JPH02127045U - - Google Patents
Info
- Publication number
- JPH02127045U JPH02127045U JP3534489U JP3534489U JPH02127045U JP H02127045 U JPH02127045 U JP H02127045U JP 3534489 U JP3534489 U JP 3534489U JP 3534489 U JP3534489 U JP 3534489U JP H02127045 U JPH02127045 U JP H02127045U
- Authority
- JP
- Japan
- Prior art keywords
- packaged
- light
- optical coupling
- resin mold
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 230000008878 coupling Effects 0.000 claims 2
- 238000010168 coupling process Methods 0.000 claims 2
- 238000005859 coupling reaction Methods 0.000 claims 2
- 230000003287 optical effect Effects 0.000 claims 2
- 238000005530 etching Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Description
第１図は本考案の実施例１を示す縦断面図、第
２図は本考案の実施例２を示す縦断面図、第３図
は従来例を示す縦断面図、第４図は本考案の効果
を示す図である。
１…発光素子、２…受光素子、３…透明樹脂、
４…白色樹脂、５…樹脂モールド、６…エツチン
グ部、７…パターンめつき部、３…予備半田、９
…リードフレーム。
Fig. 1 is a longitudinal sectional view showing the first embodiment of the present invention, Fig. 2 is a longitudinal sectional view showing the second embodiment of the invention, Fig. 3 is a longitudinal sectional view showing the conventional example, and Fig. 4 is the longitudinal sectional view of the invention. FIG. 1... Light emitting element, 2... Light receiving element, 3... Transparent resin,
4...White resin, 5...Resin mold, 6...Etching part, 7...Pattern plating part, 3...Preliminary solder, 9
…Lead frame.
Claims (1)
略同一平面上に配設し、これを透明樹脂及び樹脂
モールドでパツケージし、又は樹脂モールドのみ
でパツケージしてなる光結合素子において、樹脂
モールドに結合されるリードフレーム表面に凹凸
を有することを特徴とする光結合素子。 In an optical coupling device in which a light-emitting element and a light-receiving element are arranged facing each other or on substantially the same plane and are packaged with a transparent resin and a resin mold, or packaged with only a resin mold, An optical coupling element characterized in that the surface of a lead frame to be coupled has irregularities.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3534489U JPH02127045U (en) | 1989-03-28 | 1989-03-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3534489U JPH02127045U (en) | 1989-03-28 | 1989-03-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02127045U true JPH02127045U (en) | 1990-10-19 |
Family
ID=31540616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3534489U Pending JPH02127045U (en) | 1989-03-28 | 1989-03-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02127045U (en) |
-
1989
- 1989-03-28 JP JP3534489U patent/JPH02127045U/ja active Pending
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