JPH0367459U - - Google Patents
Info
- Publication number
- JPH0367459U JPH0367459U JP12838089U JP12838089U JPH0367459U JP H0367459 U JPH0367459 U JP H0367459U JP 12838089 U JP12838089 U JP 12838089U JP 12838089 U JP12838089 U JP 12838089U JP H0367459 U JPH0367459 U JP H0367459U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting chip
- emitting diode
- flat part
- step part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 230000003287 optical effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
Description
第１図は本考案の具体的な一実施例に係るＬＥ
Ｄ及びその光路を示した縦断面図。第２図は第１
図のＬＥＤの発光チツプが載置され接合されたリ
ードフレームを示した縦断面図。第３図は第２図
におけるリードフレームを発光チツプ側から見た
平面図。第４図は従来のＬＥＤのリードフレーム
を示した斜視図。第５図は第４図のリードフレー
ムに発光チツプが接合された状態を示した部分縦
断面図。第６図は従来の他のＬＥＤを示した縦断
面図である。
１０……発光ダイオード（ＬＥＤ）、１１，２
１……リード部材、１３，２３……平坦部、１４
，２４……反射部、１５，２５……段差部、１８
……発光チツプ、２０……リードフレーム。
FIG. 1 shows an LE according to a specific embodiment of the present invention.
A vertical cross-sectional view showing D and its optical path. Figure 2 is the first
FIG. 2 is a vertical cross-sectional view showing a lead frame on which the light emitting chip of the LED shown in the figure is mounted and bonded. FIG. 3 is a plan view of the lead frame in FIG. 2, viewed from the light emitting chip side. FIG. 4 is a perspective view showing a conventional LED lead frame. FIG. 5 is a partial vertical sectional view showing a state in which a light emitting chip is bonded to the lead frame of FIG. 4. FIG. 6 is a longitudinal sectional view showing another conventional LED. 10... Light emitting diode (LED), 11,2
1... Lead member, 13, 23... Flat part, 14
, 24... Reflection part, 15, 25... Step part, 18
...Light-emitting chip, 20...Lead frame.
Claims (1)
がリードフレームを構成する２つのリード部材の
各々に接合され樹脂成形された発光ダイオードに
おいて、 前記２つのリード部材のそれぞれの先端部でほ
ぼ同じ位置になるように形成された平坦部と、 前記平坦部に続く周囲で前記発光チツプが位置
決めされるように形成された段差部と、 前記段差部に続く側周面で該段差部から外側に
傾斜して形成された反射部と を備えたことを特徴とする発光ダイオード。[Claims for Utility Model Registration] A light emitting diode in which a light emitting chip having a pair of positive and negative electrode portions on the same side is bonded to each of two lead members constituting a lead frame and molded with resin, wherein: a flat part formed at each tip so that they are at approximately the same position; a step part formed around the flat part so that the light-emitting chip is positioned; and a side circumferential surface following the step part. A light emitting diode, comprising: a reflective section formed to be inclined outward from the stepped section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12838089U JPH0367459U (en) | 1989-10-31 | 1989-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12838089U JPH0367459U (en) | 1989-10-31 | 1989-10-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0367459U true JPH0367459U (en) | 1991-07-01 |
Family
ID=31676088
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12838089U Pending JPH0367459U (en) | 1989-10-31 | 1989-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0367459U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006103295A (en) * | 2004-10-06 | 2006-04-20 | Fukuhara Co Ltd | Device for preventing occurrence of failure in in-line screw type molding machine |
| WO2008126696A1 (en) * | 2007-04-05 | 2008-10-23 | Rohm Co., Ltd. | Semiconductor light-emitting device |
-
1989
- 1989-10-31 JP JP12838089U patent/JPH0367459U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006103295A (en) * | 2004-10-06 | 2006-04-20 | Fukuhara Co Ltd | Device for preventing occurrence of failure in in-line screw type molding machine |
| WO2008126696A1 (en) * | 2007-04-05 | 2008-10-23 | Rohm Co., Ltd. | Semiconductor light-emitting device |