JPH01167065U - - Google Patents

Info

Publication number
JPH01167065U
JPH01167065U JP1988063522U JP6352288U JPH01167065U JP H01167065 U JPH01167065 U JP H01167065U JP 1988063522 U JP1988063522 U JP 1988063522U JP 6352288 U JP6352288 U JP 6352288U JP H01167065 U JPH01167065 U JP H01167065U
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
recess
diode chip
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988063522U
Other languages
Japanese (ja)
Other versions
JPH0639464Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988063522U priority Critical patent/JPH0639464Y2/en
Publication of JPH01167065U publication Critical patent/JPH01167065U/ja
Application granted granted Critical
Publication of JPH0639464Y2 publication Critical patent/JPH0639464Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図および第２図は本考案のそれぞれ第１お
よび第２の実施例を示す。第３図は第２の実施例
と従来の赤外発光ダイオードが放射する赤外光の
指向特性曲線を、第４図は赤外発光ダイオードチ
ツプの構造とその発光出力の分布状況をそれぞれ
示す。第５図ａとｂは従来の発光ダイオードの構
造と主反射帯をそれぞれ示す。 １……赤外発光ダイオードチツプ、２……リー
ドフレーム、４……レンズ、１０……発光ダイオ
ード、２０……第１の凹部、２１……第２の凹部
、２２１，２２２……内面。 1 and 2 show a first and second embodiment of the invention, respectively. FIG. 3 shows the directivity curves of infrared light emitted by the second embodiment and the conventional infrared light emitting diode, and FIG. 4 shows the structure of the infrared light emitting diode chip and the distribution of its light emitting output. Figures 5a and 5b show the structure and main reflection band of a conventional light emitting diode, respectively. DESCRIPTION OF SYMBOLS 1... Infrared light emitting diode chip, 2... Lead frame, 4... Lens, 10... Light emitting diode, 20... First recess, 21... Second recess, 221, 222... Inner surface.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 一端部分に第１の凹部を形成したリードフレー
ムと、前記凹部に設けた発光ダイオードチツプと
、この発光ダイオードチツプと前記リードフレー
ムの他端部分を除いた部分を一体として封止した
透光性樹脂のレンズとを具備した発光ダイオード
において、前記発光ダイオードチツプを前記第１
の凹部の底部に形成した第２の凹部に取り付けた
ことを特徴とする発光ダイオード。 A lead frame with a first recess formed in one end, a light emitting diode chip provided in the recess, and a translucent resin that integrally seals the light emitting diode chip and the lead frame except for the other end. In the light emitting diode, the light emitting diode chip is provided with the first lens.
A light emitting diode, characterized in that it is attached to a second recess formed at the bottom of the recess.
JP1988063522U 1988-05-13 1988-05-13 Light emitting diode Expired - Lifetime JPH0639464Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988063522U JPH0639464Y2 (en) 1988-05-13 1988-05-13 Light emitting diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988063522U JPH0639464Y2 (en) 1988-05-13 1988-05-13 Light emitting diode

Publications (2)

Publication Number Publication Date
JPH01167065U true JPH01167065U (en) 1989-11-22
JPH0639464Y2 JPH0639464Y2 (en) 1994-10-12

Family

ID=31289018

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988063522U Expired - Lifetime JPH0639464Y2 (en) 1988-05-13 1988-05-13 Light emitting diode

Country Status (1)

Country Link
JP (1) JPH0639464Y2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005537665A (en) * 2002-08-30 2005-12-08 ゲルコアー リミテッド ライアビリティ カンパニー LED flat light source and thin headlight provided with the same
JP2006313896A (en) * 2005-05-02 2006-11-16 Samsung Electro Mech Co Ltd Light emitting element package
WO2008126696A1 (en) * 2007-04-05 2008-10-23 Rohm Co., Ltd. Semiconductor light-emitting device
WO2013161295A1 (en) * 2012-04-24 2013-10-31 パナソニック株式会社 Led package and led light-emitting element
JP2016502289A (en) * 2013-01-08 2016-01-21 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ Trough reflector for optoelectronic semiconductor components

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5577874U (en) * 1978-11-21 1980-05-29
JPS58220480A (en) * 1982-06-16 1983-12-22 Toshiba Corp Photosemiconductor device
JPS59115669U (en) * 1983-01-25 1984-08-04 三洋電機株式会社 light emitting element

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5577874U (en) * 1978-11-21 1980-05-29
JPS58220480A (en) * 1982-06-16 1983-12-22 Toshiba Corp Photosemiconductor device
JPS59115669U (en) * 1983-01-25 1984-08-04 三洋電機株式会社 light emitting element

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005537665A (en) * 2002-08-30 2005-12-08 ゲルコアー リミテッド ライアビリティ カンパニー LED flat light source and thin headlight provided with the same
JP2006313896A (en) * 2005-05-02 2006-11-16 Samsung Electro Mech Co Ltd Light emitting element package
WO2008126696A1 (en) * 2007-04-05 2008-10-23 Rohm Co., Ltd. Semiconductor light-emitting device
JP2008258413A (en) * 2007-04-05 2008-10-23 Rohm Co Ltd Semiconductor light-emitting device
WO2013161295A1 (en) * 2012-04-24 2013-10-31 パナソニック株式会社 Led package and led light-emitting element
JP2013229395A (en) * 2012-04-24 2013-11-07 Panasonic Corp Led package and led light emitting element
JP2016502289A (en) * 2013-01-08 2016-01-21 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ Trough reflector for optoelectronic semiconductor components

Also Published As

Publication number Publication date
JPH0639464Y2 (en) 1994-10-12

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