JPH0381652U - - Google Patents

Info

Publication number
JPH0381652U
JPH0381652U JP1989142390U JP14239089U JPH0381652U JP H0381652 U JPH0381652 U JP H0381652U JP 1989142390 U JP1989142390 U JP 1989142390U JP 14239089 U JP14239089 U JP 14239089U JP H0381652 U JPH0381652 U JP H0381652U
Authority
JP
Japan
Prior art keywords
emitting diode
light emitting
diode chip
lead frame
reflector plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989142390U
Other languages
Japanese (ja)
Other versions
JP2553342Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989142390U priority Critical patent/JP2553342Y2/en
Publication of JPH0381652U publication Critical patent/JPH0381652U/ja
Application granted granted Critical
Publication of JP2553342Y2 publication Critical patent/JP2553342Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案にかかる発光ダイオードランプ
の一例をモールド樹脂を省略して示す斜視図、第
２図はその断面図、第３図はモールド樹脂も含め
た全体構造を示す断面図、第４図は本考案にかか
る発光ダイオードランプの他の例を示す断面図、
第５図は従来の発光ダイオードランプをモールド
樹脂を省略して示す斜視図、第６図はその断面図
、第７図はモールド樹脂も含めた全体構造を示す
断面図である。 １０…発光ダイオードチツプ、２０…反射カツ
プ、３０…リードフレーム、６０…反射板、７０
…モールド樹脂。 FIG. 1 is a perspective view showing an example of the light emitting diode lamp according to the present invention with the mold resin omitted, FIG. 2 is a cross-sectional view thereof, FIG. 3 is a cross-sectional view showing the entire structure including the mold resin, and FIG. The figure is a sectional view showing another example of the light emitting diode lamp according to the present invention.
FIG. 5 is a perspective view of a conventional light emitting diode lamp with the mold resin omitted, FIG. 6 is a sectional view thereof, and FIG. 7 is a sectional view showing the entire structure including the mold resin. DESCRIPTION OF SYMBOLS 10... Light emitting diode chip, 20... Reflection cup, 30... Lead frame, 60... Reflection plate, 70
...Mold resin.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 反射カツプに収容されてリードフレーム上に搭
載された発光ダイオードチツプと、該発光ダイオ
ードチツプを収容する反射カツプの外周側に配設
された環状の反射板と、該反射板を含むリードフ
レーム上の搭載物を包容するモールド樹脂とを具
備することを特徴とする発光ダイオードランプ。 A light emitting diode chip housed in a reflective cup and mounted on a lead frame, an annular reflector plate disposed on the outer circumferential side of the reflective cup housing the light emitting diode chip, and a light emitting diode chip mounted on a lead frame containing the reflector plate. A light-emitting diode lamp, comprising: a molded resin that encloses a loaded object.
JP1989142390U 1989-12-08 1989-12-08 Light emitting diode lamp Expired - Lifetime JP2553342Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989142390U JP2553342Y2 (en) 1989-12-08 1989-12-08 Light emitting diode lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989142390U JP2553342Y2 (en) 1989-12-08 1989-12-08 Light emitting diode lamp

Publications (2)

Publication Number Publication Date
JPH0381652U true JPH0381652U (en) 1991-08-21
JP2553342Y2 JP2553342Y2 (en) 1997-11-05

Family

ID=31689220

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989142390U Expired - Lifetime JP2553342Y2 (en) 1989-12-08 1989-12-08 Light emitting diode lamp

Country Status (1)

Country Link
JP (1) JP2553342Y2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002185046A (en) * 2000-12-19 2002-06-28 Sharp Corp Chip-part type led and its manufacturing method
JP2004363635A (en) * 2004-09-27 2004-12-24 Nichia Chem Ind Ltd Light-emitting diode

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53124654U (en) * 1977-03-14 1978-10-04
JPS53151376U (en) * 1977-05-04 1978-11-29
JPS54159977U (en) * 1978-04-27 1979-11-08
JPS61156779A (en) * 1984-12-28 1986-07-16 Toshiba Corp Manufacture of electrode member for luminescence display device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53124654U (en) * 1977-03-14 1978-10-04
JPS53151376U (en) * 1977-05-04 1978-11-29
JPS54159977U (en) * 1978-04-27 1979-11-08
JPS61156779A (en) * 1984-12-28 1986-07-16 Toshiba Corp Manufacture of electrode member for luminescence display device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002185046A (en) * 2000-12-19 2002-06-28 Sharp Corp Chip-part type led and its manufacturing method
JP2004363635A (en) * 2004-09-27 2004-12-24 Nichia Chem Ind Ltd Light-emitting diode

Also Published As

Publication number Publication date
JP2553342Y2 (en) 1997-11-05

Similar Documents

Publication Publication Date Title
JPH0381652U (en)
JPH0381653U (en)
JPH01160864U (en)
JPH01167065U (en)
JPH0367461U (en)
JPS6395262U (en)
JPH0440554U (en)
JPH0286154U (en)
JPH01130567U (en)
JPH0235458U (en)
JPH022854U (en)
JPS6219769U (en)
JPS6230363U (en)
JPH0181804U (en)
JPH0369803U (en)
JPH0425260U (en)
JPH0163140U (en)
JPS62137491U (en)
JPH0295263U (en)
JPH0459168U (en)
JPH0296753U (en)
JPH0293154U (en)
JPS6242261U (en)
JPH02113356U (en)
JPH0375488U (en)

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term