JPS6240854U - - Google Patents
Info
- Publication number
- JPS6240854U JPS6240854U JP13198385U JP13198385U JPS6240854U JP S6240854 U JPS6240854 U JP S6240854U JP 13198385 U JP13198385 U JP 13198385U JP 13198385 U JP13198385 U JP 13198385U JP S6240854 U JPS6240854 U JP S6240854U
- Authority
- JP
- Japan
- Prior art keywords
- light
- emitting diode
- diode chip
- seals
- emitted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 230000003287 optical effect Effects 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Description
第１図は本考案の一実施例を示す側断面図、第
２図は従来の抜き型成形例を示す断面図、第３図
は同従来のパツケージ構造を示す側断面図である
。
１：発光ダイオードチツプ、２：接続用金線、
３：リードフレーム、４：透光性樹脂。
FIG. 1 is a side sectional view showing an embodiment of the present invention, FIG. 2 is a sectional view showing a conventional punching molding example, and FIG. 3 is a side sectional view showing the conventional package structure. 1: Light emitting diode chip, 2: Gold wire for connection,
3: Lead frame, 4: Transparent resin.
Claims (1)
子のパツケージ構造において、前記発光ダイオー
ドチツプを封止する透光性樹脂を、光の出る方向
に対して拡がり角度を持つ形状に形成せしめたこ
とを特徴とする光半導体パツケージ。 A package structure for a semiconductor device equipped with a light-emitting diode chip, characterized in that the light-transmitting resin that seals the light-emitting diode chip is formed into a shape that extends at an angle with respect to the direction in which light is emitted. Optical semiconductor package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13198385U JPS6240854U (en) | 1985-08-27 | 1985-08-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13198385U JPS6240854U (en) | 1985-08-27 | 1985-08-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6240854U true JPS6240854U (en) | 1987-03-11 |
Family
ID=31030943
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13198385U Pending JPS6240854U (en) | 1985-08-27 | 1985-08-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6240854U (en) |
-
1985
- 1985-08-27 JP JP13198385U patent/JPS6240854U/ja active Pending
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