JPH0242455U - - Google Patents
Info
- Publication number
- JPH0242455U JPH0242455U JP12297688U JP12297688U JPH0242455U JP H0242455 U JPH0242455 U JP H0242455U JP 12297688 U JP12297688 U JP 12297688U JP 12297688 U JP12297688 U JP 12297688U JP H0242455 U JPH0242455 U JP H0242455U
- Authority
- JP
- Japan
- Prior art keywords
- lead terminal
- light emitting
- emitting diode
- chip
- diode chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Description
第１図ａ，ｂは本考案の一実施例の平面図及び
側面図、第２図ａ，ｂは同実施例の工程説明図、
第３図は従来の発光素子の使用回路図である。
１１……発光ダイオードチツプ、１３……第１
のリード端子、１５……第２のリード端子、１６
……チツプ抵抗、１７……第３のリード端子、１
８……成形樹脂。
Figures 1a and b are a plan view and side view of an embodiment of the present invention, Figures 2a and b are process explanatory diagrams of the same embodiment,
FIG. 3 is a circuit diagram of a conventional light emitting device. 11... Light emitting diode chip, 13... First
Lead terminal, 15...Second lead terminal, 16
...Chip resistor, 17...Third lead terminal, 1
8... Molding resin.
Claims (1)
のリード端子と、前記発光ダイオードチツプに対
するワイヤボンド用の第２のリード端子と、該第
２のリード端子とチツプ抵抗によつて接続された
第３のリード端子を有し、且つ前記チツプ抵抗搭
載部の第２，第３のリード端子面が成形樹脂表面
と同一平面上に形成されたことを特徴とする発光
素子。 The first die-bonded light emitting diode chip
a second lead terminal for wire bonding to the light emitting diode chip, and a third lead terminal connected to the second lead terminal by a chip resistor, and the chip resistor is mounted. 1. A light emitting device, wherein second and third lead terminal surfaces of the portion are formed on the same plane as a surface of a molded resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12297688U JPH0242455U (en) | 1988-09-19 | 1988-09-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12297688U JPH0242455U (en) | 1988-09-19 | 1988-09-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0242455U true JPH0242455U (en) | 1990-03-23 |
Family
ID=31371407
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12297688U Pending JPH0242455U (en) | 1988-09-19 | 1988-09-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0242455U (en) |
-
1988
- 1988-09-19 JP JP12297688U patent/JPH0242455U/ja active Pending
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