JPH0367460U - - Google Patents
Info
- Publication number
- JPH0367460U JPH0367460U JP12838189U JP12838189U JPH0367460U JP H0367460 U JPH0367460 U JP H0367460U JP 12838189 U JP12838189 U JP 12838189U JP 12838189 U JP12838189 U JP 12838189U JP H0367460 U JPH0367460 U JP H0367460U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- lead frame
- bonded
- emitting chip
- molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 230000003287 optical effect Effects 0.000 description 1
Description
第１図は本考案の具体的な一実施例に係るＬＥ
Ｄ及びその光路を示した縦断面図。第２図は第１
図のＬＥＤで反射部材が成形され、発光チツプが
接合されたリードフレームを示した縦断面図。第
３図は従来のＬＥＤのリードフレームを示した斜
視図。第４図は第３図のリードフレームに発光チ
ツプが接合された状態を示した部分縦断面図。第
５図は従来の他のＬＥＤを示した縦断面図である
。
１０……発光ダイオード（ＬＥＤ）、１１，１
６……リード部材、１３，１８……平坦部、１９
……レンズ部材、２０……リードフレーム、２５
……反射部材、２８……発光チツプ。
FIG. 1 shows an LE according to a specific embodiment of the present invention.
A vertical cross-sectional view showing D and its optical path. Figure 2 is the first
FIG. 2 is a vertical cross-sectional view showing a lead frame in which a reflective member is molded using the LED shown in the figure and a light emitting chip is bonded thereto. FIG. 3 is a perspective view showing a conventional LED lead frame. FIG. 4 is a partial vertical sectional view showing a state in which a light emitting chip is bonded to the lead frame of FIG. 3. FIG. 5 is a longitudinal sectional view showing another conventional LED. 10... Light emitting diode (LED), 11,1
6... Lead member, 13, 18... Flat part, 19
... Lens member, 20 ... Lead frame, 25
... Reflective member, 28 ... Light emitting chip.
Claims (1)
合され樹脂成形された発光ダイオードにおいて、 前記リードフレームに形成され、前記発光チツ
プが接合される平面である平坦部と、 前記平坦部に接合される前記発光チツプの端面
の周囲で該平坦部から外側に傾斜し、前記発光チ
ツプから放射された光を前面に反射させるように
前記リードフレームに樹脂成形された反射部材と
、 前記反射部材が形成され、前記発光チツプが前
記リードフレームに接合された後、前記反射部材
の全周を囲むように樹脂成形されたレンズ部材と を備えたことを特徴とする発光ダイオード。[Claims for Utility Model Registration] A light emitting diode in which a light emitting chip that emits light is bonded to a lead frame and molded with resin, comprising: a flat portion that is a plane formed on the lead frame and to which the light emitting chip is bonded; a reflective member molded with resin on the lead frame so as to be inclined outward from the flat part around an end face of the light emitting chip bonded to the flat part, and to reflect light emitted from the light emitting chip to the front surface; A light emitting diode characterized in that the light emitting diode is provided with a lens member which is resin-molded so as to surround the entire circumference of the reflective member after the reflective member is formed and the light emitting chip is bonded to the lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12838189U JPH0367460U (en) | 1989-10-31 | 1989-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12838189U JPH0367460U (en) | 1989-10-31 | 1989-10-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0367460U true JPH0367460U (en) | 1991-07-01 |
Family
ID=31676089
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12838189U Pending JPH0367460U (en) | 1989-10-31 | 1989-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0367460U (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS624380A (en) * | 1985-06-29 | 1987-01-10 | Toshiba Corp | Light emitting diode device |
| JPS6273786A (en) * | 1985-09-27 | 1987-04-04 | Toshiba Corp | Semiconductor light emitting device |
| JPS6315483A (en) * | 1986-07-07 | 1988-01-22 | Toyoda Gosei Co Ltd | Lead frame for light-emitting diode |
-
1989
- 1989-10-31 JP JP12838189U patent/JPH0367460U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS624380A (en) * | 1985-06-29 | 1987-01-10 | Toshiba Corp | Light emitting diode device |
| JPS6273786A (en) * | 1985-09-27 | 1987-04-04 | Toshiba Corp | Semiconductor light emitting device |
| JPS6315483A (en) * | 1986-07-07 | 1988-01-22 | Toyoda Gosei Co Ltd | Lead frame for light-emitting diode |
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