JPH01140563U - - Google Patents
Info
- Publication number
- JPH01140563U JPH01140563U JP3727688U JP3727688U JPH01140563U JP H01140563 U JPH01140563 U JP H01140563U JP 3727688 U JP3727688 U JP 3727688U JP 3727688 U JP3727688 U JP 3727688U JP H01140563 U JPH01140563 U JP H01140563U
- Authority
- JP
- Japan
- Prior art keywords
- led
- light source
- led light
- straight line
- features
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000149 argon plasma sintering Methods 0.000 claims description 2
- 238000005192 partition Methods 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Description
第１図は本考案によるＬＥＤ光源の一実施例を
示す断端面図、第２図は放射特性を示す図、第３
図は本考案の他の実施例で使用するＬＥＤランプ
を示す断面図、第４図は従来のＬＥＤ光源の一例
を示す断端面図、第５図は従来のＬＥＤ光源の他
の例を示す断端面図である。
１１…ＬＥＤチツプ、１２…ＬＥＤランプ、１
３…隔壁、１４…モールド部、１５…粗面、１６
…光乱反射特性を有するテープ。
Figure 1 is a cross-sectional view showing an embodiment of the LED light source according to the present invention, Figure 2 is a diagram showing radiation characteristics, and Figure 3 is a diagram showing radiation characteristics.
The figure is a cross-sectional view showing an LED lamp used in another embodiment of the present invention, FIG. 4 is a cross-sectional view showing an example of a conventional LED light source, and FIG. 5 is a cross-sectional view showing another example of a conventional LED light source. FIG. 11...LED chip, 12...LED lamp, 1
3... Partition wall, 14... Mold part, 15... Rough surface, 16
...A tape with light scattering reflection properties.
Claims (1)
を隔壁で区切つて直線状に配してなるＬＥＤ光源
において、 上記ＬＥＤランプのモールド部の側面に光乱反
射手段を設けたことを特徴とするＬＥＤ光源。[Scope of Claim for Utility Model Registration] In an LED light source consisting of LED lamps formed by molding LED chips separated by partition walls and arranged in a straight line, a light scattering reflection means is provided on the side surface of the molded portion of the LED lamp. Features an LED light source.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3727688U JPH01140563U (en) | 1988-03-22 | 1988-03-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3727688U JPH01140563U (en) | 1988-03-22 | 1988-03-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01140563U true JPH01140563U (en) | 1989-09-26 |
Family
ID=31263857
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3727688U Pending JPH01140563U (en) | 1988-03-22 | 1988-03-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01140563U (en) |
-
1988
- 1988-03-22 JP JP3727688U patent/JPH01140563U/ja active Pending