JPH0286154U - - Google Patents
Info
- Publication number
- JPH0286154U JPH0286154U JP16510688U JP16510688U JPH0286154U JP H0286154 U JPH0286154 U JP H0286154U JP 16510688 U JP16510688 U JP 16510688U JP 16510688 U JP16510688 U JP 16510688U JP H0286154 U JPH0286154 U JP H0286154U
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- light emitting
- surface area
- diode chip
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
Description
第１図は本考案によるＬＥＤの一実施例の側面
図である。第２図は従来のＬＥＤの一例を示す概
略側面図である。
１０…ＬＥＤ；１１，１２…リードフレーム；
１３…ＬＥＤチツプ；１４…レンズ；１５…遮光
膜。
FIG. 1 is a side view of an embodiment of an LED according to the present invention. FIG. 2 is a schematic side view showing an example of a conventional LED. 10...LED; 11, 12...Lead frame;
13...LED chip; 14...lens; 15...light shielding film.
Claims (1)
ダイオードチツプと、該発光ダイオードチツプを
包囲するように樹脂モールドにより成形されたレ
ンズとを含んでいる発光ダイオードにおいて、 上記レンズの上向きの表面領域を除いた他の表
面領域を覆うように形成された反射率の低い遮光
膜が備えられていることを特徴とする、発光ダイ
オード。[Claims for Utility Model Registration] A light emitting diode including a light emitting diode chip attached to one end of a lead frame, and a lens molded with a resin mold to surround the light emitting diode chip, 1. A light emitting diode, comprising a light-shielding film with low reflectance formed to cover a surface area other than an upward facing surface area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16510688U JPH0286154U (en) | 1988-12-22 | 1988-12-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16510688U JPH0286154U (en) | 1988-12-22 | 1988-12-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0286154U true JPH0286154U (en) | 1990-07-09 |
Family
ID=31451291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16510688U Pending JPH0286154U (en) | 1988-12-22 | 1988-12-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0286154U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000150965A (en) * | 1998-11-11 | 2000-05-30 | Matsushita Electronics Industry Corp | Semiconductor light emitting device |
| WO2005067066A1 (en) * | 2004-01-07 | 2005-07-21 | Matsushita Electric Industrial Co., Ltd. | Led lighting light source |
| JP2018507445A (en) * | 2015-02-15 | 2018-03-15 | 北京▲環▼宇▲藍▼博科技有限公司 | LED display screen cover and LED display |
-
1988
- 1988-12-22 JP JP16510688U patent/JPH0286154U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000150965A (en) * | 1998-11-11 | 2000-05-30 | Matsushita Electronics Industry Corp | Semiconductor light emitting device |
| WO2005067066A1 (en) * | 2004-01-07 | 2005-07-21 | Matsushita Electric Industrial Co., Ltd. | Led lighting light source |
| JPWO2005067066A1 (en) * | 2004-01-07 | 2007-12-20 | 松下電器産業株式会社 | LED lighting source |
| JP2018507445A (en) * | 2015-02-15 | 2018-03-15 | 北京▲環▼宇▲藍▼博科技有限公司 | LED display screen cover and LED display |