JPH0459964U - - Google Patents
Info
- Publication number
- JPH0459964U JPH0459964U JP10218490U JP10218490U JPH0459964U JP H0459964 U JPH0459964 U JP H0459964U JP 10218490 U JP10218490 U JP 10218490U JP 10218490 U JP10218490 U JP 10218490U JP H0459964 U JPH0459964 U JP H0459964U
- Authority
- JP
- Japan
- Prior art keywords
- light
- unevenness
- transmitting part
- package structure
- mirror
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案による半導体素子のパツケージ
構造の一実施例を示す斜視図、第２図は第１図記
載の実施例の平面図、第３図は第１図記載の実施
例の断面図、第４図は従来の半導体素子のパツケ
ージ構造の一例を示す正面図である。
１……ピン、２……セラミツクステム、３……
チツプ、４……ワイヤ、５……レンズ、６……リ
ード、１１……樹脂、１１ａ……透明窓、１１ｂ
……梨地部分。
1 is a perspective view showing an embodiment of the package structure of a semiconductor device according to the present invention, FIG. 2 is a plan view of the embodiment shown in FIG. 1, and FIG. 3 is a sectional view of the embodiment shown in FIG. 1. , FIG. 4 is a front view showing an example of a conventional package structure of a semiconductor device. 1...Pin, 2...Ceramic stem, 3...
Chip, 4...Wire, 5...Lens, 6...Lead, 11...Resin, 11a...Transparent window, 11b
...Nashiji part.
Claims (1)
一部に凹凸のない鏡面状の透光部が形成され、そ
の他の部分には微細な凹凸を有する非透光部が形
成されていることを特徴とする半導体素子のパツ
ケージ構造。 A transparent resin covering the light emitting or light receiving semiconductor element is characterized in that a mirror-like light-transmitting part with no unevenness is formed in a part, and a non-light-transmitting part with fine unevenness is formed in the other part. The package structure of semiconductor devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10218490U JPH0459964U (en) | 1990-10-01 | 1990-10-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10218490U JPH0459964U (en) | 1990-10-01 | 1990-10-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0459964U true JPH0459964U (en) | 1992-05-22 |
Family
ID=31846215
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10218490U Pending JPH0459964U (en) | 1990-10-01 | 1990-10-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0459964U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018190861A (en) * | 2017-05-09 | 2018-11-29 | ローム株式会社 | Optical device |
-
1990
- 1990-10-01 JP JP10218490U patent/JPH0459964U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018190861A (en) * | 2017-05-09 | 2018-11-29 | ローム株式会社 | Optical device |