JPH0367461U - - Google Patents
Info
- Publication number
- JPH0367461U JPH0367461U JP12838289U JP12838289U JPH0367461U JP H0367461 U JPH0367461 U JP H0367461U JP 12838289 U JP12838289 U JP 12838289U JP 12838289 U JP12838289 U JP 12838289U JP H0367461 U JPH0367461 U JP H0367461U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- lead frame
- bonded
- emitting chip
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 230000003287 optical effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Description
第1図は本考案の具体的な一実施例に係るLE
D及びその光路を示した縦断面図。第2図は第1
図のLEDで基台が成形され、発光チツプが接合
されたリードフレームを示した縦断面図。第3図
は従来のLEDのリードフレームを示した斜視図
。第4図は第3図のリードフレームに発光チツプ
が接合された状態を示した部分縦断面図。第5図
は従来の他のLEDを示した縦断面図である。
10……発光ダイオード(LED)、11,1
6……リード部材、13,18……平坦部、19
……レンズ部材、20……リードフレーム、21
……基台、28……発光チツプ。
FIG. 1 shows an LE according to a specific embodiment of the present invention.
A vertical cross-sectional view showing D and its optical path. Figure 2 is the first
FIG. 2 is a longitudinal cross-sectional view showing a lead frame in which a base is formed from the LED shown in the figure and a light emitting chip is bonded thereto. FIG. 3 is a perspective view showing a conventional LED lead frame. FIG. 4 is a partial vertical sectional view showing a state in which a light emitting chip is bonded to the lead frame of FIG. 3. FIG. 5 is a longitudinal sectional view showing another conventional LED. 10... Light emitting diode (LED), 11,1
6... Lead member, 13, 18... Flat part, 19
... Lens member, 20 ... Lead frame, 21
...Base, 28...Light-emitting chip.
Claims (1)
合され樹脂成形された発光ダイオードにおいて、 前記リードフレームに形成され、前記発光チツ
プが接合される平面である平坦部と、 前記平坦部に接合される前記発光チツプの端面
の周囲で該平坦部から外側に前記発光ダイオード
の外形寸法まで傾斜し、前記発光チツプから放射
された光を前面に反射させるように前記リードフ
レームに樹脂成形された基台と、 前記基台が形成され、前記発光チツプが前記リ
ードフレームに接合された後、前記基台上でその
外形寸法と同じに樹脂成形されたレンズ部材と を備えたことを特徴とする発光ダイオード。[Claims for Utility Model Registration] A light emitting diode in which a light emitting chip that emits light is bonded to a lead frame and molded with resin, comprising: a flat portion that is a plane formed on the lead frame and to which the light emitting chip is bonded; A resin is attached to the lead frame so as to be inclined outward from the flat part to the outer dimensions of the light emitting diode around the end face of the light emitting chip to be bonded to the flat part, and to reflect light emitted from the light emitting chip to the front surface. A molded base; and a lens member resin-molded on the base to have the same external dimensions as the base after the base is formed and the light emitting chip is bonded to the lead frame. Features a light emitting diode.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989128382U JP2519504Y2 (en) | 1989-10-31 | 1989-10-31 | Light emitting diode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989128382U JP2519504Y2 (en) | 1989-10-31 | 1989-10-31 | Light emitting diode |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0367461U true JPH0367461U (en) | 1991-07-01 |
JP2519504Y2 JP2519504Y2 (en) | 1996-12-04 |
Family
ID=31676090
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989128382U Expired - Fee Related JP2519504Y2 (en) | 1989-10-31 | 1989-10-31 | Light emitting diode |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2519504Y2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100790347B1 (en) * | 2006-10-27 | 2008-01-02 | 주식회사 대목환경건설 | A planting block |
JP2010125647A (en) * | 2008-11-26 | 2010-06-10 | Towa Corp | Compression molding method of optical molded article and mold |
CN105340090A (en) * | 2013-06-28 | 2016-02-17 | 皇家飞利浦有限公司 | Light emitting diode device |
JP2016528722A (en) * | 2013-06-28 | 2016-09-15 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | Light emitting diode device |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE29724847U1 (en) | 1996-06-26 | 2004-09-30 | Osram Opto Semiconductors Gmbh | Light-emitting semiconductor component with luminescence conversion element |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS508884U (en) * | 1973-05-18 | 1975-01-29 | ||
JPS587364U (en) * | 1981-07-07 | 1983-01-18 | スタンレー電気株式会社 | light emitting diode lamp |
JPS6315483A (en) * | 1986-07-07 | 1988-01-22 | Toyoda Gosei Co Ltd | Lead frame for light-emitting diode |
-
1989
- 1989-10-31 JP JP1989128382U patent/JP2519504Y2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS508884U (en) * | 1973-05-18 | 1975-01-29 | ||
JPS587364U (en) * | 1981-07-07 | 1983-01-18 | スタンレー電気株式会社 | light emitting diode lamp |
JPS6315483A (en) * | 1986-07-07 | 1988-01-22 | Toyoda Gosei Co Ltd | Lead frame for light-emitting diode |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100790347B1 (en) * | 2006-10-27 | 2008-01-02 | 주식회사 대목환경건설 | A planting block |
JP2010125647A (en) * | 2008-11-26 | 2010-06-10 | Towa Corp | Compression molding method of optical molded article and mold |
CN105340090A (en) * | 2013-06-28 | 2016-02-17 | 皇家飞利浦有限公司 | Light emitting diode device |
JP2016528722A (en) * | 2013-06-28 | 2016-09-15 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | Light emitting diode device |
US10038122B2 (en) | 2013-06-28 | 2018-07-31 | Lumileds Llc | Light emitting diode device |
Also Published As
Publication number | Publication date |
---|---|
JP2519504Y2 (en) | 1996-12-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |