JPS63108655U - - Google Patents
Info
- Publication number
- JPS63108655U JPS63108655U JP1986200124U JP20012486U JPS63108655U JP S63108655 U JPS63108655 U JP S63108655U JP 1986200124 U JP1986200124 U JP 1986200124U JP 20012486 U JP20012486 U JP 20012486U JP S63108655 U JPS63108655 U JP S63108655U
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- diode lamp
- aging agent
- light
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 230000003712 anti-aging effect Effects 0.000 claims 4
- 239000003795 chemical substances by application Substances 0.000 claims 4
- 239000003963 antioxidant agent Substances 0.000 claims 1
- 230000003078 antioxidant effect Effects 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 2
Description
第１図は本考案のＬＥＤランプの一実施例の正
面図、第２図は本考案のＬＥＤランプを自動車の
ストツプランプに使用する際に用いる基板の一部
省略平面図、第３図は第２図に示した基板をハイ
マウント・ストツプランプに使用すべく基板をハ
イマウント・ストツプランプのケーシングに組み
込んだ時の斜視図、第４図ａ，ｂは通常のＬＥＤ
ランプを示し、ａはその断面図、ｂは正面図であ
る。
１：ＬＥＤチツプ、２，３：リードフレーム、
４：ワイヤ、５：樹脂モールド、１０：基板、１
１：ケーシング、１２：取付部材。
Fig. 1 is a front view of an embodiment of the LED lamp of the present invention, Fig. 2 is a partially omitted plan view of a substrate used when the LED lamp of the present invention is used in an automobile stop lamp, and Fig. A perspective view when the board shown in the figure is assembled into the casing of a high-mount stop lamp for use in a high-mount stop lamp. Figures 4a and b are ordinary LEDs.
The lamp is shown, a is a cross-sectional view thereof, and b is a front view. 1: LED chip, 2, 3: Lead frame,
4: Wire, 5: Resin mold, 10: Substrate, 1
1: Casing, 12: Mounting member.
Claims (1)
老化防止剤を有してなることを特徴とする発光ダ
イオードランプ。 (2) 前記老化防止剤が紫外線吸収剤及び／又は
酸化防止剤であることを特徴とする実用新案登録
請求の範囲第(1)項記載の発光ダイオードランプ
。 (3) 前記老化防止剤は樹脂モールド部の成形時
に樹脂材料に混合してなることを特徴とする実用
新案登録請求の範囲第(1)項記載の発光ダイオー
ドランプ。 (4) 前記老化防止剤は樹脂モールド部の成形後
に該樹脂モールド部の表面に塗布されていること
を特徴とする実用新案登録請求の範囲第(1)項記
載の発光ダイオードランプ。[Claims for Utility Model Registration] (1) A light-emitting diode lamp characterized in that the resin molded portion of the light-emitting diode lamp contains an anti-aging agent. (2) The light emitting diode lamp according to claim 1, wherein the anti-aging agent is an ultraviolet absorber and/or an antioxidant. (3) The light emitting diode lamp according to claim (1), wherein the anti-aging agent is mixed with the resin material during molding of the resin mold part. (4) The light emitting diode lamp according to claim (1), wherein the anti-aging agent is applied to the surface of the resin molded part after the resin molded part is molded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986200124U JPH0445258Y2 (en) | 1986-12-29 | 1986-12-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986200124U JPH0445258Y2 (en) | 1986-12-29 | 1986-12-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63108655U true JPS63108655U (en) | 1988-07-13 |
| JPH0445258Y2 JPH0445258Y2 (en) | 1992-10-23 |
Family
ID=31162345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986200124U Expired JPH0445258Y2 (en) | 1986-12-29 | 1986-12-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0445258Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012111811A (en) * | 2010-11-22 | 2012-06-14 | Agc Coat-Tech Co Ltd | Coating composition for led device, led device and led lamp using the composition |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS572583A (en) * | 1980-06-09 | 1982-01-07 | Sumitomo Bakelite Co Ltd | Sealing method for resin of light emitting diode |
-
1986
- 1986-12-29 JP JP1986200124U patent/JPH0445258Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS572583A (en) * | 1980-06-09 | 1982-01-07 | Sumitomo Bakelite Co Ltd | Sealing method for resin of light emitting diode |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012111811A (en) * | 2010-11-22 | 2012-06-14 | Agc Coat-Tech Co Ltd | Coating composition for led device, led device and led lamp using the composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0445258Y2 (en) | 1992-10-23 |
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