JPS6265855U - - Google Patents

Info

Publication number
JPS6265855U
JPS6265855U JP15837785U JP15837785U JPS6265855U JP S6265855 U JPS6265855 U JP S6265855U JP 15837785 U JP15837785 U JP 15837785U JP 15837785 U JP15837785 U JP 15837785U JP S6265855 U JPS6265855 U JP S6265855U
Authority
JP
Japan
Prior art keywords
emitting diode
light emitting
envelope
diode device
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15837785U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15837785U priority Critical patent/JPS6265855U/ja
Publication of JPS6265855U publication Critical patent/JPS6265855U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案に係る発光ダイオード装置の一
実施例の断面図、第２図は他の実施例の断面図、
第３図は従来の発光ダイオード装置の断面図、第
４図は他の従来の発光ダイオード装置をリニアイ
メージセンサに用いた場合の断面図である。 ６：発光ダイオードチツプ、８，８′，１０，
１０′：リードフレーム、１１：外囲器、１１ａ
：突起。 FIG. 1 is a sectional view of one embodiment of a light emitting diode device according to the present invention, FIG. 2 is a sectional view of another embodiment,
FIG. 3 is a sectional view of a conventional light emitting diode device, and FIG. 4 is a sectional view of another conventional light emitting diode device used in a linear image sensor. 6: Light emitting diode chip, 8, 8', 10,
10': Lead frame, 11: Envelope, 11a
:protrusion.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] リードフレームに発光ダイオードチツプを搭載
し、封止樹脂により外囲器を形成してなる発光ダ
イオード装置において、上記封止外囲器の表面に
、発光中心部において密であり周辺部において粗
となるように突起若しくは溝を設けてなることを
特徴とする発光ダイオード装置。 In a light emitting diode device in which a light emitting diode chip is mounted on a lead frame and an envelope is formed from a sealing resin, the surface of the sealing envelope is dense at the center of light emission and coarse at the periphery. A light emitting diode device characterized in that it is provided with protrusions or grooves.
JP15837785U 1985-10-14 1985-10-14 Pending JPS6265855U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15837785U JPS6265855U (en) 1985-10-14 1985-10-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15837785U JPS6265855U (en) 1985-10-14 1985-10-14

Publications (1)

Publication Number Publication Date
JPS6265855U true JPS6265855U (en) 1987-04-23

Family

ID=31081807

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15837785U Pending JPS6265855U (en) 1985-10-14 1985-10-14

Country Status (1)

Country Link
JP (1) JPS6265855U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005210042A (en) * 2003-09-11 2005-08-04 Kyocera Corp Light emitting apparatus and illumination apparatus
JP2009158541A (en) * 2007-12-25 2009-07-16 Citizen Electronics Co Ltd Manufacturing method of light emitting diode
JP2019511840A (en) * 2016-03-16 2019-04-25 ルミレッズ ホールディング ベーフェー Method of manufacturing LED module

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005210042A (en) * 2003-09-11 2005-08-04 Kyocera Corp Light emitting apparatus and illumination apparatus
JP2009158541A (en) * 2007-12-25 2009-07-16 Citizen Electronics Co Ltd Manufacturing method of light emitting diode
JP2019511840A (en) * 2016-03-16 2019-04-25 ルミレッズ ホールディング ベーフェー Method of manufacturing LED module

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