JPH0224564U - - Google Patents
Info
- Publication number
- JPH0224564U JPH0224564U JP10138788U JP10138788U JPH0224564U JP H0224564 U JPH0224564 U JP H0224564U JP 10138788 U JP10138788 U JP 10138788U JP 10138788 U JP10138788 U JP 10138788U JP H0224564 U JPH0224564 U JP H0224564U
- Authority
- JP
- Japan
- Prior art keywords
- diode chip
- attached
- led lamp
- light emitting
- bonding wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000000465 moulding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Description
第１図は従来のＬＥＤランプを説明するための
断面図、第２図はこの考案に係るＬＥＤランプを
説明するための断面図である。
１……整流ダイオード、２……モールド樹脂、
３……リード端子、１０，１１……リード端子、
１２……モールド樹脂、１３……発光ダイオード
チツプ、１４……整流ダイオードチツプ、１５…
…ボンデイングワイヤー。
FIG. 1 is a sectional view for explaining a conventional LED lamp, and FIG. 2 is a sectional view for explaining an LED lamp according to this invention. 1... Rectifier diode, 2... Molding resin,
3... Lead terminal, 10, 11... Lead terminal,
12... Mold resin, 13... Light emitting diode chip, 14... Rectifier diode chip, 15...
...bonding wire.
Claims (1)
一方に発光ダイオードチツプを、他方に整流ダイ
オードチツプを取り付け、両者をボンデイングワ
イヤーで接続させたことを特徴とする、ＬＥＤラ
ンプ。 An LED lamp characterized in that a light emitting diode chip is attached to one of lead terminals introduced into a molded resin, a rectifier diode chip is attached to the other, and both are connected with a bonding wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10138788U JPH0224564U (en) | 1988-07-30 | 1988-07-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10138788U JPH0224564U (en) | 1988-07-30 | 1988-07-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0224564U true JPH0224564U (en) | 1990-02-19 |
Family
ID=31330332
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10138788U Pending JPH0224564U (en) | 1988-07-30 | 1988-07-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0224564U (en) |
-
1988
- 1988-07-30 JP JP10138788U patent/JPH0224564U/ja active Pending
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