JPS6244452U - - Google Patents

Info

Publication number
JPS6244452U
JPS6244452U JP13518985U JP13518985U JPS6244452U JP S6244452 U JPS6244452 U JP S6244452U JP 13518985 U JP13518985 U JP 13518985U JP 13518985 U JP13518985 U JP 13518985U JP S6244452 U JPS6244452 U JP S6244452U
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
lead
molded
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13518985U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13518985U priority Critical patent/JPS6244452U/ja
Publication of JPS6244452U publication Critical patent/JPS6244452U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例を示す断面図、第２
図は本考案の他の実施例を示す断面図、第３図は
従来例を示す断面図、第４図は他の従来例を示す
断面図、第５図はさらに他の従来例を示す断面図
である。 １：発光ダイオードチツプ、２：リードフレー
ム、３：金線、４：透光性樹脂、４ａ：レンズ部
、６：白色樹脂。 Fig. 1 is a sectional view showing one embodiment of the present invention;
3 is a sectional view showing another embodiment of the present invention, FIG. 3 is a sectional view showing a conventional example, FIG. 4 is a sectional view showing another conventional example, and FIG. 5 is a sectional view showing still another conventional example. It is a diagram. 1: Light emitting diode chip, 2: Lead frame, 3: Gold wire, 4: Transparent resin, 4a: Lens part, 6: White resin.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 複数のリードフレームを有し、リードフレーム
に発光ダイオードチツプを搭載し複数のリードフ
レームにより電気的リード端子を導出するように
してなる発光ダイオードにおいて、リードフレー
ムに搭載された発光ダイオードチツプの周囲を透
光性樹脂で１次モールドし、前記透光性樹脂の発
光取出し部をあけて、さらにその外部周辺を反射
率の高い樹脂により２次モールド成形してなるこ
とを特徴とする発光ダイオード。 In a light emitting diode that has a plurality of lead frames, a light emitting diode chip is mounted on the lead frame, and electrical lead terminals are led out through the plurality of lead frames, the periphery of the light emitting diode chip mounted on the lead frame is transparent. A light emitting diode characterized in that it is first molded with a photoresist, a light emitting extraction portion of the light transmissive resin is opened, and the outer periphery thereof is second molded with a highly reflective resin.
JP13518985U 1985-09-03 1985-09-03 Pending JPS6244452U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13518985U JPS6244452U (en) 1985-09-03 1985-09-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13518985U JPS6244452U (en) 1985-09-03 1985-09-03

Publications (1)

Publication Number Publication Date
JPS6244452U true JPS6244452U (en) 1987-03-17

Family

ID=31037136

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13518985U Pending JPS6244452U (en) 1985-09-03 1985-09-03

Country Status (1)

Country Link
JP (1) JPS6244452U (en)

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