material of the lead and plating cracks in the lead, and to obtain a good lead. Can be bent.
In addition, the lead bending accuracy can be improved, and a good product can be manufactured. Further, the semiconductor device according to the present invention can be provided as a non-defective product having a high lead bending accuracy, and the like.
【図１】本発明に係るアウターリードの曲げ成形方法を
適用した半導体装置の一実施例を示す説明図である。FIG. 1 is an explanatory view showing an embodiment of a semiconductor device to which a method for bending an outer lead according to the present invention is applied.
【図２】本発明に係るアウターリードの曲げ成形方法を
適用した半導体装置の他の実施例を示す説明図である。FIG. 2 is an explanatory view showing another embodiment of the semiconductor device to which the outer lead bending method according to the present invention is applied.
【図３】本発明に係るアウターリードの曲げ成形方法を
適用した半導体装置のさらに他の実施例を示す説明図で
ある。FIG. 3 is an explanatory view showing still another embodiment of the semiconductor device to which the outer lead bending method according to the present invention is applied.
【図４】アウターリードの従来の曲げ形状を示す説明図
である。FIG. 4 is an explanatory view showing a conventional bent shape of an outer lead.
【図５】アウターリードの従来の曲げ形状を示す説明図
である。FIG. 5 is an explanatory view showing a conventional bent shape of an outer lead.
【図６】樹脂モールド後にレジン落とし、ダムバーカッ
トした状態を示す説明図である。FIG. 6 is an explanatory diagram showing a state in which resin is removed after resin molding and dam bar cutting is performed.
１０ アウターリード １２ ダムバー １４ レジン １６ パッケージ 10 Outer lead 12 Dam bar 14 Resin 16 Package
Claims (2)
ーカットを行った後、アウターリードを所定形状に曲げ
成形するアウターリードの曲げ成形方法において、 前記アウターリードの肩部にダムバー位置を設定すると
ともに、該ダムバー位置を挟む両側に各々リードの曲げ
位置を設定してリードを曲げ成形することを特徴とする
アウターリードの曲げ成形方法。1. A method of bending an outer lead, which comprises resin-molding, dambar cutting after resin molding, and then bending the outer lead into a predetermined shape, wherein a dambar position is set on a shoulder portion of the outer lead, and A method of bending an outer lead, characterized in that bending positions of the leads are set on both sides sandwiching the dam bar position to bend the leads.
形状に曲げ成形して成る半導体装置において、 前記曲げ成形されたアウターリードの肩部にダムバー位
置が設定され、該ダムバー位置を挟む両側に各々リード
の曲げ位置を設定してリードが曲げ成形されたことを特
徴とする半導体装置。2. A semiconductor device formed by bending an outer lead into a predetermined shape after resin molding, wherein a dam bar position is set on a shoulder portion of the bent outer lead, and the lead is provided on each side sandwiching the dam bar position. A semiconductor device in which a lead is bent and formed by setting a bending position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP06664493A JP3216934B2 (en) | 1993-03-25 | 1993-03-25 | Method for bending outer lead and semiconductor device using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP06664493A JP3216934B2 (en) | 1993-03-25 | 1993-03-25 | Method for bending outer lead and semiconductor device using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06283642A true JPH06283642A (en) | 1994-10-07 |
| JP3216934B2 JP3216934B2 (en) | 2001-10-09 |
Family
ID=13321815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP06664493A Expired - Fee Related JP3216934B2 (en) | 1993-03-25 | 1993-03-25 | Method for bending outer lead and semiconductor device using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3216934B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8193619B2 (en) | 2009-03-18 | 2012-06-05 | Samsung Electronics Co., Ltd. | Lead frame and semiconductor package having the same |
| DE102013200944A1 (en) | 2012-06-25 | 2014-01-02 | Mitsubishi Electric Corp. | A method of manufacturing a semiconductor device and semiconductor device |
-
1993
- 1993-03-25 JP JP06664493A patent/JP3216934B2/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8193619B2 (en) | 2009-03-18 | 2012-06-05 | Samsung Electronics Co., Ltd. | Lead frame and semiconductor package having the same |
| DE102013200944A1 (en) | 2012-06-25 | 2014-01-02 | Mitsubishi Electric Corp. | A method of manufacturing a semiconductor device and semiconductor device |
| US8859338B2 (en) | 2012-06-25 | 2014-10-14 | Mitsubishi Electric Corporation | Method of manufacturing a semiconductor device and semiconductor device |
| DE102013200944B4 (en) * | 2012-06-25 | 2020-10-15 | Mitsubishi Electric Corp. | Method of manufacturing a semiconductor device and semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3216934B2 (en) | 2001-10-09 |
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